Monolayer-Protected Gold Nanoparticle Surface-Bound Catalysts: Preparation and Application

Effects of ligands on (de-)enhancement of plasmonic excitations of silver, gold and bimetallic nanoclusters: TD-DFT+TB calculations

Metal nanoclusters can be synthesized in various sizes and shapes and are typically protected with ligands to stabilize them. These ligands can also be used to tune the plasmonic properties of the clusters as the absorption spectrum of a protected cluster can be significantly altered compared to the bare cluster. In this paper, we computationally investigate the influence of thiolate ligands on the plasmonic intensity for silver, gold and alloy clusters. Using time-dependent density functional theory with tight-binding approximations, TD-DFT+TB, we show that this level of theory can reproduce the broad experimental spectra of Au₁₄₄(SR)₆₀ and Ag₅₃Au₉₁(SR)₆₀ (R = CH₃) compounds with satisfactory agreement. As TD-DFT+TB does not depend on atom-type parameters we were able to apply this approach on large ligand-protected clusters with various compositions. With these calculations we predict that the effect of ligands on the absorption can be a quenching as well as an enhancement. We furthermore show that it is possible to unambiguously identify the plasmonic peaks by the scaled Coulomb kernel technique and explain the influence of ligands on the intensity (de-)enhancement by analyzing the plasmonic excitations in terms of the dominant orbital contributions.

High strain sensitivity controlled by the surface density of platinum nanoparticles

We report a controllable strain gauge factor obtained using a two-dimensional nanoparticle layer formed from platinum nanoparticles. A vacuum technique is used for room temperature nanoparticle deposition that allows control of the electrical resistance of the film, exhibiting semiconducting-like behavior when nanoparticle arrays cover the surface below a threshold value while above it a metallic behavior is prevalent. The highest sensitivity is obtained for intermediate density values of the nanoparticle assemblies, which could be explained using a tunneling and hopping current expression. The device, which exhibits more than one order of magnitude higher strain sensitivity than continuous metallic films, is fabricated at room temperature through standard lithographic processing allowing for miniaturization and easy integration in silicon technology or flexible substrates.