Structural Evolution of Macromolecular Chain During Pre-imidization Process and Its Effects on Polyimide Film Properties

Efficient Fabrication of Self-Assembled Polylactic Acid Colloidosomes for Pesticide Encapsulation

Colloidosomes are microcapsules whose shells are composed of cumulated or fused colloidal particles. When colloidosomes are used for in situ encapsulation, it is still a challenge to achieve a high encapsulation efficiency and controllable release by an effective fabrication method. Herein, we present a highly efficient route for the large-scale preparation of colloidosomes. The biodegradable polylactic acid (PLA) nanoparticles (NPs) as shell materials can be synthesized using an antisolvent precipitation method, and the possible formation mechanism was given through the molecular dynamics (MD) simulation. The theoretical values are basically consistent with the experimental results. Through the use of the modified and unmodified PLA NPs, the colloidosomes with controllable shell porosities can be easily constructed using spray drying technology. We also investigate the mechanism of colloidosomes successfully self-assembled by PLA NPs with various factors of inlet temperature, feed rate, and flow rates of compressed air. Furthermore, avermectin (AVM) was used as a model for in situ encapsulation and a controllable release. The spherical modified colloidosomes encapsulating AVM not only achieve a small mean diameter of 1.57 μm but also realize a high encapsulation efficiency of 89.7% and impermeability, which can be further verified by the MD simulation. AVM molecules gather around and clog the shell pores during the evaporation of water molecules. More importantly, the PLA colloidosomes also reveal excellent UV-shielding properties, which can protect AVM from photodegradation.

Alicyclic polyimides with large band gaps exhibit superior high-temperature capacitive energy storage

Flexible polymer dielectrics for capacitive energy storage that can function well at elevated temperatures are increasingly in demand for continuously advancing and miniaturizing electrical devices. However, traditional high-resistance polymer dielectrics composed of aromatic backbones have a compromised band gap (E_g) and hence suffer from low breakdown strength and a huge loss at high temperatures. Here, based on the density functional theory (DFT) calculations, rigid and non-coplanar alicyclic segments are introduced into the polyimide backbone to overcome the incompatibility of a high glass transition temperature (T_g) and large E_g. Thanks to the large optical E_g (∼4.6 eV) and high T_g (∼277 °C), the all-alicyclic polyimide at 200 °C delivers a maximum discharge energy density (U_e) of 5.01 J cm^-3 with a charge-discharge efficiency (η) of 78.1% at 600 MV m^-1, and a record U_e of 2.55 J cm^-3 at η = 90%, which is 10-fold larger than that of the state-of-art commercial polyetherimides (PEIs). In addition, compared with aromatic polyimides, the all-alicyclic polyimide possesses a better self-clearing characteristic due to a smaller ratio of carbon to hydrogen and oxygen, which facilitates its long-term reliability in practical applications.

Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes

High-quality and free-standing polyimide (PI) film with desirable mechanical properties and uniformity is in high demand due to its widespread applications in highly precise flexible and chip-integrated sensors. In this study, a free-standing PI film with high toughness was successfully prepared using a diamine monomer with ether linkages. The prepared PI films exhibited significantly superior mechanical properties compared to PI films of the same molecular structure, which can be attributed to the systematic exploration of the film-forming process. The exploration of the film-forming process includes the curing procedures, film-forming substrates, and annealing treatments. Additionally, the thickness uniformity and surface homogeneity of free-standing films were crucial for toughness. Increasing the crystallinity of the PI films by eliminating residual stress also contributed to their high strength. The results demonstrate that by adjusting the above-mentioned factors, the prepared PI films possess excellent mechanical properties, with tensile strength and elongation at break of 194.71 MPa and 130.13%, respectively.

High-Transparency and Colorless Polyimide Film Prepared by Inhibiting the Formation of Chromophores

Colorless polyimides (CPIs) with outstanding mechanical properties are essential materials in the production of flexible display panels, foldable windows, and even spacecraft cockpits. This paper specifically elaborates that the Morkit unit, and azo and nitro chromophores are important factors contributing to yellow PI, together with the well-known charge transfer complex (CTC) theory. Three diamine monomers, two anhydrides monomers, and three blockers were used to inhibit chromophores formation and, thus, obtain CPI films. The cut-off wavelength was blue-shifts to 334 nm and the transmittance is improved to 98.9% in the UV–vis range. Mechanical and thermal properties of the CPI films are not reduced through coupling effects of the blockers. Therefore, the inhibition method of the Morkit units and chromophore groups is a promising process for preparing CPIs to be used as flexible display materials.

A Universal Study on the Effect Thermal Imidization Has on the Physico-Chemical, Mechanical, Thermal and Electrical Properties of Polyimide for Integrated Electronics Applications

Polyimides (PI) are a class of dielectric polymer used in a wide range of electronics and electrical engineering applications from low-voltage microelectronics to high voltage isolation. They are well appreciated because of their excellent thermal, electrical, and mechanical properties, each of which need to be optimized uniquely depending on the end application. For example, for high-voltage applications, the final polymer breakdown field and dielectric properties must be optimized, both of which are dependent on the curing process and the final physico-chemical properties of PI. The majority of studies to date have focused on a limited set of properties of the polymer and have analyzed the effect of curing from a physicochemical-, mechanical- or electrical-centric viewpoint. This paper seeks to overcome this, unifying all of these characterizations in the same study to accurately describe the universal effect of the cure temperature on the properties of PI and at an industrial processing scale. This paper reports the widest-ranging study of its kind on the effect that cure temperature has on the physico-chemical, mechanical, thermal and electrical properties of polyimide, specifically poly (pyromellitic dianhydride-co-4, 4′-oxydianiline) (PMDA/ODA). The optimization of the cure temperature is accurately studied not only regarding the degree of imidization (DOI), but also considering the entire physical properties. Particularly, the analysis elucidates the key role of the charge–transfer complex (CTC) on these properties. The results show that while the thermal and mechanical properties improve with both DOI and CTC formation, the electrical properties, particularly at high field conditions, show an antagonistic behavior enhancing with increasing DOI while degrading at higher temperatures as the CTC formation increases. The electrical characterization at low field presents an enhancement of the final PI properties likely due to the DOI. On the contrary, at high electric field, the conductivity results show an improvement at an intermediate temperature emphasizing an ideal compromise between a high DOI and PI chain packing when the thermal imidization process is performed over this equilibrium. This balance enables maximum performance to be obtained for the PI film with optimized electrical properties and, overall, optimal thermal and mechanical properties are achieved.

Highly Thermal Conductive Graphite Films Derived from the Graphitization of Chemically Imidized Polyimide Films

With the large-scale application and high-speed operation of electronic equipment, the thermal diffusion problem presents an increasing requirement for effective heat dissipation materials. Herein, high thermal conductive graphite films were fabricated via the graphitization of polyimide (PI) films with different amounts of chemical catalytic reagent. The results showed that chemically imidized PI (CIPI) films exhibit a higher tensile strength, thermal stability, and imidization degree than that of purely thermally imidized PI (TIPI) films. The graphite films derived from CIPI films present a more complete crystal orientation and ordered arrangement. With only 0.72% chemical catalytic reagent, the graphitized CIPI film achieved a high thermal conductivity of 1767 W·m⁻¹·K⁻¹, which is much higher than that of graphited TIPI film (1331 W·m⁻¹·K⁻¹), with an increase of 32.8%. The high thermal conductivity is attributed to the large in-plane crystallite size and high crystal integrity. It is believed that the chemical imidization method prioritizes the preparation of high-quality PI films and helps graphite films achieve an excellent performance.

High-Temperature-Induced Shape Memory Copolyimide

A series of polyimide (PI) films with a high-temperature-induced shape memory effect and tunable properties were prepared via the facile random copolymerization of 4,4'-oxydianiline (ODA) with 4,4'-(hexafluoroisopropyl)diphthalic anhydride (6FDA) and 4,4'-oxydiphthalic anhydride (ODPA). The trigger temperature can be controlled from 294 to 326 °C by adjusting the ratio of monomers. The effects of monomer rigidity on the chain mobility, physical properties, and shape memory performance of as-prepared copolyimide were systematically investigated. The introduction of ODPA could enhance the mobility of PI macromolecular chains, which made chain entanglement more likely to occur and increased the physical crosslinking density, thereby improving the PI's shape recovery up to 97%. Meanwhile, the existence of 6FDA enabled PI films to set quickly at low temperatures with a shape fixation of 98%. The shape memory cycling characteristics of the polyimide films are also studied, and the relationship between the PI chemical structure and the film properties are further discussed.