Hydroxyl Influence on Adsorption and Lubrication of an Ultrathin Aqueous Triblock Copolymer Lubricant

Theoretical Exploration of Peculiar Sandwich-Type Clusters Formed by the Coordination of E92- (E = Si, Ge, Sn) Zintl Clusters: Structural Properties, Active Sites, and Hydrogen Storage

A peculiar heterogeneous metal sandwich fragment {(Ge₉)₂[η⁶-Ge(PdPPh₃)₃]}^4- anion cluster was synthesized for the first time by Xu et al. (Xu, H. L.; Tkachenko, N. V.; Wang, Z. C.; Chen, W. X.; Qiao, L.; Munoz-Castro, A.; Boldyrev, A. I.; Sun, Z. M. Nat. Commun.2020, 11, 5286). In this work, novel analogous sandwich compounds ({(E₉)₂[η⁶-E(PdPH₃)₃]}^4- (E = Si (1), Ge (2), Sn (3)) were studied using quantum chemical calculations and wave function analysis to determine the geometry, bonding nature, aromaticity, active sites, and hydrogen storage. Structural analysis revealed that the clusters were compounds formed by the coordination of two E₉^2- (E = Si, Ge, Sn) Zintl clusters with a central E@Pd₃ (E = Si, Ge, Sn) interlayer. The steric hindrance at both ends is small, facilitating facile attachment to other molecules. The valence states of the central atom E (E = Si, Ge, Sn) are close to zero, indicating that they are stable novel heterometallic sandwich compounds, and the Zintl ligands at both ends are negative, thus they can react with Lewis acids. Bonding analysis showed that the E₉^2- (E = Si, Ge, Sn) cluster has a delocalized framework bonding mode. For aromaticity analysis, we used AdNDP, ELF, LOL, ICSS, and NICS to qualitatively and quantitatively clarify that these clusters possess the characteristics of overall delocalization, σ aromaticity, and remarkable stability. By analyzing the unique structure and predicting the reaction sites, we concluded that the E₉^2- ligand reacts with Lewis acids. Finally, through the adsorption of hydrogen molecules, the average adsorption energies of 1-3 were 0.387, 0.374, and 0.325 eV per H₂ molecule, respectively, meeting the physical adsorption standard, with the adsorption effect of 3 being slightly more superior than that of 1 and 2. Our study represents a substantial step forward in the study of high-density materials for volumetric H₂ storage applications.

Theoretical Study on the Adhesion Interaction between Epoxy Resin Including Curing Agent and Plated Gold Surface

In this study, the adhesive interaction between gold and epoxy resin is theoretically investigated. These materials make up crucial components of a wide range of electronic devices. The objectives of the study are (1) to elucidate the bonding mechanism between epoxy resin and a realistic gold surface, and (2) to obtain a device-design guideline for superior adhesion, thus reducing the bonding breakage that may potentially cause device failure. Die pad surfaces used in chip attachment methods for microelectronics are usually fabricated using an electrolytic plating technique. This technique involves ionic gold solutions like K[Au(CN)₂]. The combined theoretical and experimental studies previously carried out by the authors have revealed that the CN^- counteranion of the gold cation has a high affinity for gold and is likely to remain on the realistic gold surface generated by plating. However, the cyano group content on the surface of the plated gold is still unknown. Therefore, gold surfaces embedded with cyano groups with various coverages are constructed. The effect of the varying coverage of the cyano groups on the adhesion strength is inspected using first-principles density functional theory calculations. As the number of cyano groups on the surface increases, the direct interaction between the gold surface and the epoxy resin is hindered, but the hydroxy and amino groups in the epoxy resin and hardener form more hydrogen bonds with the cyano groups adsorbed on the surface. It is found that the surface with intermediate cyano coverage (about 33%) yields the highest adhesive strength.