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Park TW, Kang YL, Kim YN, Park WI. High-Resolution Nanotransfer Printing of Porous Crossbar Array Using Patterned Metal Molds by Extreme-Pressure Imprint Lithography. NANOMATERIALS (BASEL, SWITZERLAND) 2023; 13:2335. [PMID: 37630919 PMCID: PMC10458917 DOI: 10.3390/nano13162335] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/20/2023] [Revised: 08/10/2023] [Accepted: 08/11/2023] [Indexed: 08/27/2023]
Abstract
High-resolution nanotransfer printing (nTP) technologies have attracted a tremendous amount of attention due to their excellent patternability, high productivity, and cost-effectiveness. However, there is still a need to develop low-cost mold manufacturing methods, because most nTP techniques generally require the use of patterned molds fabricated by high-cost lithography technology. Here, we introduce a novel nTP strategy that uses imprinted metal molds to serve as an alternative to a Si stamp in the transfer printing process. We present a method by which to fabricate rigid surface-patterned metallic molds (Zn, Al, and Ni) based on the process of direct extreme-pressure imprint lithography (EPIL). We also demonstrate the nanoscale pattern formation of functional materials, in this case Au, TiO2, and GST, onto diverse surfaces of SiO2/Si, polished metal, and slippery glass by the versatile nTP method using the imprinted metallic molds with nanopatterns. Furthermore, we show the patterning results of nanoporous crossbar arrays on colorless polyimide (CPI) by a repeated nTP process. We expect that this combined nanopatterning method of EPIL and nTP processes will be extendable to the fabrication of various nanodevices with complex circuits based on micro/nanostructures.
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Affiliation(s)
| | | | | | - Woon Ik Park
- Department of Materials Science and Engineering, Pukyong National University (PKNU), Busan 48513, Republic of Korea; (T.W.P.); (Y.L.K.); (Y.N.K.)
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Park TW, Kang YL, Kang EB, Kim S, Kim YN, Park WI. Formation of Multiscale Pattern Structures by Combined Patterning of Nanotransfer Printing and Laser Micromachining. NANOMATERIALS (BASEL, SWITZERLAND) 2023; 13:2327. [PMID: 37630912 PMCID: PMC10459525 DOI: 10.3390/nano13162327] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/07/2023] [Revised: 08/06/2023] [Accepted: 08/10/2023] [Indexed: 08/27/2023]
Abstract
Various lithography techniques have been widely used for the fabrication of next-generation device applications. Micro/nanoscale pattern structures formed by lithographic methods significantly improve the performance capabilities of the devices. Here, we introduce a novel method that combines the patterning of nanotransfer printing (nTP) and laser micromachining to fabricate multiscale pattern structures on a wide range of scales. Prior to the formation of various nano-in-micro-in-millimeter (NMM) patterns, the nTP process is employed to obtain periodic nanoscale patterns on the target substrates. Then, an optimum laser-based patterning that effectively engraves various nanopatterned surfaces, in this case, spin-cast soft polymer film, rigid polymer film, a stainless still plate, and a Si substrate, is established. We demonstrate the formation of well-defined square and dot-shaped multiscale NMM-patterned structures by the combined patterning method of nTP and laser processes. Furthermore, we present the generation of unusual text-shaped NMM pattern structures on colorless polyimide (CPI) film, showing optically excellent rainbow luminescence based on the configuration of multiscale patterns from nanoscale to milliscale. We expect that this combined patterning strategy will be extendable to other nano-to-micro fabrication processes for application to various nano/microdevices with complex multiscale pattern geometries.
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Affiliation(s)
- Tae Wan Park
- Department of Materials Science and Engineering, Pukyong National University (PKNU), Busan 48513, Republic of Korea; (T.W.P.); (Y.L.K.); (E.B.K.)
- Department of Materials Science and Engineering, Korea University, Seoul 48513, Republic of Korea
| | - Young Lim Kang
- Department of Materials Science and Engineering, Pukyong National University (PKNU), Busan 48513, Republic of Korea; (T.W.P.); (Y.L.K.); (E.B.K.)
| | - Eun Bin Kang
- Department of Materials Science and Engineering, Pukyong National University (PKNU), Busan 48513, Republic of Korea; (T.W.P.); (Y.L.K.); (E.B.K.)
| | - Seungmin Kim
- RanoM R&D Center, RanoM Co., Ltd., Busan 48548, Republic of Korea;
| | - Yu Na Kim
- Department of Materials Science and Engineering, Pukyong National University (PKNU), Busan 48513, Republic of Korea; (T.W.P.); (Y.L.K.); (E.B.K.)
| | - Woon Ik Park
- Department of Materials Science and Engineering, Pukyong National University (PKNU), Busan 48513, Republic of Korea; (T.W.P.); (Y.L.K.); (E.B.K.)
- RanoM R&D Center, RanoM Co., Ltd., Busan 48548, Republic of Korea;
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Abstract
From microcircuits to metamaterials, the micropatterning of surfaces adds valuable functionality. For nonplanar surfaces, incompatibility with conventional microlithography requires the transfer of originally planar micropatterns onto those surfaces; however, existing approaches accommodate only limited curvatures. A microtransfer approach was developed using reflowable materials that transform between solid and liquid on demand, freely stretching to yield transfers that naturally conform down to nanoscale radii of curvature and arbitrarily complex topographies. Such reflow transfer helps generalize microprinting, extending the reach of precision planar microlithography to highly nonplanar substrates and microstructures. With gentle water-based processing, reflow transfer can be applied to a range of materials, with microprinting demonstrated onto metal, plastic, paper, glass, polystyrene, semiconductor, elastomer, hydrogel, and multiple biological surfaces.
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Affiliation(s)
- G Zabow
- Applied Physics Division, National Institute of Standards and Technology; Boulder, CO 80305, USA
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Cheong IT, Morrish W, Sheard W, Yu H, Tavares Luppi B, Milburn L, Meldrum A, Veinot JGC. Silicon Quantum Dot-Polymer Fabry-Pérot Resonators with Narrowed and Tunable Emissions. ACS APPLIED MATERIALS & INTERFACES 2021; 13:27149-27158. [PMID: 33983697 DOI: 10.1021/acsami.1c01825] [Citation(s) in RCA: 5] [Impact Index Per Article: 1.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/12/2023]
Abstract
Luminescent silicon nanoparticles have been widely recognized as an alternative for metal-based quantum dots (QDs) for optoelectronics partly because of the high abundance and biocompatibility of silicon. To date, the broad photoluminescence line width (often >100 nm) of silicon QDs has been a hurdle to achieving competitive spectral purity and incorporating them into light-emitting devices. Herein we report fabrication and testing of straightforward configuration of Fabry-Pérot resonators that incorporates a thin layer of SiQD-polymer hybrid/blend between two reflective silver mirrors; remarkably these devices exhibit up-to-14-fold narrowing of SiQD emission and achieve a spectral bandwidth as narrow as ca. 9 nm. Our polymer-based, SiQD-containing Fabry-Pérot resonators also provide convenient spectral tunability, can be prepared using a variety of polymer hosts and substrates, and enable rigid as well as flexible devices.
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Affiliation(s)
- I Teng Cheong
- Department of Chemistry, University of Alberta, Edmonton, Alberta T6G 2G2, Canada
| | - William Morrish
- Department of Physics, University of Alberta, Edmonton, Alberta T6G 2E1, Canada
| | - William Sheard
- Department of Chemistry, University of Alberta, Edmonton, Alberta T6G 2G2, Canada
| | - Haoyang Yu
- Department of Chemistry, University of Alberta, Edmonton, Alberta T6G 2G2, Canada
| | - Bruno Tavares Luppi
- Department of Chemistry, University of Alberta, Edmonton, Alberta T6G 2G2, Canada
| | - Leanne Milburn
- Department of Chemistry, University of Alberta, Edmonton, Alberta T6G 2G2, Canada
| | - Alkiviathes Meldrum
- Department of Physics, University of Alberta, Edmonton, Alberta T6G 2E1, Canada
| | - Jonathan G C Veinot
- Department of Chemistry, University of Alberta, Edmonton, Alberta T6G 2G2, Canada
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Hou Y, Ren X, Fan J, Wang G, Dai Z, Jin C, Wang W, Zhu Y, Zhang S, Liu L, Zhang Z. Preparation of Twisted Bilayer Graphene via the Wetting Transfer Method. ACS APPLIED MATERIALS & INTERFACES 2020; 12:40958-40967. [PMID: 32805838 DOI: 10.1021/acsami.0c12000] [Citation(s) in RCA: 22] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/11/2023]
Abstract
Assembling monolayers into a bilayer system unlocks the rotational free degree of van der Waals (vdW) homo/heterostructure, enabling the building of twisted bilayer graphene (tBLG) which possesses novel electronic, optical, and mechanical properties. Previous methods for preparation of homo/heterstructures inevitably leave the polymer residue or hexagonal boron nitride (h-BN) mask, which usually obstructs the measurement of intrinsic mechanical and surface properties of tBLG. Undoubtedly, to fabricate the designable tBLG with clean interface and surface is necessary but challenging. Here, we propose a simple and handy method to prepare atomically clean twisted bilayer graphene with controllable twist angles based on wetting-induced delamination. This method can transfer tBLG onto a patterned substrate, which offers an excellent platform for the observation of physical phenomena such as relaxation of moiré pattern in marginally tBLG. These findings and insight should ultimately guide the designable packaging and atomic characterization of the two-dimensional (2D) materials.
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Affiliation(s)
- Yuan Hou
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei 230027, P. R. China
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication and CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, P. R. China
| | - Xibiao Ren
- State Key Laboratory of Silicon Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou, Zhejiang 310027, P. R. China
| | - Jingcun Fan
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei 230027, P. R. China
| | - Guorui Wang
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication and CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, P. R. China
| | - Zhaohe Dai
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Chuanhong Jin
- State Key Laboratory of Silicon Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou, Zhejiang 310027, P. R. China
| | - Wenxiang Wang
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication and CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, P. R. China
| | - Yinbo Zhu
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei 230027, P. R. China
| | - Shuai Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics and Center for Nano and Micro Mechanics, Tsinghua University, Beijing 100084, P. R. China
| | - Luqi Liu
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication and CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, P. R. China
| | - Zhong Zhang
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei 230027, P. R. China
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication and CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, P. R. China
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