Molecular Dynamics Test of the Stress-Thermal Rule in Polyethylene and Polystyrene Entangled Melts

Effect of shear flow on the transverse thermal conductivity of polymer melts

The effect of shear flows on the thermal conductivity of polymer melts is investigated using a reversed nonequilibrium molecular-dynamics (RNEMD) method. We extended the original RNEMD method to simultaneously produce spatial gradients of temperature and flow velocity in a single direction. This method enables accurate measurement of the thermal conductivity in the direction transverse to shear flow. The Weissenberg number defined with the shear rate and the relaxation time of the polymer conformation can uniformly differentiate the occurrence of shear rate dependence of the thermal conductivity across different chain lengths. The stress-thermal rule (STR) (i.e., the linear relationship between anisotropic parts of the stress tensor and the thermal conductivity tensor) holds for entangled polymer melts even under shear flows but not for unentangled polymer melts. Furthermore, once entanglements form in polymer chains, the stress-thermal coefficient in the STR remains independent of the polymer chain length. These observations align with the theoretical foundation of the STR, which focuses on energy transmission along the network structure of entangled polymer chains [B. van den Brule, Rheol. Acta 28, 257 (1989)0035-451110.1007/BF01329335]. However, under driven shear flows, the stress-thermal coefficient is notably smaller than that measured in the literature for a quasiquiescent state without external forces. Although the mechanism of the STR in shear flows has yet to be fully elucidated, our study confirmed the validity of the STR in shear flows. This allows us to use the STR as a constitutive equation for computational thermofluid dynamics of polymer melts, thus having broad engineering applications.

Smart Polymers for Soft Materials: From Solution Processing to Organic Solids

Polymeric materials are ubiquitous in our everyday life, where they find a broad range of uses-spanning across common household items to advanced materials for modern technologies. In the context of the latter, so called "smart polymers" have received a lot of attention. These systems are soluble in water below their lower critical solution temperature Tℓ and often exhibit counterintuitive solvation behavior in mixed solvents. A polymer is known as smart-responsive when a slight change in external stimuli can significantly change its structure, functionm and stability. The interplay of different interactions, especially hydrogen bonds, can also be used for the design of lightweight high-performance organic solids with tunable properties. Here, a general scheme for establishing a structure-property relationship is a challenge using the conventional simulation techniques and also in standard experiments. From the theoretical side, a broad range of all-atom, multiscale, generic, and analytical techniques have been developed linking monomer level interaction details with macroscopic material properties. In this review, we briefly summarize the recent developments in the field of smart polymers, together with complementary experiments. For this purpose, we will specifically discuss the following: (1) the solution processing of responsive polymers and (2) their use in organic solids, with a goal to provide a microscopic understanding that may be used as a guiding tool for future experiments and/or simulations regarding designing advanced functional materials.

The Effect of Mechanical Elongation on the Thermal Conductivity of Amorphous and Semicrystalline Thermoplastic Polyimides: Atomistic Simulations

Over the past few decades, the enhancement of polymer thermal conductivity has attracted considerable attention in the scientific community due to its potential for the development of new thermal interface materials (TIM) for both electronic and electrical devices. The mechanical elongation of polymers may be considered as an appropriate tool for the improvement of heat transport through polymers without the necessary addition of nanofillers. Polyimides (PIs) in particular have some of the best thermal, dielectric, and mechanical properties, as well as radiation and chemical resistance. They can therefore be used as polymer binders in TIM without compromising their dielectric properties. In the present study, the effects of uniaxial deformation on the thermal conductivity of thermoplastic PIs were examined for the first time using atomistic computer simulations. We believe that this approach will be important for the development of thermal interface materials based on thermoplastic PIs with improved thermal conductivity properties. Current research has focused on the analysis of three thermoplastic PIs: two semicrystalline, namely BPDA-P3 and R-BAPB; and one amorphous, ULTEM^TM. To evaluate the impact of uniaxial deformation on the thermal conductivity, samples of these PIs were deformed up to 200% at a temperature of 600 K, slightly above the melting temperatures of BPDA-P3 and R-BAPB. The thermal conductivity coefficients of these PIs increased in the glassy state and above the glass transition point. Notably, some improvement in the thermal conductivity of the amorphous polyimide ULTEM^TM was achieved. Our study demonstrates that the thermal conductivity coefficient is anisotropic in different directions with respect to the deformation axis and shows a significant increase in both semicrystalline and amorphous PIs in the direction parallel to the deformation. Both types of structural ordering (self-ordering of semicrystalline PI and mechanical elongation) led to the same significant increase in thermal conductivity coefficient.