Organic Ice Resists

Electron beam lithography on nonplanar and irregular surfaces

E-beam lithography is a powerful tool for generating nanostructures and fabricating nanodevices with fine features approaching a few nanometers in size. However, alternative approaches to conventional spin coating and development processes are required to optimize the lithography procedure on irregular surfaces. In this review, we summarize the state of the art in nanofabrication on irregular substrates using e-beam lithography. To overcome these challenges, unconventional methods have been developed. For instance, polymeric and nonpolymeric materials can be sprayed or evaporated to form uniform layers of electron-sensitive materials on irregular substrates. Moreover, chemical bonds can be applied to help form polymer brushes or self-assembled monolayers on these surfaces. In addition, thermal oxides can serve as resists, as the etching rate in solution changes after e-beam exposure. Furthermore, e-beam lithography tools can be combined with cryostages, evaporation systems, and metal deposition chambers for sample development and lift-off while maintaining low temperatures. Metallic nanopyramids can be fabricated on an AFM tip by utilizing ice as a positive resistor. Additionally, Ti/Au caps can be patterned around a carbon nanotube. Moreover, 3D nanostructures can be formed on irregular surfaces by exposing layers of anisole on organic ice surfaces with a focused e-beam. These advances in e-beam lithography on irregular substrates, including uniform film coating, instrumentation improvement, and new pattern transferring method development, substantially extend its capabilities in the fabrication and application of nanoscale structures.

All-Water Etching-Free Electron Beam Lithography for On-Chip Nanomaterials

Electron beam lithography uses an accelerated electron beam to fabricate patterning on an electron-beam-sensitive resist but requires complex dry etching or lift-off processes to transfer the pattern to the substrate or film on the substrate. In this study, etching-free electron beam lithography is developed to directly write a pattern of various materials in all-water processes, achieving the desired semiconductor nanopatterns on a silicon wafer. Introduced sugars are copolymerized with metal ions-coordinated polyethylenimine under the action of electron beams. The all-water process and thermal treatment result in nanomaterials with satisfactory electronic properties, indicating that diverse on-chip semiconductors (e.g., metal oxides, sulfides, and nitrides) can be directly printed on-chip by an aqueous solution system. As a demonstration, zinc oxide patterns can be achieved with a line width of 18 nm and a mobility of 3.94 cm² V^-1 s^-1. This etching-free electron beam lithography strategy provides an efficient alternative for micro/nanofabrication and chip manufacturing.

Production and Patterning of Fluorescent Quantum Dots by Cryogenic Electron-Beam Writing

Graphene quantum dots (GQDs) have emerged as a promising type of functional material with distinguished properties. Although tremendous effort was devoted to the preparation of GQDs, their applications are still limited due to a lack of methods for processing GQDs from synthesis to patterning smoothly. Here, we demonstrate that aromatic molecules, e.g., anisole, can be directly converted into GQD-containing nanostructures by cryogenic electron-beam writing. Such an electron-beam irradiation product exhibits evenly red fluorescence emission under laser excitation at 473 nm, and its photoluminescence intensity can be easily tuned with the electron-beam exposure dose. Experimental characterizations on the chemical composition of the product reveal that anisole undergoes a carbonization and further graphitization process during e-beam irradiation. With conformal coating of anisole, our approach can create arbitrary fluorescent patterns on both planar and curved surfaces for concealing information or anticounterfeiting applications. This study provides a one-step method for production and patterning of GQDs, facilitating their applications in highly integrated and compact optoelectronic devices.

Patterning submicron photomechanical features into single diarylethene crystals using electron beam lithography

Lithography methods are commonly used to create structures in inorganic semiconductors like silicon but have not been widely applied to organic crystals. In this work, electron beam lithography (EBL) is used to pattern structures into single organic photomechanical crystals composed of 1,2-bis(2-methyl-5-phenyl-3-thienyl)perfluorocyclopentene. The electron beam creates amorphous regions of decomposed molecules, while the reactivity of the unexposed crystal regions is preserved under a removable Au coating. Exposure of the patterned crystal to 365 nm light causes ridges of amorphous material to increase in height by 30-70%. This height increase can be reversed by visible light exposure and undergo multiple cycles. The reversible surface morphology changes are strong enough to rupture a sheet of graphene placed on top of the patterned crystal. Surprisingly, the change in dimensions of the EBL features is an order of magnitude larger than the changes in overall crystal dimensions as deduced from X-ray diffraction experiments and microscopy observations. A dynamic extrusion model is presented to explain how nanoscale features imprinted into single crystals can amplify molecular-level photomechanical changes. This work demonstrates the capability of EBL methods to produce sub-micron structural features on single photomechanical crystals, providing a new route to monolithic light-powered actuator devices.

Theoretical modeling of ice lithography on amorphous solid water

Due to the perfection of the nanofabrication in nanotechnology and nanoscience, ice lithography (IL) by patterning ice thin-films with a focused electron beam, as a significant derivative technology of electron beam lithography (EBL), is attracting growing attention, evoked by its advantages over traditional EBL with respects of in situ-fabrication, high efficiency, high accuracy, limited proximity effect, three-dimensional (3D) profiling capability, etc. However, theoretical modeling of ice lithography for replicated profiles on the ice resist (amorphous solid water, ASW) has rarely been reported so far. As the result, the development of ice lithography still stays at the experimental stage. The shortage of modeling methods limits our insight into the ice lithography capability, as well as theoretical anticipations for future developments of this emerging technique. In this work, an e-beam induced etching ice model based on the Monte Carlo algorithm for point/line spread functions is established to calculate the replicated profiles of the resist by ice lithography. To testify the fidelity of the modeling method, systematic simulations of the ice lithography property under the processing parameters of the resist thickness, electron accelerating voltage and actual patterns are performed. Theoretical comparisons between the IL on ASW and the conventional EBL on polymethyl methacrylate (PMMA) show superior properties of IL over EBL in terms of the minimum feature size, the highest aspect ratio, 3D nanostructure/devices, etc. The success in developing a modeling method for ice lithography, as reported in this paper, offers a powerful tool in characterizing ice lithography up to the theoretical level and down to molecular scales.

Gentle Patterning Approaches toward Compatibility with Bio-Organic Materials and Their Environmental Aspects

Advances in material science, bioelectronic, and implantable medicine combined with recent requests for eco-friendly materials and technologies inevitably formulate new challenges for nano- and micropatterning techniques. Overall, the importance of creating micro- and nanostructures is motivated by a large manifold of fundamental and applied properties accessible only at the nanoscale. Lithography is a crucial family of fabrication methods to create prototypes and produce devices on an industrial scale. The pure trend in the miniaturization of critical electronic semiconducting components has been recently enhanced by implementing bio-organic systems in electronics. So far, significant efforts have been made to find novel lithographic approaches and develop old ones to reach compatibility with delicate bio-organic systems and minimize the impact on the environment. Herein, such delicate materials and sophisticated patterning techniques are briefly reviewed.

3D Nanoprinting by Electron-Beam with an Ice Resist

Following the general trend in the miniaturization of electronic devices, techniques that enable 3D printing at the nanometer scale are gaining momentum. As a widely used planar processing method, electron-beam lithography (EBL) can be employed to create 3D nanostructures in a layer-by-layer fashion. However, compared with other 3D printing techniques, EBL is limited by the stringent requirement of a range of fabrication equipment and complex fabrication processes. Here, we have demonstrated that EBL can be developed to a controllable 3D nanoprinting technology with the aid of ice resists. With carefully selected accelerating voltage, electron dose, and ice thickness, 3D objects can be efficiently printed in a single vacuum system through an iterative process of ice deposition and e-beam exposure. Mixed ice resists containing solid anisole and water are also introduced into the printing process, which offer a flexible control of the thickness of printed layers. Apart from carbonaceous objects obtained with our method, 3D printing of metals is also promising by employing organometallic compounds as ice resists. This study provides a fresh perspective in EBL-based nanofabrication and expands the spectrum of modern additive manufacturing.

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

MEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

Room Temperature Direct Electron Beam Lithography in a Condensed Copper Carboxylate

High-resolution metallic nanostructures can be fabricated with multistep processes, such as electron beam lithography or ice lithography. The gas-assisted direct-write technique known as focused electron beam induced deposition (FEBID) is more versatile than the other candidates. However, it suffers from low throughput. This work presents the combined approach of FEBID and the above-mentioned lithography techniques: direct electron beam lithography (D-EBL). A low-volatility copper precursor is locally condensed onto a room temperature substrate and acts as a positive tone resist. A focused electron beam then directly irradiates the desired patterns, leading to local molecule dissociation. By rinsing or sublimation, the non-irradiated precursor is removed, leaving copper-containing structures. Deposits were formed with drastically enhanced growth rates than FEBID, and their composition was found to be comparable to gas-assisted FEBID structures. The influence of electron scattering within the substrate as well as implementing a post-purification protocol were studied. The latter led to the agglomeration of high-purity copper crystals. We present this as a new approach to electron beam-induced fabrication of metallic nanostructures without the need for cryogenic or hot substrates. D-EBL promises fast and easy fabrication results.

Solvent-Free Nanofabrication Based on Ice-Assisted Electron-Beam Lithography

Advances in electron-beam lithography (EBL) have fostered the prominent development of functional micro/nanodevices. Nonetheless, traditional EBL is predominantly applicable to large-area planar substrates and often suffers from chemical contamination and complex processes for handling resists. This paper reports a streamlined and ecofriendly approach to implement e-beam patterning on arbitrary shaped substrates, exemplified by solvent-free nanofabrication on optical fibers. The procedure starts with the vapor deposition of water ice as an electron resist and ends in the sublimation of the ice followed by a "blow-off" process. Without damage and contamination from chemical solvents, delicate nanostructures and quasi-3D structures are easily created. A refractive index sensor is further demonstrated by decorating plasmonic nanodisk arrays on the end face of a single-mode fiber. Our study provides a fresh perspective in EBL-based processing, and more exciting research exceeding the limits of traditional approaches is expected.

Electron-Beam Patterning of Vapor-Deposited Solid Anisole

The emerging ice lithography (IL) nanofabrication technology differs from conventional electron-beam lithography by working at cryogenic temperatures and using vapor-deposited organic molecules, such as solid water and alkanes, as e-beam resists. In this paper, we systematically investigate e-beam patterning of frozen anisole and assess its performance as an e-beam resist in IL. Dose curves reveal that anisole has a very low contrast of ∼1, with a very weak dependence on primary beam energy in the investigated range of 5-20 keV. The minimum line width of 60 nm is attainable at 20 keV, limited by stage vibration in our apparatus. Notably, various solid states of anisole have been observed and we can control the deposited anisole from crystalline to amorphous state by decreasing the deposition temperature. The critical temperature for forming an amorphous film is 130 K in the vacuum of a microscope chamber. Smooth patterns with a surface roughness of ∼0.7 nm are achieved in the as-deposited amorphous solid anisole. As a proof of principle of 3D fabrication, we finally fabricate nanoscale patterns on exotic silicon micropillars with a high aspect ratio using this resist.

Comparison between Focused Electron/Ion Beam-Induced Deposition at Room Temperature and under Cryogenic Conditions

In this contribution, we compare the performance of Focused Electron Beam-induced Deposition (FEBID) and Focused Ion Beam-induced Deposition (FIBID) at room temperature and under cryogenic conditions (the prefix “Cryo” is used here for cryogenic). Under cryogenic conditions, the precursor material condensates on the substrate, forming a layer that is several nm thick. Its subsequent exposure to a focused electron or ion beam and posterior heating to 50 °C reveals the deposit. Due to the extremely low charge dose required, Cryo-FEBID and Cryo-FIBID are found to excel in terms of growth rate, which is typically a few hundred/thousand times higher than room-temperature deposition. Cryo-FIBID using the W(CO)₆ precursor has demonstrated the growth of metallic deposits, with resistivity not far from the corresponding deposits grown at room temperature. This paves the way for its application in circuit edit and the fast and direct growth of micro/nano-electrical contacts with decreased ion damage. The last part of the contribution is dedicated to the comparison of these techniques with other charge-based lithography techniques in terms of the charge dose required and process complexity. The comparison indicates that Cryo-FIBID is very competitive and shows great potential for future lithography developments.

Ultra-fast direct growth of metallic micro- and nano-structures by focused ion beam irradiation

An ultra-fast method to directly grow metallic micro- and nano-structures is introduced. It relies on a Focused Ion Beam (FIB) and a condensed layer of suitable precursor material formed on the substrate under cryogenic conditions. The technique implies cooling the substrate below the condensation temperature of the gaseous precursor material, subsequently irradiating with ions according to the wanted pattern, and posteriorly heating the substrate above the condensation temperature. Here, using W(CO)₆ as the precursor material, a Ga⁺ FIB, and a substrate temperature of −100 °C, W-C metallic layers and nanowires with resolution down to 38 nm have been grown by Cryogenic Focused Ion Beam Induced Deposition (Cryo-FIBID). The most important advantages of Cryo-FIBID are the fast growth rate (about 600 times higher than conventional FIBID with the precursor material in gas phase) and the low ion irradiation dose required (∼50 μC/cm²), which gives rise to very low Ga concentrations in the grown material and in the substrate (≤0.2%). Electrical measurements indicate that W-C layers and nanowires grown by Cryo-FIBID exhibit metallic resistivity. These features pave the way for the use of Cryo-FIBID in various applications in micro- and nano-lithography such as circuit editing, photomask repair, hard masks, and the growth of nanowires and contacts. As a proof of concept, we show the use of Cryo-FIBID to grow metallic contacts on a Pt-C nanowire and investigate its transport properties. The contacts have been grown in less than one minute, which is considerably faster than the time needed to grow the same contacts with conventional FIBID, around 10 hours.

Ice lithography for 3D nanofabrication

Nanotechnology and nanoscience are enabled by nanofabrication. Electron-beam lithography, which makes 2D patterns down to a few nanometers, is one of the fundamental pillars of nanofabrication. Recently, significant progress in 3D electron-beam-based nanofabrication has been made, such as the emerging ice lithography technology, in which ice thin-films are patterned by a focused electron-beam. Here, we review the history and progress of ice lithography, and focus on its applications in efficient 3D nanofabrication and additive manufacturing or nanoscale 3D printing. The finest linewidth made using frozen octane is below 5 nm, and nanostructures can be fabricated in selected areas on non-planar surfaces such as freely suspended nanotubes or nanowires. As developing custom instruments is required to advance this emerging technology, we discuss the evolution of ice lithography instruments and highlight major instrumentation advances. Finally, we present the perspectives of 3D printing of functional materials using organic ices. We believe that we barely scratched the surface of this new and exciting research area, and we hope that this review will stimulate cutting-edge and interdisciplinary research that exploits the undiscovered potentials of ice lithography for 3D photonics, electronics and 3D nanodevices for biology and medicine.

Effect of Molecular Weight on the Feature Size in Organic Ice Resists

The feature size of patterns obtained by electron-beam lithography (EBL) depends critically on resist properties, beam parameters, development process, and instrument limitations. Frozen layers of simple organic molecules such as n-alkanes behave as negative-tone resists for EBL. With the unique advantage of an in situ thermal treatment replacing chemical development, the entire lithographic process can be performed within a single instrument, thus removing the influence of chemical developers on the feature size. By using an environmental transmission electron microscope, we can also minimize the influence of instrumental limitations and explore the fundamental link between resist characteristics and feature size. Our results reveal that the onset dose of organic ice resists correlates with the inverse molecular weight and that in the thermal development the role of change in solubility of polymers is mirrored in a shift in the solid/vapor critical temperature of organic ices. With a 0.4 pA beam current, we obtained 4.5, 5.5, and 8.5 nm lines with frozen octane, undecane, and tetradecane, respectively, consistent with the predictions of a model we developed that links beam profile and feature size. The knowledge acquired on the response of small organic molecules to electron irradiation, combined with the flexibility and operational advantages of using them as qualified EBL resists, provides us with new opportunities for the design and production of nanodevices and broadens the reach of EBL especially toward biological applications.

Three-Dimensional in Situ Electron-Beam Lithography Using Water Ice

Three-dimensional (3D) nanofabrication techniques are of paramount importance in nanoscience and nanotechnology because they are prerequisites to realizing complex, compact, and functional 3D nanodevices. Although several 3D nanofabrication methods have been proposed and developed in recent years, it is still a formidable challenge to achieve a balance among resolution, accuracy, simplicity, and adaptability. Here, we propose a 3D nanofabrication method based on electron-beam lithography using ice resists (iEBL) and fabricate 3D nanostructures by stacking layered structures and those with dose-modulated exposure, respectively. The entire process of 3D nanofabrication is realized in one vacuum system by skipping the spin-coating and developing steps required for commonly used resists. This needs far fewer processing steps and is contamination-free compared with conventional methods. With in situ alignment and correction in the iEBL process, a pattern resolution of 20 nm and an alignment error below 100 nm can be steadily achieved. This 3D nanofabrication technique using ice thus shows great potential in the fabrication of complicated 3D nanodevices.