Highly Flexible Graphene Derivative Hybrid Film: An Outstanding Nonflammable Thermally Conductive yet Electrically Insulating Material for Efficient Thermal Management

Flexible Fluorinated Graphene/Poly(vinyl Alcohol) Films toward High Thermal Management Capability

Graphene is widely used in heat dissipation, owing to its inherently high in-plane thermal conductivity and excellent mechanical properties. However, its poor cross-plane thermal conductivity limits its use in some electronic applications. The electron distribution of graphene and the interaction with the base material can be greatly altered by introducing F, the most electronegative element, giving fluorinated graphene oxide (FG) with a high thermal conductivity. Herein, FG is prepared by grafting F atoms onto the surface of graphene oxide in a low-temperature solid-phase reaction with poly(vinylidene fluoride) as a fluorine source. This method can effectively avoid the use of dangerous substances such as HF and F2. The FG dispersion and aqueous poly(vinyl alcohol) (PVA) solution are sequentially vacuum-filtered to obtain the FG/PVA composite film. After natural drying and hot-pressing, the thermal conductivity of the N-FG/PVA film is enhanced by the hydrogen bond between F of FG and the hydroxyl group of PVA. The in-plane and cross-plane thermal conductivity of an N-FG/PVA film containing 10.4 wt % FG are 7.13 and 1.42 W m-1 k-1, respectively. The film has a tensile strength of 60 MPa and an elongation at a break of 28%, which is promising for the thermal management of flexible electronic devices.

Finite Element Analysis Model of Electronic Skin Based on Surface Acoustic Wave Sensor

In recent years, with the rapid development of flexible electronic devices, researchers have a great interest in the research of electronic skin (e-skin). Traditional e-skin, which is made of rigid integrated circuit chips, not only limits the overall flexibility, but also consumes a lot of power and poses certain security risks to the human body. In this paper, a wireless passive e-skin is designed based on the surface acoustic wave sensor (SAWS) of lithium niobate piezoelectric film. The e-skin has the advantages of small size, high precision, low power consumption, and good flexibility. With the multi-sensing function of stress, temperature, and sweat ion concentration, etc., the newly designed e-skin is a sensor platform for a wide range of external stimuli, and the measurement results can be directly presented in frequency. In order to explore the characteristic parameters and various application scenarios of the SAWS, finite element analysis is carried out using the simulation software; the relationship between the SAWS and various influencing factors is explored, and the related performance curve is obtained. These simulation results provide important reference and experimental guidance for the design and preparation of SAW e-skin.

Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors

Recent advances in flexible and stretchable electronics have led to a surge of electronic skin (e-skin)-based health monitoring platforms. Conventional wireless e-skins rely on rigid integrated circuit chips that compromise the overall flexibility and consume considerable power. Chip-less wireless e-skins based on inductor-capacitor resonators are limited to mechanical sensors with low sensitivities. We report a chip-less wireless e-skin based on surface acoustic wave sensors made of freestanding ultrathin single-crystalline piezoelectric gallium nitride membranes. Surface acoustic wave-based e-skin offers highly sensitive, low-power, and long-term sensing of strain, ultraviolet light, and ion concentrations in sweat. We demonstrate weeklong monitoring of pulse. These results present routes to inexpensive and versatile low-power, high-sensitivity platforms for wireless health monitoring devices.

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

Recent Advances in Fluorinated Graphene from Synthesis to Applications: Critical Review on Functional Chemistry and Structure Engineering

Fluorinated graphene (FG), as an emerging member of the graphene derivatives family, has attracted wide attention on account of its excellent performances and underlying applications. The introduction of a fluorine atom, with the strongest electronegativity (3.98), greatly changes the electron distribution of graphene, resulting in a series of unique variations in optical, electronic, magnetic, interfacial properties and so on. Herein, recent advances in the study of FG from synthesis to applications are introduced, and the relationship between its structure and properties is summarized in detail. Especially, the functional chemistry of FG has been thoroughly analyzed in recent years, which has opened a universal route for the functionalization and even multifunctionalization of FG toward various graphene derivatives, which further broadens its applications. Moreover, from a particular angle, the structure engineering of FG such as the distribution pattern of fluorine atoms and the regulation of interlayer structure when advanced nanotechnology gets involved is summarized. Notably, the elaborated structure engineering of FG is the key factor to optimize the corresponding properties for potential applications, and is also an up-to-date research hotspot and future development direction. Finally, perspectives and prospects for the problems and challenges in the study of FG are put forward.

Stitching Graphene Sheets with Graphitic Carbon Nitride: Constructing a Highly Thermally Conductive rGO/g-C3N4 Film with Excellent Heating Capability

Driven by the evolution of electronic packaging technology for high-dense integration of high-power, high-frequency, and multi-function devices in modern electronics, thermal management materials have become a crucial component for guaranteeing the stable and reliable operation of devices. Because of its admirable in-plane thermal conductivity, graphene is considered as a desired thermal conductor. However, the promise of graphene films has been greatly weakened as the existence of grain boundaries lead to a high extent of phonon scattering. Here, a stitching strategy is adopted to fabricate an rGO/g-C₃N₄ film, where 2D g-C₃N₄ works as a linker to covalently connect adjacent rGO sheets for expanding the size of graphene and forming an in-plane rGO/g-C₃N₄ heterostructure. The in-plane thermal conductivity of the rGO/g-C₃N₄ film reaches 41.2 W m^-1 K^-1 at a g-C₃N₄ content of only 1 wt %, which increased by 17.3% compared to pristine rGO. The interfaced thermal resistance between rGO and g-C₃N₄ is further examined by non-equilibrium molecular dynamics simulations. Furthermore, owing to the unique light absorption and welding ability of g-C₃N₄, the rGO/g-C₃N₄ film presents superior solar-thermal and electric-thermal responses to controllably regulate the chip temperature against overcooling. This work provides a facile approach to construct a large-sized rGO sheet and combines heat dissipation and heating capability in the same thermal management material for future electronics.