Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns

Nanoparticle Assembly: From Self-Organization to Controlled Micropatterning for Enhanced Functionalities

Nanoparticles form long-range micropatterns via self-assembly or directed self-assembly with superior mechanical, electrical, optical, magnetic, chemical, and other functional properties for broad applications, such as structural supports, thermal exchangers, optoelectronics, microelectronics, and robotics. The precisely defined particle assembly at the nanoscale with simultaneously scalable patterning at the microscale is indispensable for enabling functionality and improving the performance of devices. This article provides a comprehensive review of nanoparticle assembly formed primarily via the balance of forces at the nanoscale (e.g., van der Waals, colloidal, capillary, convection, and chemical forces) and nanoparticle-template interactions (e.g., physical confinement, chemical functionalization, additive layer-upon-layer). The review commences with a general overview of nanoparticle self-assembly, with the state-of-the-art literature review and motivation. It subsequently reviews the recent progress in nanoparticle assembly without the presence of surface templates. Manufacturing techniques for surface template fabrication and their influence on nanoparticle assembly efficiency and effectiveness are then explored. The primary focus is the spatial organization and orientational preference of nanoparticles on non-templated and pre-templated surfaces in a controlled manner. Moreover, the article discusses broad applications of micropatterned surfaces, encompassing various fields. Finally, the review concludes with a summary of manufacturing methods, their limitations, and future trends in nanoparticle assembly.

Effects of temperature on microstructures of MSA-type electroplating solution: a coarse-grained molecular dynamics simulation

In this study, we employ coarse-grained molecular dynamics simulations to explore the microstructure of MSA (methanesulfonic acid)-type electroplating solution, containing Sn(MSA)2 as the primary salt, MSA as the stabilizer, amphiphilic alkylphenol ethoxylate (APEO) as surfactants and cinnamaldehyde (CA) as the brightener agents, as well as water as the solvent. Our simulation indicates that temperature variations can significantly affect the structural properties of the electroplating solution and the adsorption behavior of its key components onto the substrate. Specifically, at low temperatures, the primary salt ions aggregate into ionic clusters, and the amphiphilic APEO surfactants and CA molecules form micelles composed of hydrophobic cores and hydrophilic shells, which reduces the uniformity of the solution and hinders the adsorption of ions, CA and surfactants onto the substrate. Appropriately increasing the temperature can weaken the aggregation of these components in bulk solution due to the accelerated molecular movements and arouse their adsorption. However, on further increasing the temperature, the elevated kinetic energy of the components thoroughly overwhelms the adsorption interactions, and therefore, the ions, surfactants, and CA desorb from the substrate and redissolve into the solution. We systematically analyze the complex interactions between these components at different temperatures and clarify the mechanism of the non-monotonic dependence of adsorption strength on the temperature at the molecular level. Our simulations demonstrate that there is low-temperature scope for reprocessing/recycling and intermediate-temperature scope for substrate-adsorptions of the key components. This study confers insights into a fundamental understanding of the microscopic mechanism for electroplating and can provide guidance for the development of precise electroplatings.

Concurrently Fabricating Precision Meso- and Microscale Cross-Scale Arrayed Metal Features and Components by Using Wire-Anode Scanning Electroforming Technique

In order to improve the thickness uniformity of the electroformed metal layer and components, a new electroforming technique is proposed-wire-anode scanning electroforming (WAS-EF). WAS-EF uses an ultrafine inert anode so that the interelectrode voltage/current is superimposed upon a very narrow ribbon-shaped area at the cathode, thus ensuring better localization of the electric field. The anode of WAS-EF is in constant motion, which reduces the effect of the current edge effect. The stirring paddle of WAS-EF can affect the fluid flow in the microstructure, and improve the mass transfer effect inside the structure. The simulation results show that, when the depth-to-width ratio decreases from 1 to 0.23, the depth of fluid flow in the microstructure can increase from 30% to 100%. Experimental results show that. Compared with the traditional electroforming method, the single metal feature and arrayed metal components prepared by WAS-EF are respectively improved by 15.5% and 11.4%.

Computational analysis of copper electrodeposition into a porous preform

Electroplating of metals into a porous preform with conductive walls is relevant in the fabrication of structural composites, fuel cells and batteries, and microelectronics. Electrodeposition process parameters, such as direct current or pulsed current, electric potential, and electrolyte concentration, as well as preform geometry, have important implications in the process outcomes including the filling process and the percentage of the infiltrated volume. Although electroplating into a vertical interconnect access (with nonconductive walls) for microelectronic applications has been extensively studied, the "flow-through" electroplating into a channel geometry with conducive walls has not been previously investigated. Here, copper infiltration into a such channel has been investigated using computational analysis for the first time. The effects of the inlet flow velocity, potential, electrolyte concentration, and microchannel geometry are systematically studied to quantify their influence on the electrodeposition rate, uniformity of the deposition front, and the infiltrated area within the channel. Computational results revealed that the unfilled area can be reduced to lower than 1% with a low applied potential, a high electrolyte concentration, and no inflow velocity. The results can be used to guide experiments involving electroplating metals into porous preforms toward reliable and reproducible manufacturing processes.

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass substrates and optional laser post-processing of the recorded structures; thus, the proposed approach offers a complete manufacturing cycle, utilizing a single, commercially available, pulsed Yb fiber laser system. The potential implications of the presented research are amplified by the observation of laser-induced periodic surface structures (LIPSSs) that may be useful for the further tuning of tracks' functional properties.

Study of Microscale Meniscus Confined Electrodeposition Based on COMSOL

The rate and quality of microscale meniscus confined electrodeposition represent the key to micromanipulation based on electrochemistry and are extremely susceptible to the ambient relative humidity, electrolyte concentration, and applied voltage. To solve this problem, based on a neural network and genetic algorithm approach, this paper optimizes the process parameters of the microscale meniscus confined electrodeposition to achieve high-efficiency and -quality deposition. First, with the COMSOL Multiphysics, the influence factors of electrodeposition were analyzed and the range of high efficiency and quality electrodeposition parameters were discovered. Second, based on the back propagation (BP) neural network, the relationships between influence factors and the rate of microscale meniscus confined electrodeposition were established. Then, in order to achieve effective electrodeposition, the determined electrodeposition rate of 5 × 10⁻⁸ m/s was set as the target value, and the genetic algorithm was used to optimize each parameter. Finally, based on the optimization parameters obtained, we proceeded with simulations and experiments. The results indicate that the deposition rate maximum error is only 2.0% in experiments. The feasibility and accuracy of the method proposed in this paper were verified.

Influence of Double-Pulse Electrodeposition Parameters on the Performance of Nickel/Nanodiamond Composite Coatings

In this study, using 45# carbon steel as the substrate, a first experimental analysis was carried out on the polarisation behaviour of different component wattage plating solutions in order to determine the reasonable content of nanodiamond particles in a nickel/nanodiamond composite plating solution. Secondly, the effect of double-pulse forward and reverse duty cycle and reverse working time on the performance of nickel/nanodiamond composite plating was then investigated by testing the thickness, hardness and surface roughness of the composite plating and observing the surface micromorphology. The experimental results show that, when the content of nanodiamond particles in the plating solution is 5 g/L, the anti-pulse working time, forward and reverse pulse duty cycle of the double-pulse plating parameters are 20 ms, 0.3 and 0.2, respectively, and the composite plating layer prepared by double pulse has good comprehensive performance. This research work provides technical support for the optimisation of process parameters for the preparation of nickel/nanodiamond composite coatings by double-pulse electrodeposition.