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Lee J, Woo G, Lee G, Jeon J, Lee S, Wang Z, Shin H, Lee GW, Kim YJ, Lee DH, Kim MJ, Kim E, Seok H, Cho J, Kang B, No YS, Jang WJ, Kim T. Ultrastable 3D Heterogeneous Integration via N-Heterocyclic Carbene Self-Assembled Nanolayers. ACS APPLIED MATERIALS & INTERFACES 2024. [PMID: 38935928 DOI: 10.1021/acsami.4c04665] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/29/2024]
Abstract
The commercialization of 3D heterogeneous integration through hybrid bonding has accelerated, and accordingly, Cu-polymer bonding has gained significant attention as a means of overcoming the limitations of conventional Cu-SiO2 hybrid bonding, offering high compatibility with other fabrication processes. Polymers offer robust bonding strength and a low dielectric constant, enabling high-speed signal transmission with high reliability, but suffer from low thermomechanical stability. Thermomechanical stability of polymers was not achieved previously because of thermal degradation and unstable anchoring. To overcome these limitations, wafer-scale Cu-polymer bonding via N-heterocyclic carbene (NHC) nanolayers was presented for 3D heterogeneous integration, affording ultrastable packing density, crystallinity, and thermal properties. NHC nanolayers were deposited on copper electrodes via electrochemical deposition, and wafer-scale 3D heterogeneous integration was achieved by adhesive bonding at 170 °C for 1 min. Ultrastable conductivity and thermomechanical properties were observed by the spatial mapping of conductivity, work function, and force-distance curves. With regard to the characterization of NHC nanolayers, low-temperature bonding, robust corrosion inhibition, enhanced electrical conductivity, back-end-of-line process compatibility, and fabrication process reduction, NHC Cu/polymer bonding provides versatile advances in 3D heterogeneous integration, indicating that NHC Cu/polymer bonding can be utilized as a platform for future 3D vertical chip architectures.
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Affiliation(s)
- Jinhyoung Lee
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Center for Quantum Nanoscience, Institute for Basic Science (IBS), Seoul 03760, Republic of Korea
| | - Gunhoo Woo
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Gyuyoung Lee
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Jongyeong Jeon
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Seunghwan Lee
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Ziyang Wang
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Hyelim Shin
- Department of Semiconductor Convergence Engineering, Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Gil-Woo Lee
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Physics, Konkuk University, Seoul 05029, Republic of Korea
| | - Yeon-Ji Kim
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Physics, Konkuk University, Seoul 05029, Republic of Korea
| | - Do-Hyun Lee
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Physics, Konkuk University, Seoul 05029, Republic of Korea
| | - Min-Jae Kim
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Eungchul Kim
- AVP Process Development Team, Samsung Electronics, Chungcheongnam-do, Cheonan-si 31086, South Korea
| | - Hyunho Seok
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Jinill Cho
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Boseok Kang
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Nano Engineering, Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - You-Shin No
- Department of Physics, Konkuk University, Seoul 05029, Republic of Korea
| | - Won-Jun Jang
- Center for Quantum Nanoscience, Institute for Basic Science (IBS), Seoul 03760, Republic of Korea
- Department of Physics, Ewha Womans University, Seoul 03760, Republic of Korea
| | - Taesung Kim
- School of Mechanical Engineering, Sungkyunkwan University (SKKU), Suwon-si, Gyeonggi-do 16419, Republic of Korea
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Semiconductor Convergence Engineering, Suwon-si, Gyeonggi-do 16419, Republic of Korea
- Department of Nano Engineering, Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
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Jeong MS, Park SW, Kim YJ, Kim JH, Hong SK, Kim SE, Park JK. Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers. Sci Rep 2024; 14:6665. [PMID: 38509189 PMCID: PMC10954753 DOI: 10.1038/s41598-024-57379-2] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/12/2024] [Accepted: 03/18/2024] [Indexed: 03/22/2024] Open
Abstract
Cu/SiO2 hybrid bonding presents a promising avenue for achieving high-density interconnects by obviating the need for microbumps and underfills. Traditional copper bonding methods often demand temperatures exceeding 400 °C, prompting recent endeavors to mitigate bonding temperatures through investigations into metal passivation bonding. In this study, we scrutinized the diffusion behavior associated with various metal passivation layers (Platinum, Titanium, Tantalum, and Chromium) in the context of low-temperature direct copper bonding and delved into the essential bonding mechanisms. We observed a deviation from conventional metal-metal bonding factors, such as surface roughness and grain size, in the diffusion behavior. Remarkably, our analysis revealed a pronounced correlation between the crystallinity of the metal passivation layers and diffusion behavior, surpassing the influence of other experimental factors. Subsequent post-bonding examinations corroborated consistent diffusion behavior in Pt and Cr passivation samples with disparate crystallinities, reinforcing the significance of crystallinity in the bonding process. Our findings underscore crystallinity as a pivotal factor governing diffusion behavior, even under varied bonding conditions. These insights are instrumental in achieving exceptional bonding characteristics at lower temperatures in Cu/SiO2 hybrid bonding. Implications of this study extend to the prospect of advancing highly integrated systems through die-to-wafer bonding, marking a substantial stride toward future applications.
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Affiliation(s)
- Min Seong Jeong
- Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, Republic of Korea
| | - Sang Woo Park
- Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, Republic of Korea
| | - Yeon Ju Kim
- Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, Republic of Korea
| | - Ji Hun Kim
- Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, Republic of Korea
| | - Seul Ki Hong
- Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, Republic of Korea
| | - Sarah Eunkyung Kim
- Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, Republic of Korea
| | - Jong Kyung Park
- Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul, Republic of Korea.
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He S, Jiang J, Shen YA, Mo L, Bi Y, Wu J, Guo C. Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature. MATERIALS (BASEL, SWITZERLAND) 2024; 17:1055. [PMID: 38473526 DOI: 10.3390/ma17051055] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/31/2023] [Revised: 02/19/2024] [Accepted: 02/22/2024] [Indexed: 03/14/2024]
Abstract
With the continuous reduction of chip size, fluxless soldering has brought attention to high-density, three-dimensional packaging. Although fluxless soldering technology with formic acid (FA) atmosphere has been presented, few studies have examined the effect of the Pt catalytic, preheating time, and soldering pad on FA soldering for the Sn-58Bi solder. The results have shown that the Pt catalytic can promote oxidation-reduction and the formation of a large pore in the Sn-58Bi/Cu solder joint, which causes a decrease in shear strength. ENIG (electroless nickel immersion gold) improves soldering strength. The shear strength of Sn-58Bi/ENIG increases under the Pt catalytic FA atmosphere process due to the isolation of the Au layer on ENIG. The Au layer protects metal from corrosion and provides a good contact surface for the Sn-58Bi solder. The shear strength of the Sn-58Bi/ENIG joints under a Pt catalytic atmosphere improved by 44.7% compared to using a Cu pad. These findings reveal the improvement of the shear strength of solder joints bonded at low temperatures under the FA atmosphere.
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Affiliation(s)
- Siliang He
- Key Laboratory of Microelectronic Packaging & Assembly Technology of Guangxi Education Department, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
- Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China
| | - Jian Jiang
- Key Laboratory of Microelectronic Packaging & Assembly Technology of Guangxi Education Department, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
| | - Yu-An Shen
- Department of Materials Science and Engineering, Feng Chia University, Taichung 407, Taiwan
| | - Lanqing Mo
- Key Laboratory of Microelectronic Packaging & Assembly Technology of Guangxi Education Department, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
| | - Yuhao Bi
- Key Laboratory of Microelectronic Packaging & Assembly Technology of Guangxi Education Department, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
| | - Junke Wu
- Key Laboratory of Microelectronic Packaging & Assembly Technology of Guangxi Education Department, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
| | - Chan Guo
- Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China
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Jang YJ, Sharma A, Jung JP. Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review. MATERIALS (BASEL, SWITZERLAND) 2023; 16:7652. [PMID: 38138794 PMCID: PMC10744783 DOI: 10.3390/ma16247652] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/24/2023] [Revised: 12/03/2023] [Accepted: 12/12/2023] [Indexed: 12/24/2023]
Abstract
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.
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Affiliation(s)
- Ye Jin Jang
- Department of Materials Science and Engineering, University of Seoul, Seoul 02504, Republic of Korea;
| | - Ashutosh Sharma
- Department of Materials Science and Engineering, Ajou University, 206-Worldcup-ro, Yeongtong-gu, Gyeonggi-do, Suwon 16499, Republic of Korea
| | - Jae Pil Jung
- Department of Materials Science and Engineering, University of Seoul, Seoul 02504, Republic of Korea;
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He S, Xiong B, Xu F, Chen B, Cui Y, Hu C, Yue G, Shen YA. Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid Atmosphere. MATERIALS (BASEL, SWITZERLAND) 2023; 16:2389. [PMID: 36984269 PMCID: PMC10051379 DOI: 10.3390/ma16062389] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 02/16/2023] [Revised: 03/07/2023] [Accepted: 03/08/2023] [Indexed: 06/18/2023]
Abstract
This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, Cu6Sn5 forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into Cu3Sn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa.
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Affiliation(s)
- Siliang He
- Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China; (S.H.)
- Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China
| | - Bifu Xiong
- Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China; (S.H.)
| | - Fangyi Xu
- Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China; (S.H.)
| | - Biyang Chen
- Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China; (S.H.)
| | - Yinhua Cui
- Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China
| | - Chuan Hu
- Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China
| | - Gao Yue
- Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China; (S.H.)
- Guilin Fuda Co., Ltd., Guilin 541199, China
| | - Yu-An Shen
- Department of Materials Science and Engineering, Feng Chia University, Taichung 407, Taiwan
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Zhao K, Zhao J, Wei X, Guan X, Deng C, Dai B, Zhu J. Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management. MICROMACHINES 2023; 14:290. [PMID: 36837990 PMCID: PMC9967922 DOI: 10.3390/mi14020290] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 12/19/2022] [Revised: 01/18/2023] [Accepted: 01/19/2023] [Indexed: 06/18/2023]
Abstract
Three-dimensional integrated packaging with through-silicon vias (TSV) can meet the requirements of high-speed computation, high-density storage, low power consumption, and compactness. However, higher power density increases heat dissipation problems, such as severe internal heat storage and prominent local hot spots. Among bulk materials, diamond has the highest thermal conductivity (≥2000 W/mK), thereby prompting its application in high-power semiconductor devices for heat dissipation. In this paper, we report an innovative bottom-up Cu electroplating technique with a high-aspect-ratio (10:1) through-diamond vias (TDV). The TDV structure was fabricated by laser processing. The electrolyte wettability of the diamond and metallization surface was improved by Ar/O plasma treatment. Finally, a Cu-filled high-aspect-ratio TDV was realized based on the bottom-up Cu electroplating process at a current density of 0.3 ASD. The average single-via resistance was ≤50 mΩ, which demonstrates the promising application of the fabricated TDV in the thermal management of advanced packaging systems.
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Affiliation(s)
- Kechen Zhao
- National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin 150080, China
| | - Jiwen Zhao
- National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin 150080, China
| | - Xiaoyun Wei
- Huawei Technologies Co., Ltd., Dongguan 523799, China
| | - Xiaoyu Guan
- National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin 150080, China
| | - Chaojun Deng
- Huawei Technologies Co., Ltd., Dongguan 523799, China
| | - Bing Dai
- National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin 150080, China
| | - Jiaqi Zhu
- National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin 150080, China
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