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Sun R, Guo R, Yu X, Ren Y, Wang R, Zou P, Chen Z, Xu R, Ma Y, Ma L. Brushy C-Decorated BiTe-Based Thermoelectric Film for Efficient Photodetection and Photoimaging. ACS APPLIED MATERIALS & INTERFACES 2024; 16:45307-45318. [PMID: 39150356 DOI: 10.1021/acsami.4c07979] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 08/17/2024]
Abstract
Current strategies for simultaneously achieving high thermoelectric performance and high light absorption efficiency still suffer from complex steps and high costs. Herein, two kinds of amorphous thermoelectric films of n-type Bi2Te3 and p-type Bi0.5Sb1.5Te3 with high Seebeck coefficients were prepared by pulsed laser deposition (PLD) technology. In addition, C-decorated films with excellent light absorption efficiency at the junction of the thermoelectric legs were prepared by simple drop coating and reactive ion etching (RIE) method. The TE/C-RIE composite device exhibits excellent photodetection performance under the conditions of simulated natural light, monochromatic light, and high-frequency chopping. The maximum responsivity and specific detectivity of the device can reach 153.58 mV W-1 and 6.97 × 106 cm Hz1/2 W-1 (under simulated natural light), respectively. This represents an improvement rate of 85.91% compared to that of the pure TE device. Benefiting from the excellent photodetection efficiency of the device and integration advantage of PLD technology, the composite structure can be expanded into integrated photoimaging devices. The accurate identification of patterned light sources with letters (T, J, and U) and digitals (0-9) was successfully realized by associating the response electrical signals of each electrode with the position coordinates. This work provides valuable guidance for the design and fabrication of wide-spectrum photodetectors and complex optical imaging devices.
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Affiliation(s)
- Rongke Sun
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
| | - Runan Guo
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
| | - Xue Yu
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
| | - Yanmei Ren
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
| | - Ruoxi Wang
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
| | - Pinggen Zou
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
| | - Zhi Chen
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
| | - Rui Xu
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
| | - Yanqing Ma
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
- Tianjin Key Laboratory of Low-Dimensional Electronic Materials and Advanced Instrumentation, Tianjin 300072, PR China
- School of Precision Instrument and Optoelectronics Engineering, Tianjin University, Tianjin 300072, P. R. China
| | - Lei Ma
- Tianjin International Center for Nanoparticles and Nanosystems, Tianjin University, Tianjin 300072, P. R. China
- Tianjin Key Laboratory of Low-Dimensional Electronic Materials and Advanced Instrumentation, Tianjin 300072, PR China
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Si W, Zhou W, Liu X, Wang K, Liao Y, Yan F, Ji X. Recent Advances in Broadband Photodetectors from Infrared to Terahertz. MICROMACHINES 2024; 15:427. [PMID: 38675239 PMCID: PMC11051910 DOI: 10.3390/mi15040427] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/19/2024] [Revised: 03/15/2024] [Accepted: 03/19/2024] [Indexed: 04/28/2024]
Abstract
The growing need for the multiband photodetection of a single scene has promoted the development of both multispectral coupling and broadband detection technologies. Photodetectors operating across the infrared (IR) to terahertz (THz) regions have many applications such as in optical communications, sensing imaging, material identification, and biomedical detection. In this review, we present a comprehensive overview of the latest advances in broadband photodetectors operating in the infrared to terahertz range, highlighting their classification, operating principles, and performance characteristics. We discuss the challenges faced in achieving broadband detection and summarize various strategies employed to extend the spectral response of photodetectors. Lastly, we conclude by outlining future research directions in the field of broadband photodetection, including the utilization of novel materials, artificial microstructure, and integration schemes to overcome current limitations. These innovative methodologies have the potential to achieve high-performance, ultra-broadband photodetectors.
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Affiliation(s)
- Wei Si
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Wenbin Zhou
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Xiangze Liu
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Ke Wang
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Yiming Liao
- School of Electronic and Optical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
| | - Feng Yan
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Xiaoli Ji
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
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Zhang Y, Meng Y, Wang L, Lan C, Quan Q, Wang W, Lai Z, Wang W, Li Y, Yin D, Li D, Xie P, Chen D, Yang Z, Yip S, Lu Y, Wong CY, Ho JC. Pulse irradiation synthesis of metal chalcogenides on flexible substrates for enhanced photothermoelectric performance. Nat Commun 2024; 15:728. [PMID: 38272917 PMCID: PMC10810900 DOI: 10.1038/s41467-024-44970-4] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/28/2023] [Accepted: 01/11/2024] [Indexed: 01/27/2024] Open
Abstract
High synthesis temperatures and specific growth substrates are typically required to obtain crystalline or oriented inorganic functional thin films, posing a significant challenge for their utilization in large-scale, low-cost (opto-)electronic applications on conventional flexible substrates. Here, we explore a pulse irradiation synthesis (PIS) to prepare thermoelectric metal chalcogenide (e.g., Bi2Se3, SnSe2, and Bi2Te3) films on multiple polymeric substrates. The self-propagating combustion process enables PIS to achieve a synthesis temperature as low as 150 °C, with an ultrafast reaction completed within one second. Beyond the photothermoelectric (PTE) property, the thermal coupling between polymeric substrates and bismuth selenide films is also examined to enhance the PTE performance, resulting in a responsivity of 71.9 V/W and a response time of less than 50 ms at 1550 nm, surpassing most of its counterparts. This PIS platform offers a promising route for realizing flexible PTE or thermoelectric devices in an energy-, time-, and cost-efficient manner.
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Affiliation(s)
- Yuxuan Zhang
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - You Meng
- State Key Laboratory of Terahertz and Millimeter Waves, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China.
| | - Liqiang Wang
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Changyong Lan
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, P.R. China
| | - Quan Quan
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Wei Wang
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Zhengxun Lai
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Weijun Wang
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Yezhan Li
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Di Yin
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Dengji Li
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Pengshan Xie
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Dong Chen
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Zhe Yang
- Department of Chemistry, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - SenPo Yip
- Institute for Materials Chemistry and Engineering, Kyushu University, Fukuoka, 816 8580, Japan
| | - Yang Lu
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong, SAR 999077, P.R. China
| | - Chun-Yuen Wong
- Department of Chemistry, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China.
| | - Johnny C Ho
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China.
- State Key Laboratory of Terahertz and Millimeter Waves, City University of Hong Kong, Hong Kong, SAR 999077, P.R. China.
- Institute for Materials Chemistry and Engineering, Kyushu University, Fukuoka, 816 8580, Japan.
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