Polymeric Self-Assembled Monolayers Anomalously Improve Thermal Transport across Graphene/Polymer Interfaces

Thermal rectification in mass-asymmetric one-dimensional anharmonic oscillator lattices with and without a ballistic spacer

In this work we perform a systematic analysis of various structural parameters that have influence on the thermal rectification effect, i.e. asymmetrical heat flow, and the negative differential thermal resistance -reduction of the heat flux as the applied thermal bias is increased- present in a one-dimensional, segmented mass-graded system consisting of a coupled nearest-neighbor harmonic oscillator lattice (ballistic spacer) and two diffusive leads (modeled by a substrate potential) attached to the lattice at both boundaries. At variance with previous works, we consider the size of the spacer as smaller than that of the leads. Also considered is the case where the leads are connected along the whole length of the oscillator lattice; that is, in the absence of the ballistic spacer. Upon variation of the system's parameters it was determined that the performance of the device, as quantified by the spectral properties, is largely enhanced in the absence of the ballistic spacer for the small system-size limit herein considered.

Unstructured Self-Assembled Molecular Lamella Induces Ultrafast Thermal Transfer through a Cathode/Separator Interphase in Lithium-Ion Batteries

Thermal issues associated with lithium-ion batteries (LIBs) can dramatically affect their life cycle and overall performance. However, the effective heat transfer is deeply restrained by the high thermal resistance across the cathode (lithium cobalt oxide, LCO)-separator (polyethylene, PE) interface. This work presents a new approach to tailoring the interfacial thermal resistance, namely, unstructured self-assembled lamella (USAL). Compared to the popular self-assembled monolayers, although the USAL gives a redundant interface and amorphous molecule patterns, it can also provide many benefits, including easy assembly, more thermal bridges, and ready pressurization. Three small organic molecules (SOMs) were assembled into an LCO-PE interface, providing unique functional groups, -NH₂, -SH, and -CH₃, to illustrate its energy conversion efficiency. Through molecular dynamics simulations, our results show that the USAL can facilitate interfacial heat transfer remarkably. A 3-aminopropyl trimethoxysilane (APTMS)-coated LCO-PE system with 11.4 Å thickness demonstrates the maximum enhancement of thermal conductance, about 320% of the pristine system. Such enhancement is attributed to the developed double heat passages by strong non-bonded interactions across LCO-SOM and PE-SOM interfaces, a tuned temperature field, and high compatibility between SOMs and PE. Importantly, due to SOMs' amorphous morphology, the pressure can be imposed and further enhance the interfacial heat transfer. Results show the improved thermal conductance rises the most for the APTMS-coated LCO-PE system with 11.4 Å thickness at 10 GPa, almost 685% higher than that of the pristine system. The high efficiency of heat transfer comes as a result of the enhanced binding strength across the LCO-SOM and SOM-PE interface, the reduced phonon scattering in PE and SOMs, and the high LCO stiffness. These investigations are expected to provide a new perspective for modulating the heat transfer across the interphase of LIBs and achieve more effective thermal management for the multi-material system.

Molecular self-assembled monolayers anomalously enhance thermal conductance across polymer-semiconductor interfaces

Thermal issues have become increasingly important for the performance and lifetime of highly miniaturized and integrated devices. However, the high thermal resistance across the polymer/semiconductor interface greatly weakens the fast heat dissipation. In this study, applying the self-assembled monolayer (SAM) technique, organic molecules are employed as heat regulators to mediate interfacial thermal conductance (ITC) between semiconductors (silicon or Si) and polymers (polystyrene or PS). Silane-based SAM molecules with unique functional groups, such as -NH₂, -CH₃, -SH, and -Cl, are orderly assembled into Si-PS interfaces. Their roles in ITC and the heat transfer mechanism were systematically investigated. Molecular simulations demonstrate that the Si-PS interface decorated with SAM molecules can significantly facilitate heat transfer in varying degrees. Such a difference is primarily due to the different non-bonded interactions and compatibility between SAMs and PS. Compared with the pristine Si-PS interface, the interface incorporated with 3-chloropropyl trimethoxysilane shows the greatest improvement in ITC, about 507.02%. Such improvements are largely attributed to the SAM molecules, as the thermal bridges straighten the molecular SAM chains, develop strong non-bonded interactions with PS, provide the covalent bonding between Si and PS, exhibit a strong coupling effect between two materials' vibrational modes, and eliminate the discontinuities in the temperature field. Eventually, these demonstrations are expected to offer molecular insights to enable effective thermal management through surface engineering for critical-heat transfer materials and microelectronic devices.

Water-soluble polyvinyl alcohol composite films with nanodiamond particles modified with polyethyleneimine

Nanodiamond particles modified with polyethyleneimine were added to polyvinyl alcohol matrices to obtain composites with good thermal and mechanical properties.

Heat Transport Control and Thermal Characterization of Low-Dimensional Materials: A Review

Heat dissipation and thermal management are central challenges in various areas of science and technology and are critical issues for the majority of nanoelectronic devices. In this review, we focus on experimental advances in thermal characterization and phonon engineering that have drastically increased the understanding of heat transport and demonstrated efficient ways to control heat propagation in nanomaterials. We summarize the latest device-relevant methodologies of phonon engineering in semiconductor nanostructures and 2D materials, including graphene and transition metal dichalcogenides. Then, we review recent advances in thermal characterization techniques, and discuss their main challenges and limitations.

Quantitative Analysis of Salmonella typhimurium Based on Elemental-Tags Laser-Induced Breakdown Spectroscopy

Current rapid bacterial detection methods are dedicated to the classification and identification of bacteria. However, there is still a lack of a method for specific quantitative analysis of certain bacteria. In this work, a method based on elemental-tags laser-induced breakdown spectroscopy (ETLIBS) was developed for the rapid and specific quantitative analysis of Salmonella typhimurium (S. ty). Elemental tags were first synthesized by assembling copper nanoparticles (CuNPs) with poly(thymine) (poly-T) template that linked with the aptamer sequence. Under the specific recognition of the aptamer, S. ty can be fully combined with the elemental tags within 30 min to achieve labeling. Afterward, the silicon nanowires (SiNWs) array modified with Au@Ag nanoparticles (SiNWs-Au@Ag) was employed to capture S. ty in 30 min. Attributed to the rapid analysis superiority of ETLIBS mapping, 100 spectra of SiNWs-Au@Ag/S. ty/CuNPs can be obtained in 5 min. It was found that the peak area of the Cu(I) atomic emission line at 324.75 nm fitted by the Voigt profile was linearly related to the bacterial concentration in the range of 10²-10⁶ CFU/mL(R² = 0.978). Furthermore, ETLIBS mapping achieved a low limit of detection (LOD) of 61 CFU/mL and showed good selectivity to S. ty compared with other bacteria. Besides, the method exhibited preeminent detection performance in spiked samples with the recoveries of 87-113%. With the advantages of rapidity, high efficiency, and specificity, the proposed method is expected to be a powerful tool for bacterial detection.

N-Heterocyclic Carbenes for the Self-Assembly of Thin and Highly Insulating Monolayers with High Quality and Stability

As an organic nanostructure, self-assembled monolayers (SAMs) play a central role in many aspects of nanotechnology, including molecular electronics. In this work, we show that SAMs based on N-heterocyclic carbenes on a Au(111) substrate offer a high level of crystallinity and also exhibit the highest possible packing density. As a result of this structural optimization, defect concentrations were reduced by 2-3 orders of magnitude and thermal stability was ∼100 K higher than those of any other SAMs on Au. The conductivity of these SAMs is ∼4 orders of magnitude lower than that of standard alkanethiols of comparable length, which together with very low defect concentration and high thermal stability makes them a highly interesting material for potential application in organic thin film transistors. The self-assembly of such dense, highly crystalline, and notably stable structures is associated with strong C-Au bonding and the rational design of assembled molecules, resulting in the high mobility of both adsorbate and substrate atoms, as confirmed by the size of the molecular domains and the adsorbate-driven modification of the Au(111) substrate, respectively.

Self-Assembled Monolayers for the Polymer/Semiconductor Interface with Improved Interfacial Thermal Management

Reliability and lifespan of highly miniaturized and integrated devices will be effectively improved if excessive accumulated heat can be quickly transported to heat sinks. In this study, both molecular dynamics (MD) simulations and experiments were performed to demonstrate that self-assembled monolayers (SAMs) have high potential in interfacial thermal management and can enhance thermal transport across the polystyrene (PS)/silicon (Si) interface, modeling the common polymer/semiconductor interfaces in actual devices. The influence of packing density and alkyl-chain length of SAMs is investigated. First, MD simulations show that the interfacial thermal transport efficiency of SAM is higher with high packing density. The interfacial thermal conductance (ITC) between PS and Si can be improved up to 127 ± 9 MW m^-2 K^-1, close to the ITC across the metal and semiconductor interface. At moderate packing density, the SAMs with less than eight carbon atoms in the alkyl chain show superior improvements over those with more carbons because of the assembled structure variation. Second, the time-domain thermoreflectance technique was employed to characterize the ITCs of a bunch of Al/PS/SAM/Si samples. C6-SAM enhances the ITC by fivefolds, from 11 ± 1 to 56 ± 17 MW m^-2 K^-1. The interfacial thermal management efficiency will weaken when the alkyl chain exceeds eight carbon atoms, which agrees with the ITC trend from MD simulations at moderate packing density. The relationship between the SAM morphology and interfacial thermal management efficiency is also discussed in detail. This study demonstrates the feasibility of molecular-level design for interfacial thermal management from both the theoretical calculation and experiment and may provide a new idea for improving the heat dissipation efficiency of microdevices.

Hierarchically hydrogen-bonded graphene/polymer interfaces with drastically enhanced interfacial thermal conductance

Interfacial thermal transport is a critical physical process determining the performance of many material systems with small-scale features. Recently, self-assembled monolayers and polymer brushes have been widely used to engineer material interfaces presenting unprecedented properties. Here, we demonstrate that poly(vinyl alcohol) (PVA) monolayers with hierarchically arranged hydrogen bonds drastically enhance interfacial thermal conductance by a factor of 6.22 across the interface between graphene and poly(methyl methacrylate) (PMMA). The enhancement is tunable by varying the number of grafted chains and the density of hydrogen bonds in the unique hierarchical hydrogen bond network. The extraordinary enhancement results from a synergy of hydrogen bonds and other structural and thermal factors including molecular morphology, chain orientation, interfacial vibrational coupling and heat exchange. Two types of hydrogen bonds, i.e. PVA-PMMA hydrogen bonds and PVA-PVA hydrogen bonds, are analyzed and their effects on various structural and thermal properties are systematically investigated. These results are expected to provide new physical insights for interface engineering to achieve tunable thermal management and energy efficiency in a wide variety of systems involving polymers and biomaterials.