Oligosilylarylnitrile: The Thermoresistant Thermosetting Resin with High Comprehensive Properties

Dielectric Properties of Benzocyclobutene-Based Resin: A Molecular Dynamics Study

Benzocyclobutene (BCB)-based resins have garnered considerable attention because of their remarkable dielectric properties and thermal stability. However, in molecular dynamics (MD) simulations, progress in BCB-based resin research has yet to keep pace with experimental advancements, resulting in a shortage of theoretical underpinnings at the molecular level. This study focuses on a novel homopolymer, poly(2-(4-benzocyclobutenyl)-divinylbenzene(DVB-S-BCB)), and devises an interactive methodology suitable for BCB-based resins. We implemented a Python script for the joint relaxation method to construct a three-dimensional model of the cured polymer using MadeA and LAMMPS. We conducted MD simulations to investigate how the cross-linking degree and resin molecular weight influence the dielectric properties of the cured polymer. Furthermore, we analyzed the thermodynamic properties through simulation. The results illustrate that augmenting the cross-linking degree and resin molecular weight results in a higher cross-linking density and reduced free volume, thereby increasing the dielectric constant of the resin. The cross-link density does not increase indefinitely with molecular weight, and after a certain threshold is reached, it cannot have a significant effect on the dielectric constant. The degree of cross-linking exerts a more pronounced impact on the dielectric constant than the molecular weight of the resin. In addition, the simulation results denote the excellent thermodynamic properties of the cured polymer. This study also examines the dielectric and thermodynamic properties of the resin samples that were experimentally prepared. The obtained data successfully confirm the reliability of the simulation results. This study offers novel insights for future simulation research on benzocyclobutene-based resins. Additionally, it provides theoretical support for exploring experimental work on low-dielectric materials in the electronic field.

Preparation of phthalonitrile resins containing siloxane linkages with improved processability

To improve the processability of biphenyl phthalonitrile resin, a flexible siloxane structure was introduced into the phthalonitrile monomer through molecular design, which was then blended with a biphenyl monomer to prepare phthalonitrile alloy resins. When the ratio of phthalonitrile monomer containing flexible siloxane to biphenyl phthalonitrile monomer was 1:1, the processing window widened from 58 to 110°C, as compared to that of biphenyl phthalonitrile. Due to the introduction of the biphenyl structure into the phthalonitrile alloy resins, the initial decomposition temperature of the silicon-containing phthalonitrile resin increased from 385 to 516°C. More importantly, the phthalonitrile alloy resin exhibited a high bending strength (66 MPa) and bending modulus (3762 MPa), indicating that it could be potentially applied as high temperature structural composite matrices. Furthermore, it provides a new strategy for processing phthalonitrile resins with a high melting point and narrow processing window.

Self-catalytic phthalonitrile polymer with improved processing performance and long-term thermal stability

Phthalonitrile monomer with alkyl, pyrimidine, and amino is successfully prepared by nucleophilic substitution. The monomer is cured by autocatalysis of active hydrogen in the amino group, in order to obtain polymers through different temperature procedures. The low melting point (96°C) and curing kinetics of the monomer are analyzed by DSC, which manifest a processing window of 163°C. With lower energy barriers to overcome, the apparent activation energy ( E a) is 59.6 kJ mol−1 after fitting and calculating, signifying that the monomers are easier to process into polymers. This study focuses on the usefulness of the polymer, especially the long-term thermal stability by the comparison of numerous commonly used polymers. The consequence demonstrates that the polymer could be used for long periods at 300°C, keeping weight loss within 5 wt.% for 6 h. The advantage of long-term usage at high temperatures has not been proved in previous works on phthalonitrile polymer. Moreover, the thermal and thermal-mechanical stability are examined through TGA and DMA. The results indicate preferable thermal properties, that the glass transition temperature is up to 400°C.

Rational Design of Fluorinated Phthalonitrile/Hollow Glass Microsphere Composite with Low Dielectric Constant and Excellent Heat Resistance for Microelectronic Packaging

High-performance composites with a resin matrix are urgently required for electronic packaging due to their low dielectric constant, outstanding high temperature resistance, excellent corrosion resistance, light weight and easy molding. In this work, hollow-glass-microsphere (HGM)-filled fluorinated-phthalonitrile (PBDP) composites, with filler contents ranging from 0 to 35.0 vol.%, were prepared in order to modify the dielectric properties of the phthalonitrile. Scanning electron microscopy (SEM) observations indicate that the modified HGM particles were uniformly dispersed in the matrix. The PBDP/27.5HGM-NH₂ composite demonstrates a low dielectric constant of 1.85 at 12 GHz. The 5% thermogravimetric temperature (T₅) of composites with silanized HGM filler (481-486 °C) is higher than the minimum packaging-material requirements (450 °C). In addition, the heat-resistance index (T_HRI) of PBDP/HGM-NH₂ composites reached as high as 268 °C. the storage modulus of PBDP/HGM-NH₂ composites were significantly increased to 1283 MPa at 400 °C, an increase by 50%, in comparison to that of PBDP phthalonitrile resin (857 MPa). The excellent dielectric and thermal properties of the present composites may pave a way for comprehensive applications in electronic packaging and thermal management for energy systems.

Synthesis of oligomeric phthalonitrile resins containing imide units and study of the methylene-cyano thermal synergistic polymerization effect

The meta- and para-catenated methylene-containing phthalonitrile oligomers were prepared from the reaction of an excess amount of 4,4′-(4,4′-isopropylidenediphenoxy) bis-(phthalic anhydride) (BPADA) with 4,4′-Methylenedianiline (MDA) in a N, N-dimethylformamide/ toluene solvent mixture, followed by end-capping agent with 4-nitrophthalonitrile or 4-phenoxyaniline in a two-step, one-pot reaction. Differential scanning calorimetry (DSC) showed that both PN oligomers exhibited low softening points. The self-catalyzed curing reactivity of the PN oligomers was confirmed by the isothermal rheological measurements. Fourier transform infrared spectroscopy (FTIR) and ultraviolet and visible spectrophotometry (UV–Vis) data of the pre-curing resins were employed to investigate the chemical structure of the pre-cured resins, suggesting that oligomers generated crosslinking sites, including triazine, isoindoline, and phthalocyanine. The results further confirmed the self-catalyzed curing reactivity of the oligomers. Thermal properties were investigated by dynamic mechanical analysis (DMA) and thermal gravimetric analysis (TGA), demonstrating good thermal properties of the cured resins. The glass transition temperatures (Tgs) of PIPN-1-325, PIPN-1-350, PIPN-1-375 were in the range of 285–345°C, the 5% weight loss temperature (T5%) was observed at 482°C. The PIPN-2-325, PIPN-2-350, PIPN-2-375 showed Tgs ranging from 293 to 370°C, and T5% of the resins were in the range of 481–501°C. Then the isothermal rheological results of model compound and PN oligomers implied that the curing process of PN oligomers was closely related to the methylene-cyano radical thermal synergistic polymerization (TSP) effect proposed in our previous research, and then a revised curing mechanism (radical TSP mechanism) was proposed.

Fabricating a Repairable, Recyclable, Imine-based Dynamic Covalent Thermosetting Resin with Excellent Water Resistance by Introducing Dynamic Covalent Oxime Bonds

The sustainable production of adaptive, recyclable and imine-based dynamic covalent thermosetting resins (DCTRs) presents an opportunity for polymer scientists to address the prevalent environmental and energy concerns associated with current petroleum-based plastics. However, the imine-based DCTRs easily decompose in the presence of water, which can weaken the mechanical properties in imine-based polymers. In this study, we designed oxime-imine DCTRs that are stable in the presence of water and exhibit good mechanical properties. In the presence of one kind of amino group catalyst, the oxime-imine DCTRs could be completely recycled. Additionally, these well-designed oxime-imine DCTRs have good mechanical properties, high glass transition temperatures (166 °C), and good thermal stabilities. Taken together, this work offers a sustainable solution for the design and manufacture of high-value degradable materials intended for applications in which recyclability and reusability are indispensable.

A theoretical insight into the curing mechanism of phthalonitrile resins promoted by aromatic amines

High-temperature phthalonitrile resins have a wide range of applications, and understanding their curing mechanism is of great importance for academic research and engineering applications. However, the actual curing mechanism is still elusive. We presented a density functional theory study on the curing mechanism of phthalonitrile resins promoted by aromatic amines using phthalonitrile and aniline as the model compounds. We found that the rate-determining step is the initial nucleophilic addition of amines with nitrile groups on phthalonitrile to generate an amidine intermediate. The amines play a vital role in the H-transfer promoter throughout the curing reaction. The amidine and isoindoline are the critical intermediates, which can readily react with phthalonitrile through 6-membered transition states. The intramolecular cyclization of amidine intermediates is the vital step in forming isoindoline intermediates, which can be significantly promoted by amines. The proposed curing reaction pathways are kinetically more favorable than the previously reported ones, which can account for the formation of triazine, polyisoindoline, and phthalocyanine and provide a molecular-level understanding of the curing reaction.

Propargyloligosilazane matrixed composite for high temperature material combining polymer and ceramic properties

A new single-phased thermosetting resin (propargyloligosilazane, POSZ) was prepared through Hofmann alkylation of oligosilazane with propargylbromide; the propargyl content in POSZ was controlled by monitoring the amount of propargylbromide in synthesis. The characterizations showed that POSZ has ideal rheology during material processing, the thermal curing temperature could be lowered when isocyanate was used as crosslinking agent, and the thermally cured POSZ can be pyrolyzed into anti-oxidative ceramic at a high yield of >70%. For POSZ-matrixed carbon-fabric laminate composite, it possessed high mechanical properties and retained the original shape with the increase of temperature as high as 800 °C. The POSZ-matrixed laminate has the mechanical properties combining polymer character at room temperature and ceramic character at high temperature, and it will find many prospective high temperature applications in need of polymer and ceramic properties simultaneously.

SiBCN ceramic precursor modified phthalonitrile resin with high thermal resistance

In order to expand the application of phenolic-type phthalonitrile resin in high-temperature fields, a series of organic–inorganic hybrid materials have been prepared via conventional blending and doping method. The chemical transformations were monitored by various measurements, while the curing behavior was evaluated by differential scanning calorimetry (DSC), and these new blends could be also cured under auto-catalytic process. The onset polymerization exothermic temperature shifted to lower temperatures (195.3°C). Later, the compatibility within the cured products was analyzed by using energy dispersive spectrometer (EDS) and scanning electron microscope (SEM), where no phase separation occurred between the ceramic domain and the phthalonitrile polymer. Upon curing, the thermal properties of the polymers were characterized by dynamic thermomechanical analysis (DMA) and thermogravimetric analysis (TGA), where enhanced heat resistance and thermal stability were discovered, The blends residual weight (Cy) value was 57.6% with 15 wt.% SiBCN at 1000°C. And when blended with SiBCN precursor, no peak or onset point could be observed in the temperature range (50 to 500°C), which indicated the glass transition temperature greater than 500°C. Additionally, the dielectric properties were evaluated. And when the content was 5 wt.%, the blends dielectric loss was 0.0043 and the permittivity was 4.31. The above results indicated that the introduction of ceramic precursors could enhance the thermal performance of phthalonitrile polymers, consequently the hybrid materials shown great potential in the application of higher temperature fields.

Synthesis and properties of a novel silicon-containing phthalonitrile resin and its quartz-fiber-reinforced composites

A novel silicon-containing phthalonitrile monomer named bis(4-(4′-(4′-phenoxy)phenyl)phenyl)dimethylsilane phthalonitrile (SiBPPN) was successfully designed and synthesized. The chemical structure was characterized by proton nuclear magnetic resonance and Fourier transform infrared (FTIR) analyses, and its molecular weight was determined by mass spectrometry. Its melting point is lower than that of 4,4′-bis(3,4-dicyanophenoxy)biphenyl (BPPN), which has no silicon atom, and its solubility is also much better than that of BPPN. The curing behavior of SiBPPN was studied by differential scanning calorimetry and FTIR analyses in detail. The thermal and thermomechanical properties of the polymer and laminate were studied by thermogravimetric analysis and dynamic mechanical analysis. The results show that the cured SiBPPN (c-SiBPPN) possesses excellent thermal and mechanical properties. Under nitrogen atmosphere, its residual weight ratio at 800°C is 81.5% and the 5% thermal degradation temperature is 546°C. In addition, quartz-fiber (QF)-reinforced c-SiBPPN composites exhibit mechanical properties superior to those of QF-reinforced cured BPPN composites. The interlaminar shear strength and bending strength of the composite are 30.44 and 389 MPa at room temperature, and the interlaminar shear strength and bending strength of the composite are 22.25 and 339 MPa at 300°C.

Developing Highly Tough, Heat-Resistant Blend Thermosets Based on Silicon-Containing Arylacetylene: A Material Genome Approach

Silicon-containing arylacetylene (PSA) resins exhibit excellent heat resistance, yet their brittleness limits the applications. We proposed using acetylene-terminated polyimides (ATPI) as an additive to enhance the toughness of the PSA resins and maintain excellent heat resistance. A material genome approach (MGA) was first established for designing and screening the acetylene-terminated polyimides, and a polyimide named ATPI was filtered out by using this MGA. The ATPI was synthesized and blended with PSA resins to improve the toughness of the thermosets. Influences of the added ATPI contents and prepolymerization temperature on the properties were examined. The result shows that the blend resin can resist high temperature and bear excellent mechanical properties. The molecular dynamics simulations were carried out to understand the mechanism behind the improvement of toughness. The present work provides a method for the rapid design and screening of high-performance polymeric materials.

A high-performance functional phthalonitrile resin with a low melting point and a low dielectric constant

A monomer of fluorinated phthalonitrile, namely 4,4'-bis(p-perfluoro-phenol-(bis(p-phenol)propane-2,2-diyl)-p-oxy-diphthalonitrile) (PBDP), was synthesized by the nucleophilic substitution reaction of bisphenol A, decafluorobiphenyl and 4-nitrophthalonitrile. The structure of the monomer was characterized by nuclear magnetic resonance (NMR) spectroscopy and Fourier transform infrared (FTIR) spectroscopy. The results indicated that the PBDP monomer was synthesized successfully. The monomer was cured in the presence of 4-(aminophenoxy)phthalonitrile (APPH) and the curing behaviour was investigated by differential scanning calorimetry (DSC), suggesting a low melting point of 96 °C and an excellent processing window (96-262 °C). Thermogravimetric analysis (TGA) and dynamic mechanical analysis (DMA) showed that the fluorinated phthalonitrile resin possessed outstanding thermal and thermo-oxidative stabilities as well as good mechanical properties. The glass transition temperature was >400 °C and the 5% thermal degradation temperature was 501 °C. When the frequency was 50 MHz, the dielectric constant and dielectric loss of the polymer were 2.84 and 0.007, respectively. The PBDP resin has ultra-low water absorption of 0.77% and 1.4%, when exposed to an aqueous environment for 50 days at 24 °C and for 24 h at 100 °C, respectively. The prepared PBDP resin with outstanding thermal stability and low dielectric constant is an ideal candidate for aerospace industries, and microelectronic and other electronic packaging materials.

Thermal and oxidative behavior of a tetraphenylsilane-containing phthalonitrile polymer

Phthalonitrile polymers have potential for high-temperature applications in polymer matrix composites as electronic encapsulation compounds. To investigate the effect of inclusion of an organosilicon moiety, a tetraphenylsilane-containing phthalonitrile monomer was synthesized in high yields. The monomer possessed a high melting point of 222–223°C, while no hydrolytic sensitivity was observed. Cured polymers exhibited glass transitions in the range of 290–325°C and coefficients of thermal expansion of 73–77 µm/(m °C). In thermogravimetric analysis (TGA), 5 wt% loss was observed at 482–497°C and 519–526°C, under air and nitrogen, respectively. Infrared (IR)-TGA of evolved gases revealed multiple degradations in both nitrogen and air. The material possessed good thermo-oxidative stability (TOS) when aged in air at 250°C. After aging for 5000 h, oxidative degradation was characterized using Fourier transform IR microscopy, energy dispersive spectroscopy, optical microscopy, and Knoop hardness testing. Four zones were identified in aged samples. The cleavage of Si-phenyl bonds and the formation of Si–O phases and carbonyl groups were observed.