Enhancing Thermal Boundary Conductance of Graphite-Metal Interface by Triazine-Based Molecular Bonding

Boron Nitride/Carbon Fiber High-Oriented Thermal Conductivity Material with Leaves-Branches Structure

In the realm of thermal interface materials (TIMs), high thermal conductivity and low density are key for effective thermal management and are particularly vital due to the growing compactness and lightweight nature of electronic devices. Efficient directional arrangement is a key control strategy to significantly improve thermal conductivity and comprehensive properties of thermal interface materials. In the present work, drawing inspiration from natural leaf and branch structures, a simple-to-implement approach for fabricating oriented thermal conductivity composites is introduced. Utilizing carbon fibers (CFs), known for their ultra-high thermal conductivity, as branches, this design ensures robust thermal conduction channels. Concurrently, boron nitride (BN) platelets, characterized by their substantial in-plane thermal conductivity, act as leaves. These components not only support the branches but also serve as junctions in the thermal conduction network. Remarkably, the composite achieves a thermal conductivity of 11.08 W/(m·K) with just an 11.1 wt% CF content and a 1.86 g/cm3 density. This study expands the methodologies for achieving highly oriented configurations of fibrous and flake materials, which provides a new design idea for preparing high-thermal conductivity and low-density thermal interface materials.

Unstructured Self-Assembled Molecular Lamella Induces Ultrafast Thermal Transfer through a Cathode/Separator Interphase in Lithium-Ion Batteries

Thermal issues associated with lithium-ion batteries (LIBs) can dramatically affect their life cycle and overall performance. However, the effective heat transfer is deeply restrained by the high thermal resistance across the cathode (lithium cobalt oxide, LCO)-separator (polyethylene, PE) interface. This work presents a new approach to tailoring the interfacial thermal resistance, namely, unstructured self-assembled lamella (USAL). Compared to the popular self-assembled monolayers, although the USAL gives a redundant interface and amorphous molecule patterns, it can also provide many benefits, including easy assembly, more thermal bridges, and ready pressurization. Three small organic molecules (SOMs) were assembled into an LCO-PE interface, providing unique functional groups, -NH₂, -SH, and -CH₃, to illustrate its energy conversion efficiency. Through molecular dynamics simulations, our results show that the USAL can facilitate interfacial heat transfer remarkably. A 3-aminopropyl trimethoxysilane (APTMS)-coated LCO-PE system with 11.4 Å thickness demonstrates the maximum enhancement of thermal conductance, about 320% of the pristine system. Such enhancement is attributed to the developed double heat passages by strong non-bonded interactions across LCO-SOM and PE-SOM interfaces, a tuned temperature field, and high compatibility between SOMs and PE. Importantly, due to SOMs' amorphous morphology, the pressure can be imposed and further enhance the interfacial heat transfer. Results show the improved thermal conductance rises the most for the APTMS-coated LCO-PE system with 11.4 Å thickness at 10 GPa, almost 685% higher than that of the pristine system. The high efficiency of heat transfer comes as a result of the enhanced binding strength across the LCO-SOM and SOM-PE interface, the reduced phonon scattering in PE and SOMs, and the high LCO stiffness. These investigations are expected to provide a new perspective for modulating the heat transfer across the interphase of LIBs and achieve more effective thermal management for the multi-material system.

Thermal and Thermoelectric Properties of SAM-Based Molecular Junctions

In molecular thermoelectrics, the thermopower of molecular junctions is closely interlinked with their thermal properties; however, the detailed relationship between them remains uncertain. This study systematically investigates the thermal properties of self-assembled monolayer (SAM)-based molecular junctions and relates them to the thermoelectric performance of the junctions. The electrode temperatures for the bare AuTS, AuTS/EGaIn, and AuTS/TPT SAM//Ga2O3/EGaIn samples placed on a hot chuck were measured under different conditions, such as air vs vacuum and the presence and absence of thermal grease, which generates a heat conduction channel from a hot chuck to gold. It was revealed that the SAM was the most efficient thermal resistor, which was responsible for the creation of a temperature differential (ΔT) across the junction; ΔT in an air atmosphere is overestimated to some extent, and air mainly contributes to large dispersions of thermovoltage (ΔV) data. While junction measurements in air were possible at low ΔT (up to 13 K), the new optimal condition, under a vacuum and with thermal grease, allowed us to examine a wide temperature range up to ΔT = 40 K and obtain a more reliable Seebeck coefficient (S, μV/K). The value of S under the new condition was ∼1.4 times higher than that measured in air without thermal grease. Our study shows the potential of liquid-metal-based junctions to reliably investigate heat conduction across nanometer-thick organic films and elaborates on how the thermal properties of molecular junctions affect their thermoelectric performance.

Thermally Insulating Nanocellulose-Based Materials

Thermally insulating materials based on renewable nanomaterials such as nanocellulose could reduce the energy consumption and the environmental impact of the building sector. Recent reports of superinsulating cellulose nanomaterial (CNM)-based aerogels and foams with significantly better heat transport properties than the commercially dominating materials, such as expanded polystyrene, polyurethane foams, and glass wool, have resulted in a rapidly increasing research activity. Herein, the fundamental basis of thermal conductivity of porous materials is described, and the anisotropic heat transfer properties of CNMs and films with aligned CNMs and the processing and structure of novel CNM-based aerogels and foams with low thermal conductivities are presented and discussed. The extraordinarily low thermal conductivity of anisotropic porous architectures and multicomponent approaches are highlighted and related to the contributions of the Knudsen effect and phonon scattering.

Modulation of Interfacial Thermal Transport between Fumed Silica Nanoparticles by Surface Chemical Functionalization for Advanced Thermal Insulation

Since solid-state heat transport in a highly porous nanocomposite strongly depends on the thermal boundary conductance (TBC) between constituent nanomaterials, further suppression of the TBC is important for improving performance of thermal insulators. Here, targeting a nanocomposite fabricated by stamping fumed silica nanoparticles, we perform a wide variety of surface functionalizations on fumed silica nanoparticles by a silane coupling method and investigate the impact on the thermal conductivity (K_m). The K_m of the silica nanocomposite is approximately 20 and 9 mW/m/K under atmospheric and vacuum conditions at the material density of 0.2 g/cm³ without surface functionalization, respectively, and the experimental results indicate that the K_m can be modulated depending on the chemical structure of molecules. The surface modification with a linear alkyl chain of optimal length significantly suppresses K_m by approximately 30%, and the suppression can be further enhanced to approximately 50% with an infrared opacifier. The magnitude of suppression was found to sensitively depend on the length of the terminal chain. The magnitude is also related to the number of reactive silanol groups in the chemical structure, where the surface modification with fluorocarbon gives the largest suppression. The surface hydrophobization merits thermal insulation through significant suppression of the TBC, presumably by reducing the water molecules that otherwise would serve as heat conduction channels at the interface. On the other hand, when the chain length is long, the suppression is counteracted by the enhanced phonon transmission through the silane coupling molecules that grow with the chain length. This is supported by the analytical model and present simulation results, leading to prediction of the optimal chemical structure for better thermal insulation.

Cross-Plane Thermal Conductance of Phosphonate-Based Self-Assembled Monolayers and Self-Assembled Nanodielectrics

Self-assembled nanodielectrics (SANDs) consist of alternating layers of polarized phosphonate-functionalized azastibazolium π-electron (PAE) and high-k dielectric metal oxide (ZrO₂ or HfO_x) films. SANDs are desirable gate dielectrics materials for thin-film transistor applications because of their excellent properties such as low-temperature fabrication, large dielectric strength, and large capacitance. In this paper, we investigate the cross-plane thermal boundary conductance of SANDs using the frequency domain thermoreflectance (FDTR) technique. First, we characterize the thermal conductance of PAE self-assembled monolayers (SAMs), inverted-PAE (IPAE) SAMs, and mixed PAE-IPAE SAMs, sandwiched between thin gold and silica (SiO₂) films at the top and bottom surfaces. Next, we quantify the thermal conductance of SAND-n with different numbers (n) of PAE-ZrO₂ layers and thicknesses ranging between 4.7 and 11.3 nm. From the FDTR measurements, we observe that the thermal boundary conductance of the SAMs can be tuned between 42.1 ± 4.6 MW/(m² K) and 52.4 ± 2.5 MW/(m² K), based on the relative density of the PAE and IPAE chromophores. In the SAND-n samples, we observe a monotonic decrease in the thermal conductance with increasing n. We use the measured thermal conductance data in a series resistance model to estimate a thermal interface conductance of 695 MW/(m² K) for the contact between the PAE chromophore and the zirconium dioxide films, which is an order of magnitude larger than the SAMs. We attribute the improved thermal conductance to stronger adhesion between the PAE chromophore and the zirconium dioxide films, as compared to the weakly bonded SAMs to the gold and silicon dioxide films.