Mechanisms of Adhesive Micropatterning of Functional Colloid Thin Layers

Simple, Fast, and Scalable Reverse-Offset Printing of Micropatterned Copper Nanowire Electrodes with Sub-10 μm Resolution

Copper nanowires (CuNWs) possess key characteristics for realizing flexible transparent electronics. High-quality CuNW micropatterns with high resolution and uniform thickness are required to realize integrated transparent electronic devices. However, patterning high-aspect-ratio CuNWs is challenging because of their long length, exceeding the target pattern dimension. This work reports a novel reverse-offset printing technology that enables the sub-10 μm high-resolution micropatterning of CuNW transparent conducting electrodes (TCEs). The CuNW ink for reverse-offset printing was formulated to control viscoelasticity, cohesive force, and adhesion by adjusting the ligands, solvents, surface energy modifiers, and leveling additives. An inexpensive commercial adhesive handroller achieved a simple, fast, and scalable micropatterning of CuNW TCEs. Easy production of high-quality CuNW micropatterns with various curvatures and shapes was possible, regardless of the printing direction. The reverse-offset-printed CuNW micropatterns exhibited a minimum of 7 μm line width and excellent pattern qualities such as fine line spacing, sharp edge definition, and outstanding pattern uniformity. In addition, they exhibited excellent sheet resistance, high optical transparency, outstanding mechanical durability, and long-term stability. Flexible light-emitting diode (LED) circuits, transparent heaters, and organic LEDs (OLEDs) can be fabricated using high-resolution reverse-offset-printed CuNW micropatterns for applications in flexible transparent electronic devices.

Multifunctional Structured Platforms: From Patterning of Polymer-Based Films to Their Subsequent Filling with Various Nanomaterials

There is an astonishing number of optoelectronic, photonic, biological, sensing, or storage media devices, just to name a few, that rely on a variety of extraordinary periodic surface relief miniaturized patterns fabricated on polymer-covered rigid or flexible substrates. Even more extraordinary is that these surface relief patterns can be further filled, in a more or less ordered fashion, with various functional nanomaterials and thus can lead to the realization of more complex structured architectures. These architectures can serve as multifunctional platforms for the design and the development of a multitude of novel, better performing nanotechnological applications. In this work, we aim to provide an extensive overview on how multifunctional structured platforms can be fabricated by outlining not only the main polymer patterning methodologies but also by emphasizing various deposition methods that can guide different structures of functional nanomaterials into periodic surface relief patterns. Our aim is to provide the readers with a toolbox of the most suitable patterning and deposition methodologies that could be easily identified and further combined when the fabrication of novel structured platforms exhibiting interesting properties is targeted.

Micro-transfer patterning of dense nanoparticle layers: roles of rheology, adhesion and fracture in transfer dynamics

Liquid inks deposited on substrates undergo spreading, coalescence, dewetting and subsequent drying kinetics, which limit the controllability of the cross-sectional shape and resolution of the printed patterns. By contrast, when the ink layers are previously semidried (highly-concentrated) and patterned on a polydimethylsiloxane sheet, single-micrometer features are resolved. Here we present the rheological, fracture and adhesive properties of semidried nanoparticle dispersion ink layers, which optimize the patterning of reverse offset printing with 5 μm spatial resolution. Under the appropriate patterning conditions, when the volume fraction φ of the particles in the semidried layers was approximately 46 v/v%, the layer elasticity was dominant in the linear viscoelastic region and a Burgers-type creeping property appeared. Under tensile strain, the semidried layers suddenly fractured at the sites of patterns with sharply defined sidewalls. In the semidried thin layers dominated by viscosity (lower φ), the pattern edges were degraded owing to local transfer instability and possible subsequent spreading. Over-drying reduced the adhesiveness of the ink layers, implying an upper limit of φ for successful patterning. The characteristics of semidried inks contribute to establishing a versatile ink-formulation scheme of various functional nanomaterials for high-resolution printed applications.