Synthesis of Sandwich-Like Nanostructure Fillers and Their Use in Different Types of Thermal Composites

Fabrication of thermally conductive polymer composites based on hexagonal boron nitride: recent progresses and prospects

Hexagonal boron nitride (h-BN) and its nanomaterials are among the most promising candidates for use in thermal management applications because of their high thermal conductivity, thermal stability, and good electric insulation, and when used as the conductive fillers, they enhance the overall properties of polymer composites. In this review, the basic concepts of h-BN are introduced, followed by the synthesis of BN nanotubes and BN nanosheets. Then, various novel methods to fabricate h-BN polymer composites with improved thermally conductive paths are discussed. They can be classified into two categories: dispersion and compatibility reinforced and structure formation. In addition, the thermal conducting mechanisms of h-BN composites are proposed. Finally, the advantages and limitations of aforementioned strategies are summarized.

Highly Thermal Conductive Poly(vinyl alcohol) Composites with Oriented Hybrid Networks: Silver Nanowire Bridged Boron Nitride Nanoplatelets

With the increasing demand for thermal management materials in the highly integrated electronics area, building efficient heat-transfer networks to obtain advanced thermally conductive composites is of great significance. In the present work, highly thermally conductive poly(vinyl alcohol) (PVA)/boron nitride nanoplatelets@silver nanowires (BNNS@AgNW) composites were fabricated via the combination of the electrospinning and the spraying technique, followed by a hot-pressing method. BNNS are oriented along the in-plane direction, while AgNWs with a high aspect ratio can help to construct a thermal conductive network effectively by bridging BNNS in the composites. The PVA/BNNS@AgNW composites showed high in-plane thermal conductivity (TC) of 10.9 W/(m·K) at 33 wt % total fillers addition. Meanwhile, the composite shows excellent thermal dispassion capability when it is taken as a thermal interface material of a working light-emitting diode (LED) chip, which is certified by capturing the surface temperature of the LED chip. In addition, the out-of-plane electrical conductivity of the composites is below 10^-12 S/cm. The composites with outstanding thermal conductive and electrical insulating properties hold promise for application in electrical packaging and thermal management.

Highly thermally conductive and eco-friendly OH-h-BN/chitosan nanocomposites by constructing a honeycomb thermal network

More than 110,000,000 tons of mismanaged plastics were to be produced in 2020. Polymers are favored in the preparation of thermally conductive materials due to their excellent comprehensive properties. However, most polymers fabricated for thermally conductive materials are difficult to degrade in the natural environment. To alleviate the increasingly severe environmental problems, we reported a novel eco-friendly material with high thermal conductivity, which was composited of chitosan microspheres (CSM) and hydroxyl-functionalized hexagonal boron nitride (OH-h-BN) nanoplatelets. Utilizing their significant difference in scales, the OH-h-BN nanoplatelets were arranged between each CSM. Their overall structure was similar to the honeycomb: CSM were honeycomb cores, and OH-h-BN nanoplatelets were honeycomb network. The routine-structure OH-h-BN/CS nanocomposites were only 0.94 ± 0.02 W·m^-1·K^-1 at 50 wt% in thermal conductivity. However, the OH-h-BN/CSM nanocomposites with honeycomb structure can reach 5.66 ± 0.32 W·m^-1·K^-1 in the same loading, for enhancement of 502% and 1914% than OH-h-BN/CS nanocomposites and pure CS, respectively.

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs.

Desolvation-Triggered Versatile Transfer-Printing of Pure BN Films with Thermal-Optical Dual Functionality

Although hexagonal boron nitride (BN) nanostructures have recently received significant attention due to their unique physical and chemical properties, their applications have been limited by a lack of processability and poor film quality. In this study, a versatile method to transfer-print high-quality BN films composed of densely stacked BN nanosheets based on a desolvation-induced adhesion switching (DIAS) mechanism is developed. It is shown that edge functionalization of BN sheets and rational selection of membrane surface energy combined with systematic control of solvation and desolvation status enable extensive tunability of interfacial interactions at BN-BN, BN-membrane, and BN-substrate boundaries. Therefore, without incorporating any additives in the BN film and applying any surface treatment on target substrates, DIAS achieves a near 100% transfer yield of pure BN films on diverse substrates, including substrates containing significant surface irregularities. The printed BNs demonstrate high optical transparency (>90%) and excellent thermal conductivity (>167 W m^-1 K^-1) for few-micrometer-thick films due to their dense and well-ordered microstructures. In addition to outstanding heat dissipation capability, substantial optical enhancement effects are confirmed for light-emitting, photoluminescent, and photovoltaic devices, demonstrating their remarkable promise for next-generation optoelectronic device platforms.

Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties

The effective dissipation of heat is critical to the performance and longevity of high-power electronics, so it is important to prepare highly thermally conductive polymer-based packaging materials for efficient thermal management. Due to the excellent thermal conductivity of boron nitride nanosheets (BNNSs), the hexagonal boron nitride (hBN) powder was dissolved in a mixed solution of isopropanol and deionized water for ultrasonic exfoliation to obtain hydroxylated BN nanosheets. Then, the prepared BNNS was functionalized with (3-aminopropyl)triethoxysilane (APTES) to enhance its dispersibility and interfacial compatibility in the epoxy resin, which play an important role in the improvement of the thermal conductivity of the composites. Finally, APTES-BNNS was uniformly dispersed in the epoxy resin by solvent mixing, and the oriented APTES-BNNS/epoxy composites were prepared through spin-coating and hot-pressing methods. It was found that APTES-BNNS/epoxy composites prepared herein exhibited significant anisotropic thermal conductivity. The results show that the thermal conductivity of APTES-BNNS/epoxy composites reached 5.86 W/mK at a filler content of 40 wt % and these composites have favorable thermal stability and mechanical properties. The APTES-BNNS/epoxy composite prepared in this paper has excellent thermal management capability and can be applied to the packaging of high-power electronic devices.