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Xu L, Zhou X, Zhao F, Fu Y, Tang L, Zeng Y, Chen G, Wu C, Wang L, Chen Q, Yang K, Sun D, Hai Z. Rapid laser fabrication of indium tin oxide and polymer-derived ceramic composite thin films for high-temperature sensors. J Colloid Interface Sci 2024; 658:913-922. [PMID: 38157615 DOI: 10.1016/j.jcis.2023.12.119] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/24/2023] [Revised: 11/29/2023] [Accepted: 12/19/2023] [Indexed: 01/03/2024]
Abstract
Thin-film sensors are essential for real-time monitoring of components in high-temperature environments. Traditional fabrication methods often involve complicated fabrication steps or require prolonged high-temperature annealing, limiting their practical applicability. Here, we present an approach using direct ink writing and laser scanning (DIW-LS) to fabricate high-temperature functional thin films. An indium tin oxide (ITO)/preceramic polymer (PP) ink suitable for DIW was developed. Under LS, the ITO/PP thin film shrank in volume. Meanwhile, the rapid pyrolysis of PP into amorphous precursor-derived ceramic (PDC) facilitated the faster sintering of ITO nanoparticles and improved the densification of the thin film. This process realized the formation of a conductive network of interconnected ITO nanoparticles. The results show that the ITO/PDC thin film exhibits excellent stability, with a drift rate of 4.7 % at 1000 °C for 25 h, and withstands temperatures up to 1250 °C in the ambient atmosphere. It is also sensitive to strain, with a maximum gauge factor of -6.0. As a proof of concept, we have used DIW-LS technology to fabricate a thin-film heat flux sensor on the surface of the turbine blade, capable of measuring heat flux densities over 1 MW/m2. This DIW-LS process provides a viable approach for the integrated, rapid, and flexible fabrication of thin film sensors for harsh environments.
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Affiliation(s)
- Lida Xu
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Xiong Zhou
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Fuxin Zhao
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Yanzhang Fu
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Lantian Tang
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Yingjun Zeng
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Guochun Chen
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Chao Wu
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Lingyun Wang
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Qinnan Chen
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Kai Yang
- China Aerodynamics Research and Development Center, Mianyang 621000, China.
| | - Daoheng Sun
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China.
| | - Zhenyin Hai
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China.
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Winnicki M, Wiatrowski A, Mazur M. High Power Impulse Magnetron Sputtering of In 2O 3/Sn Cold Sprayed Composite Target. MATERIALS (BASEL, SWITZERLAND) 2021; 14:1228. [PMID: 33807798 PMCID: PMC7961378 DOI: 10.3390/ma14051228] [Citation(s) in RCA: 7] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 02/01/2021] [Revised: 02/23/2021] [Accepted: 03/02/2021] [Indexed: 11/17/2022]
Abstract
High Power Impulse Magnetron Sputtering (HiPIMS) was used for deposition of indium tin oxide (ITO) transparent thin films at low substrate temperature. A hybrid-type composite target was self-prepared by low-pressure cold spraying process. Prior to spraying In2O3 and oxidized Sn powders were mixed in a volume ratio of 3:1. Composite In2O3/Sn coating had a mean thickness of 900 µm. HiPIMS process was performed in various mixtures of Ar:O2: (i) 100:0 vol.%, (ii) 90:10 vol.%, (iii) 75:25 vol.%, (iv) 50:50 vol.%, and (v) 0:100 vol.%. Oxygen rich atmosphere was necessary to oxidize tin atoms. Self-design, simple high voltage power switch capable of charging the 20 µF capacitor bank from external high voltage power supply worked as a power supply for an unbalanced magnetron source. ITO thin films with thickness in the range of 30-40 nm were obtained after 300 deposition pulses of 900 V and deposition time of 900 s. The highest transmission of 88% at λ = 550 nm provided 0:100 vol. % Ar:O2 mixture, together with the lowest resistivity of 0.03 Ω·cm.
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Affiliation(s)
- Marcin Winnicki
- Department of Metal Forming, Welding and Metrology, Wrocław University of Science and Technology, Lukasiewicza 5, 50-371 Wroclaw, Poland
| | - Artur Wiatrowski
- Department of Microelectronics and Nanotechnology, Wrocław University of Science and Technology, Janiszewskiego 11/17, 50-372 Wroclaw, Poland; (A.W.); (M.M.)
| | - Michał Mazur
- Department of Microelectronics and Nanotechnology, Wrocław University of Science and Technology, Janiszewskiego 11/17, 50-372 Wroclaw, Poland; (A.W.); (M.M.)
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