Sintering Mechanism of a Supersaturated Ag-Cu Nanoalloy Film for Power Electronic Packaging

Centrifugation-induced assembly of dense hotspots based SERS substrate for enhanced Raman scattering and quenched fluorescence

Hanging (aggregation stuck to the centrifugal tube) in the centrifugation process is always regarded as an unwanted condition. In this work, we develop a centrifugation-induced assembly of dense hotspots surface-enhanced Raman scattering (SERS) substrates from the hanging phenomenon. We discovered interesting sintering-resistant behavior (maintain the sharp nanotip features) of star-like Au nanoparticles after centrifugation-induced assembly, which is in stark contrast with the sintering phenomenon of sphere-like nanoparticles. We also found that one side of centrifugal-induced Au assemblies is two-dimensional (2D, root mean square (rms) roughness down to ∼10 nm), while the other is three-dimensional (3D, rms roughness more than 100 nm). The close-packed feature of the Au assemblies makes them candidates as dense hotspots based SERS substrates. Through systematic investigation of SERS performance of centrifugation-induced assemblies with different morphology (star-like and sphere-like, 2D and 3D), it was found that the 3D side of star-like Au nanoparticles assembly exhibits the highest SERS enhancement together with quenched fluorescence. The star-like SERS substrate also displays high detection uniformity (with 10^-7M Rhodamine 6G) and a low detection limit (down to 10^-12M Rhodamine 6G).

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb₉₅Sn₅ solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.