Peel Adhesion Strength between Epoxy Resin and Hydrated Silica Surfaces: A Density Functional Theory Study

Effects of Curing Agents on the Adhesion of Epoxy Resin to Copper: A Density Functional Theory Study

Epoxy resins are widely used adhesives in industrial fields. To use epoxy resin as an adhesive, it is necessary to mix the epoxy resin with a hardener. Hardeners have various functional groups and skeletons, and the properties of epoxy resins vary depending on the hardener. Although the adhesion of epoxy resins has been extensively studied using density functional theory (DFT) calculations, few studies have evaluated the effect of hardener molecules. Therefore, in this study, DFT calculations of adhesion energies and bonding structures on Cu (111) and Cu2O (111) surfaces are performed for model molecules of adducts of epoxy resin with hardeners having various functional groups and skeletons to evaluate the influence of the hardeners on the adhesion of epoxy resin to the metal surface. The adhesion energy to the Cu (111) surface is governed by the energy due to dispersion forces. Hardeners of the thiol type, which contain relatively heavy sulfur atoms, and hardeners with aromatic rings, displaying high planarity, enable the entire molecule to approach the metal surface, resulting in a relatively high adhesion strength. The calculations for the Cu2O (111) surface show the adhesion strength is more strongly influenced by interactions such as hydrogen bonds between the surface and adhesive molecules than by dispersion forces. Therefore, in adhesion to Cu2O (111), the benzylamine-epoxy adduct with hydrogen bonding and OH-π interactions with the surface, in addition to having a relatively flexible framework, shows a high adhesion strength.

Elucidating the Effects of Chemisorbed Water Molecules on the Adhesive Interactions of Epoxy Resin to γ-Alumina Surfaces

The adhesion mechanism of epoxy resin to the γ-alumina (110) surface was investigated using first-principles density functional theory (DFT). Aluminum materials are lightweight and are used in a wide range of industrial fields. Its surface is oxidized to alumina, and the stable surface is known as the γ-alumina (110) surface. The coverage of hydroxy groups by chemisorbed water molecules on this surface varied depending on the pretreatment temperature. In this study, we investigated the adhesive interactions of epoxy resin on four alumina surfaces with different densities of surface hydroxy groups (0, 3, 6, and 9 OH/nm2) and have discussed their effects. At each interface, the energy curves of the vertically displaced epoxy resin were calculated and the adhesive forces were estimated by differentiating these curves. As the coverage of the surface hydroxy groups increased from 0 to 6 OH/nm2, the adhesive strength gradually decreased. However, the adhesive strength at 9 OH/nm2 was relatively large and almost equal to that at 3 OH/nm2. This inverse volcano-type behavior was analyzed via the decomposition of adhesive forces and the crystal orbital Hamilton population (COHP). The decomposition of adhesive forces into DFT and dispersion components revealed that the inverse volcano-type behavior is derived from the DFT component, and the interfacial interactions owing to the DFT component are accompanied by charge transfer. These were investigated using a COHP analysis, which revealed that this behavior was caused by changes in the activity of the aluminum atoms on the surface and surface reconstruction by chemisorbed water molecules. It is noteworthy that the adhesive strength for 9 OH/nm2 was only 6.9% lower than that for 0 OH/nm2 wherein the chemisorbed water molecules were completely removed from the surface. These results are expected to provide a guideline for the adhesion of epoxy resin to aluminum materials.

Molecular Understanding of Adhesion of Epoxy Resin to Graphene and Graphene Oxide Surfaces in Terms of Orbital Interactions

The adhesion mechanism of epoxy resin (ER) cured material consisting of diglycidyl ether of bisphenol A (DGEBA) and 4,4'-diaminodiphenyl sulfone (DDS) to pristine graphene and graphene oxide (GO) surfaces is investigated on the basis of first-principles density functional theory (DFT) with dispersion correction. Graphene is often used as a reinforcing filler incorporated into ER polymer matrices. The adhesion strength is significantly improved by using GO obtained by the oxidation of graphene. The interfacial interactions at the ER/graphene and ER/GO interfaces were analyzed to clarify the origin of this adhesion. The contribution of dispersion interaction to the adhesive stress at the two interfaces is almost identical. In contrast, the DFT energy contribution is found to be more significant at the ER/GO interface. Crystal orbital Hamiltonian population (COHP) analysis suggests the existence of hydrogen bonding (H-bonding) between the hydroxyl, epoxide, amine, and sulfonyl groups of the ER cured with DDS and the hydroxyl groups of the GO surface, in addition to the OH-π interaction between the benzene rings of ER and the hydroxyl groups of the GO surface. The H-bond has a large orbital interaction energy, which is found to contribute significantly to the adhesive strength at the ER/GO interface. The overall interaction at the ER/graphene is much weaker due to antibonding type interactions just below the Fermi level. This finding indicates that only dispersion interaction is significant when ER is adsorbed on the graphene surface.

Effects of Moisture Diffusion on a System-in-Package Module by Moisture-Thermal-Mechanical-Coupled Finite Element Modeling

Epoxy molding compounds (EMCs) are commonly used in electronic products for chip encapsulation, but the moisture absorption of EMC can induce significant reliability challenges. In this study, the effects of hygrothermal conditions and structure parameters on moisture diffusion and the consequent influences (such as moisture content on die surfaces and stress distribution) on a system-in-package module have been systematically investigated by moisture-thermal-mechanical-coupled modeling. Hygroscopic tests were carried out on a new commercial EMC at 60 °C/60% RH and 85 °C/85% RH, followed by evaluations of diffusion coefficients by Fick's law. It was found that the moisture diffusion coefficients and saturation concentrations at 85 °C/85% RH were higher than those at 60 °C/60% RH. From the modeling, it was found that the consequent maximum out-of-plane deformation and stress of the module at 85 °C/85% RH were both higher than those at 60 °C/60% RH. Influences of thicknesses of EMC and PCB on the moisture diffusion behavior have also been studied for design optimization. It was found that the maximum moisture concentration on die surfaces and resultant stress increased notably with thinner PCB, whereas the effects of EMC thickness were limited. This can be attributed to the comparison between the thicknesses of EMC and PCB and the shortest existing diffusion path within the module. These findings can provide helpful insights to the design optimization of electronic modules for hygrothermal conditions.

Shear adhesive strength between epoxy resin and copper surfaces: a density functional theory study

Shear adhesive strengths of epoxy resin for copper and copper oxide surfaces are estimated based on quantum chemical calculations. Shear adhesion has periodicity, and its origin is revealed.