Electromagnetic Interference Shielding Performances of Carbon-Fiber-Reinforced PA11/PLA Composites in the X-Band Frequency Range

Electrophysical Characteristics of Acrylonitrile Butadiene Styrene Composites Filled with Magnetite and Carbon Fiber Fillers

With the rapid development of wireless communication technologies and the miniaturization trend in the electronics industry, the reduction of electromagnetic interference has become an important issue. To solve this problem, a lot of attention has been focused on polymer composites with combined functional fillers. In this paper, we report a method for creating an acrylonitrile butadiene styrene (ABS) plastic composite with a low amount of conductive carbon and magnetic fillers preparation. Also, we investigate the mechanical, thermophysical, and electrodynamic characteristics of the resulting composites. Increasing the combined filler amount in the ABS composite from 1 to 5 wt % leads to a composite conductivity growth of almost 50 times. It is necessary to underline the temperature decrease of 5 wt % mass loss and, accordingly, the composite heat resistance reduction with an increase in the combined filler from 1 to 5 wt %, while the thermal conductivity remains almost constant. It was established that electrodynamic and physical-mechanical characteristics depend on the agglomeration of fillers. This work is expected to reveal the potential of combining commercially available fillers to construct effective materials with good electromagnetic interference (EMI) protection using mass production methods (extrusion and injection molding).

Exploring the Potential of Sustainable Biopolymers as a Shield against Electromagnetic Radiations

The increasing demand for biodegradable and environmentally friendly materials is shifting the focus from traditional polymer composites to biocomposites in various applications, especially in electromagnetic shielding. Effective utilization of biopolymers demands improved properties and can be achieved to a certain extent by functionalization. Biopolymers such as cellulose, polylactic acid, and starch are some of the potential candidates for mitigating electromagnetic pollution in next-generation electronic devices because of their high aspect ratio, flexibility, light weight, high mechanical strength, thermal stability, and tunable microwave absorption to the electromagnetic interference (EMI) shielding composites. This Review provides an overview of the current advancements in EMI shielding materials and outlines recent research on EMI shielding composites that utilize various biodegradable polymer structures.

Microwave-assisted ZnO-decorated carbon urchin resembling 'shish-kebab' morphology with self-healing and enhanced electromagnetic shielding properties

Herein, inspired by Acacia auriculiformis fruit, the shish-kebab-like growth of ZnO on carbon urchin (ZnO@CU) was designed using microwave radiation, thus leading to a hierarchal 3D structure that can promote multiple internal reflections through polarization centers. This hierarchal structure was then dispersed in a designer polyetherimide (PEI) matrix containing dynamic covalent bonds that can undergo metathesis, triggered by temperature, to harness self-healing properties in the composite. Such key attributes are required for their potential use in EMI shielding applications where frequent repairs are indispensable. Morphological investigation revealed that the ZnO flower was periodically nucleated like 'shish-kebab' structures on CU surfaces. CU was designed from short carbon fibers using a facile modified method. The EMI shielding performance of the resulting composites was investigated in the X-band, illustrating a shielding effectiveness of -40.6 dB for 2 wt% of ZnO@CU loading, and the composite can be preserved after the self-healing procedure. The ZnO 'kebabs' on 'CU shish' facilitated multiple scattering and numerous polarization centers to improve the EMI shielding performances at extremely low filler contents. In addition, the mechanical and thermal properties of the composite showed improved structural integrity and superior resistance to extreme temperatures, respectively. Overall, the proposed ZnO@CU/PEI composite has great potential to fulfill the increasing demands for lightweight EMI shielding materials in many fields.