1
|
Lu J, Zhang S, Zhang L, Wang C, Min C. Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials. MATERIALS (BASEL, SWITZERLAND) 2023; 16:ma16103768. [PMID: 37241395 DOI: 10.3390/ma16103768] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/19/2023] [Revised: 05/07/2023] [Accepted: 05/15/2023] [Indexed: 05/28/2023]
Abstract
With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO2 hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm-1 k-1, the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa.
Collapse
Affiliation(s)
- Jiadong Lu
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Songli Zhang
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Leizhi Zhang
- School of Civil Engineering, Southeast University, Nanjing 211189, China
| | - Chenxi Wang
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| | - Chunying Min
- School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China
| |
Collapse
|
2
|
A novel bisphenol A‐free polyarylates synthesis strategy: 4,4′‐sulfobisphenol/2,2‐bis(4‐hydroxyphenyl)butane co‐polyarylate prepared by interfacial polymerization. JOURNAL OF POLYMER SCIENCE 2023. [DOI: 10.1002/pol.20230011] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 03/04/2023]
|
3
|
Hanson KG, Lin CH, Abu-Omar MM. Crosslinking of renewable polyesters with epoxides to form bio-based epoxy thermosets. POLYMER 2022. [DOI: 10.1016/j.polymer.2021.124363] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
|
4
|
Meng H, Zhang Q, Lu M, Qu Z, Chen B, Xu CA, Lu M. Cure kinetics and properties of high-performance epoxy thermosets cured with active ester-terminated poly (aryl ether ketone). HIGH PERFORM POLYM 2021. [DOI: 10.1177/09540083211009572] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]
Abstract
Benzene-1,3,5-triyl tribenzoate (TBB), both 3,5-bis(benzoyloxy)benzoate-terminated poly (aryl ether ketone) oligomers (BPAPK and TMPK), containing active ester (Ph−O−(C=O)− structure), were prepared and served as curing agents for dicyclopentadiene novoalc epoxy (DCPD). The curing kinetics and properties of three epoxy thermosets were systematically investigated. The model reaction of TBB and glycidyl phenyl ether was designed to understand the curing mechanism of oxirane ring with active ester. TMPK/DCPD displays the lowest reaction activation energy, which is the result of the combined influence of free volume and diffusion. In addition, TMPK/DCPD has the highest Tg value (218°C), which enhances 34.6% and 42.5% compared with BPAPK/DCPD and TBB/DCPD, respectively. Meanwhile, TMPK/DCPD also shows superior dielectric and water resistance properties due to no secondary alcohol generated after curing and hydrophobic tetramethyl-substituted biphenyl structure. Herein, TMPK/DCPD as high-performance epoxy thermosets has potential applications in electronic packaging fields.
Collapse
Affiliation(s)
- Huifa Meng
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, People’s Republic of China
- University of Chinese Academy of Sciences, Beijing, People’s Republic of China
- Guangdong Provincial Key Laboratory of Organic Polymer Materials for Electronics, Guangzhou, People’s Republic of China
| | - Qian Zhang
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, People’s Republic of China
- University of Chinese Academy of Sciences, Beijing, People’s Republic of China
- Guangdong Provincial Key Laboratory of Organic Polymer Materials for Electronics, Guangzhou, People’s Republic of China
| | - Maoping Lu
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, People’s Republic of China
- University of Chinese Academy of Sciences, Beijing, People’s Republic of China
| | - Zhencai Qu
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, People’s Republic of China
- University of Chinese Academy of Sciences, Beijing, People’s Republic of China
- CAS Engineering Laboratory for Special Fine Chemicals, Guangzhou, People’s Republic of China
| | - Bing Chen
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, People’s Republic of China
- University of Chinese Academy of Sciences, Beijing, People’s Republic of China
- CASH GCC (Nanxiong) Research Institute of New Materials Co., Ltd, Guangzhou, People’s Republic of China
| | - Chang-an Xu
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, People’s Republic of China
- University of Chinese Academy of Sciences, Beijing, People’s Republic of China
- CASH GCC (Nanxiong) Research Institute of New Materials Co., Ltd, Guangzhou, People’s Republic of China
| | - Mangeng Lu
- Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, People’s Republic of China
- University of Chinese Academy of Sciences, Beijing, People’s Republic of China
- Guangdong Provincial Key Laboratory of Organic Polymer Materials for Electronics, Guangzhou, People’s Republic of China
| |
Collapse
|
5
|
Zu L, Li J, Gao B, Pan Z, Wang J, Liu W, Zegaoui A, Dayo AQ. Studies on the curing behavior, thermal, and mechanical properties of epoxy resin‐co‐amine‐functionalized lead phthalocyanine. J Appl Polym Sci 2020. [DOI: 10.1002/app.48983] [Citation(s) in RCA: 4] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/28/2023]
Affiliation(s)
- Li‐Wu Zu
- Key Laboratory of Superlight Material and Surface Technology of Ministry of EducationCollege of Materials Science and Chemical Engineering, Harbin Engineering University Harbin China
- College of Materials Science and Engineering of Qiqihar University, Heilongjiang Province Key Laboratory of Polymeric Composites Qiqihar China
| | - Ji‐dong Li
- College of Materials Science and Engineering of Qiqihar University, Heilongjiang Province Key Laboratory of Polymeric Composites Qiqihar China
| | - Bao‐Chang Gao
- Key Laboratory of Superlight Material and Surface Technology of Ministry of EducationCollege of Materials Science and Chemical Engineering, Harbin Engineering University Harbin China
| | - Zhong‐Cheng Pan
- Key Laboratory of Superlight Material and Surface Technology of Ministry of EducationCollege of Materials Science and Chemical Engineering, Harbin Engineering University Harbin China
| | - Jun Wang
- Key Laboratory of Superlight Material and Surface Technology of Ministry of EducationCollege of Materials Science and Chemical Engineering, Harbin Engineering University Harbin China
| | - Wen‐Bin Liu
- Key Laboratory of Superlight Material and Surface Technology of Ministry of EducationCollege of Materials Science and Chemical Engineering, Harbin Engineering University Harbin China
| | - Abdeldjalil Zegaoui
- Key Laboratory of Superlight Material and Surface Technology of Ministry of EducationCollege of Materials Science and Chemical Engineering, Harbin Engineering University Harbin China
| | - Abdul Qadeer Dayo
- Key Laboratory of Superlight Material and Surface Technology of Ministry of EducationCollege of Materials Science and Chemical Engineering, Harbin Engineering University Harbin China
- Department of Chemical EngineeringBalochistan University of Information Technology, Engineering and Management Sciences Quetta Pakistan
| |
Collapse
|
6
|
Wang P, Chen L, Xiao H, Zhan T. Nitrogen/sulfur-containing DOPO based oligomer for highly efficient flame-retardant epoxy resin. Polym Degrad Stab 2020. [DOI: 10.1016/j.polymdegradstab.2019.109023] [Citation(s) in RCA: 61] [Impact Index Per Article: 15.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
|
7
|
Kim HG, Lee HR, Lim CS, Seo B. Separation of Dicyclopentaidene in a C5 stream using a tetraethoxydimethyl disiloxane-derived silica composite membrane. J IND ENG CHEM 2019. [DOI: 10.1016/j.jiec.2019.05.016] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/26/2022]
|