A novel dry chemical path way for diene and dienophile surface functionalization toward thermally responsive metal-polymer adhesion

High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation

In this study, thermal and argon (Ar) plasma/wetting treatments were combined to enhance the bonding strength of polyimide (PI) films. Attenuated total reflectance-Fourier transform infrared spectroscopy (ATR-FTIR) was used to analyze the changes in the PI imidization degrees. The contact angles of the PI films were also measured. The results show that the contact angles of the fully cured PI films markedly decreased from 78.54° to 26.05° after the Ar plasma treatments. X-ray photoelectron spectroscopy (XPS) analysis was also conducted on the PI surfaces. We found that the intensities of the C-OH and C-N-H bonds increased from 0% to 13% and 29% to 57%, respectively, after Ar plasma activation. Such increases in the C-OH and C-N-H intensities could be attributed to the generation of dangling bonds and the breakage of the imide ring or polymer long chains. Shear tests were also conducted to characterize the bonding strength of the PI films, which, after being treated with the appropriate parameters of temperature, plasma power, and wetting droplets, was found to be excellent at greater than 35.3 MPa.

Using TOF-SIMS Spectrometry to Study the Kinetics of the Interfacial Retro Diels-Alder Reaction

In this work, the use of Time of Flight Secondary Ion Mass Spectrometry (TOF-SIMS) was explored as a technique for monitoring the interfacial retro Diels–Alder (retro DA) reaction occurring on well-controlled self-assembled monolayers (SAMs). A molecule containing a Diels–Alder (DA) adduct was grafted on to the monolayers, then the surface was heated at different temperatures to follow the reaction conversion. A TOF-SIMS analysis of the surface allowed the detection of a fragment from the molecule, which is released from the surface when retro DA reaction occurs. Hence, by monitoring the decay of this fragment’s peak integral, the reaction conversion could be determined in function of the time and for different temperatures. The viability of this method was then discussed in comparison with the results obtained by ¹H NMR spectroscopy.

Thermal Welding by the Third Phase Between Polymers: A Review for Ultrasonic Weld Technology Developments

Ultrasonic welding (USW) is a promising method for the welds between dissimilar materials. Ultrasonic thermal welding by the third phase (TWTP) method was proposed in combination with the formation of a third phase, which was confirmed as an effective technology for polymer welding between the two dissimilar materials compared with the traditional USW. This review focused on the advances of applying the ultrasonic TWTP for thermoplastic materials. The research development on the ultrasonic TWTP of polycarbonate (PC) and polymethyl methacrylate (PMMA), polylactic acid (PLA) and polyformaldehyde (POM), and PLA and PMMA are summarized according to the preparation of the third phase, welded strength, morphologies of rupture surfaces, thermal stability, and others. The review aimed at providing guidance for using ultrasonic TWTP in polymers and a basic understanding of the welding mechanism, i.e., interdiffusion and molecular motion mechanisms between the phases.

Control of Interfacial Diels-Alder Reactivity by Tuning the Plasma Polymer Properties

Functionalizing the surface of a material with a smart plasma polymer coating is an interesting alternative strategy to obtain a thermoresponsive material without changing its formulation. On the basis of a low-pressure plasma polymerization process, the present work first aims to fabricate polymer thin films that react via the well-known thermoreversible Diels-Alder (DA) reaction (diene/dienophile cycloaddition). A two-step surface modification process based on (pulsed) plasma polymerization enables the design of functional coatings that contain furan (diene) groups. The reactivity of these surfaces with maleic anhydride (dienophile) in solution is thoroughly investigated, mainly by studying the kinetics of the DA reaction by advancing contact angle measurements. The determination of rate constants of reactions at various temperatures leads to the quantification of thermodynamic parameters such as the activation energy of the reaction as well as the enthalpy and entropy of activation related to the formation of the transition-state complex involved in the DA reaction. More interestingly, the design of furan-functionalized coatings with various physicochemical properties enables the understanding of the role played by the density of functional groups and the cross-linking rate of the polymer on the interfacial reactivity. Thus, we show in this work how to control the interfacial DA reaction on plasma coatings by tailoring the operating conditions of plasma polymerization.

Dissimilar Materials Bonding Using Epoxy Monolith

The epoxy monolith with a highly porous structure is fabricated by the thermal curing of 2,2-bis(4-glycidyloxyphenyl)propane and 4,4'-methylenebis(cyclohexylamine) in the presence of poly(ethylene glycol) as the porogen via polymerization-induced phase separation. In this study, we demonstrated a new type of dissimilar material bonding method for various polymers and metals coated with the epoxy monolith. On the basis of scanning electron microscopy (SEM) observations, the pore size and number of epoxy monoliths were evaluated to be 1.1-114 μm and 8.7-48 200 mm^-2, respectively, depending on the ratio of the epoxy resin and cross-linking agent used for the monolith fabrication. Various kinds of thermoplastics, such as polyethylene, polypropylene, polyoxymethylene, acrylonitrile-butadiene-styrene copolymer, polycarbonate bisphenol-A, and poly(ethylene terephthalate), were bonded to the monolith-modified metal plates by thermal welding. The bond strength for the single lap-shear tensile test of stainless steel and copper plates with the thermoplastics was in the range of 1.2-7.5 MPa, which was greater than the bond strength value for each bonding system without monolith modification. The SEM observation of fractured test pieces directly confirmed an anchor effect on this bonding system. The elongated deformation of the plastics that filled in the pores of the epoxy monolith, was observed. It was concluded that the bond strength significantly depended on the intrinsic strength of the used thermoplastics. The epoxy monolith bonding of hard plastics, such as polystyrene and poly(methyl methacrylate), was performed by the additional use of adhesives, solvents, and a reactive monomer. The epoxy monolith sheets were also successfully fabricated and applied to dissimilar material bonding.

Promiscuous hydrogen in polymerising plasmas

Historically, there have been two opposing views regarding deposition mechanisms in plasma polymerisation, radical growth and direct ion deposition, with neither being able to fully explain the chemistry of the resultant coating. Deposition rate and film chemistry are dependent on the chemistry of the plasma phase and thus the activation mechanisms of species in the plasma are critical to understanding the relative contributions of various chemical and physical routes to plasma polymer formation. In this study, we investigate the roles that hydrogen plays in activating and deactivating reactive plasma species. Ethyl trimethylacetate (ETMA) is used as a representative organic precursor, and additional hydrogen is added to the plasma in the form of water and deuterium oxide. Optical emission spectroscopy confirms that atomic hydrogen is abundant in the plasma. Comparison of the plasma phase mass spectra of ETMA/H₂O and ETMA/D₂O reveals that (1) proton transfer from hydronium is a common route to charging precursors in plasma, and (2) hydrogen abstraction (activation) and recombination (deactivation) processes are much more dynamic in the plasma than previously thought. Consideration of the roles of hydrogen in plasma chemistry may then provide a more comprehensive view of deposition processes and bridge the divide between the two disparate schools of thought.