Effect of Irradiation Dose in Making an Insulator from a Self-Assembled Monolayer

Electron-beam patterned self-assembled monolayers as templates for Cu electrodeposition and lift-off

Self-assembled monolayers (SAMs) of 4'-methylbiphenyl-4-thiol (MBP0) adsorbed on polycrystalline gold substrates served as templates to control electrochemical deposition of Cu structures from acidic solution, and enabled the subsequent lift-off of the metal structures by attachment to epoxy glue. By exploiting the negative-resist behaviour of MBP0, the SAM was patterned by means of electron-beam lithography. For high deposition contrast a two-step procedure was employed involving a nucleation phase around -0.7 V versus Cu(2+)/Cu and a growth phase at around -0.35 V versus Cu(2+)/Cu. Structures with features down to 100 nm were deposited and transferred with high fidelity. By using substrates with different surface morphologies, AFM measurements revealed that the roughness of the substrate is a crucial factor but not the only one determining the roughness of the copper surface that is exposed after lift-off.

Issues and challenges in vapor-deposited top metal contacts for molecule-based electronic devices

Metal vapor deposition to form ohmic contacts is commonly used in the fabrication of organic electronic devices because of significant manufacturability advantages. In the case of single molecular layer devices, however, the extremely small thickness, typically ~1-2nm, presents serious challenges in achieving good contacts and device integrity. This review focuses on recent scientific aspects of metal vapor deposition on monolayer thickness molecular films, particularly self-assembled monolayers, ranging across mechanisms of metal nucleation, metal-molecular group interactions and chemical reactions, diffusion of metal atoms within and through organic films, and the correlations of these and other factors with device function. Results for both non-reactive and reactive metal deposition are reviewed. Finally, novel strategies are considered which show promise for providing highly reliable and durable metal/organic top contacts for use in metal-molecule-metal junctions for device applications.

Electrodeposition of palladium onto a pyridine-terminated self-assembled monolayer

The electrodeposition of Pd onto self-assembled monolayers (SAMs) of 3-(4-pyridine-4-ylphenyl)propane-1-thiol on Au(111) has been investigated by scanning tunneling microscopy. Two schemes are compared: One involves an established two-step procedure where Pd(2+) ions are first coordinated to the pyridine moieties and subsequently reduced in Pd(2+)-free electrolyte. The second deposition routine involves electroreduction in an electrolyte containing low concentration of Pd(2+) which merges both steps and, thus, significantly simplifies metal deposition onto pyridine-terminated SAMs. Both strategies produce identical Pd nanoparticles (NPs) which exhibit a narrow size distribution and an apparent STM height of ∼2.4 nm. The observation of a Coulomb blockade and easy displacement of the nanoparticles in STM experiments evidence deposition on top of the SAM. The NPs are concluded to be essentially spherical. Growth of the NPs is found to be self-limiting since repeating the complexation-deposition cycle increases the density of the nanoparticles rather than their size but only close to full coverage. At high concentration of the Pd(2+) electrolyte, deposition on top of the SAM is impeded by a competitive mushroom-type growth.

Morphology control of structured polymer brushes

The surface-initiated photopolymerization (SIPP) of vinyl monomers on structured self-assembled monolayers, as defined by two-dimensional (2D) initiator templates for polymer growth, is investigated. The 2D templates are prepared by electron-beam chemical lithography (EBCL) of 4'-nitro-4-mercaptobiphenyl (NBT) and chemical conversion to an asymmetric azo initiator (4'-azomethylmalonodinitrile-1,1'-biphenyl-4-thiol). Ex situ kinetic studies of the SIPP process reveal a linear increase in the thickness of the polymer layer with the irradiation/polymerization time. The effect of the applied electron dosage during the EBCL process upon the final thickness of the polymer layer is also studied. The correlation between the electron-induced conversion of the 4'-nitro to the 4'-amino group and the layer thickness of the resulting polymer brush indicates that the polymer-brush grafting density can be directly controlled by the EBCL process. NBT-based template arrays are used for the combinatorial study of the influence of the lateral structure size and the irradiation dosage on the morphology of the resulting polymer-brush layer. Analysis of the array topography reveals the dependence of the thickness of the dry polymer layer on both electron dosage and structure size. This unique combination of EBCL as a lithographic technique to locally manipulate the surface chemistry and SIPP to amplify the created differences allows the preparation of defined polymer-brush layers of controlled morphologies.