CryoSEM investigation of latex coatings dried in walled substrates

Using an added liquid to suppress drying defects in hard particle coatings

HYPOTHESIS

Lateral accumulation and film defects during drying of hard particle coatings is a common problem, typically solved using polymeric additives and surface active ingredients, which require further processing of the dried film. Capillary suspensions with their tunable physical properties, devoid of polymers, offer new pathways in producing uniform and defect free particulate coatings.

EXPERIMENTS

We investigated the effect of small amounts of secondary liquid on the coating's drying behavior. Stress build-up and weight loss in a temperature and humidity controlled drying chamber were simultaneously measured. Changes in the coating's reflectance and height profile over time were related with the weight loss and stress curve.

FINDINGS

Capillary suspensions dry uniformly without defects. Lateral drying is inhibited by the high yield stress, causing the coating to shrink to an even height. The bridges between particles prevent air invasion and extend the constant drying period. The liquid in the lower layers is transported to the interface via corner flow within surface pores, leading to a partially dry layer near the substrate while the pores above are still saturated. Using capillary suspensions for hard particle coatings results in more uniform, defect free films with better printing characteristics, rendering high additive content obsolete.

Apparatus for simultaneous stress and weight measurement during film drying in an environmentally controlled chamber

The drying behavior of coatings is essential for the development of formulations in order to obtain reliable and defect free finishes. There are two major measures of interest: the development of the stress responsible for cracking and the drying rate that gives insight into the morphological structure. The cantilever deflection method is the predominant way of determining stresses under defined drying conditions such as temperature and humidity. However, both measures of interest are currently obtained using two different coatings when dried in a chamber or a single coating with simultaneous measurements that can only be dried under ambient conditions. In this paper, we present an apparatus design based on the cantilever deflection method that allows simultaneous measurement of the stress and drying rate in an environmentally controlled chamber.

The Properties of Solvent-Based and Water-Borne Butyl Acrylate/Styrene Copolymer Films

With the increasing demands of environmental protection, the properties of water-borne coatings film must meet or exceed current solvent-based coatings. It is an important part of coating science for characterizing the film properties of polymers which was used in the water-borne and the solvent-based coating. In this study, UV-visible spectroscopy, gravimetric analysis, scanning electron microscopy, and electrochemical impedance spectroscopy were used to characterize the properties of the water-borne and the solvent-based poly(butyl acrylate/styrene) (P(BA/St)) copolymer films. The water-borne and the solvent-based P(BA/St) copolymer was synthesized by two methods. The copolymer had a Tg of approximately 14.4°C, which was close to room temperature. The water-borne copolymers were prepared via a three-step film formation process, while the solvent-based copolymer films were prepared in two steps. Comparing the properties of the water-borne and the solvent-based films, the water absorption capacities decreased with increasing film formation times, and the film barrier properties and electrochemical properties of both films improved as the film formation time increased.

Capillary Coatings: Flow and Drying Dynamics in Open Microchannels

Capillary flow and drying of polymer solutions in open microchannels are explored over time scales spanning seven orders of magnitude: from capillary filling (10^-3-10 s) to the formation of a dry thin film (a "capillary coating"; 10²-10³ s). During capillary filling, drying-induced changes (increased solids content and viscosity) generate microscale pinning events that impede contact line motion. Three unique types of pinning are identified and characterized, each defined by the specific location(s) along the contact line at which pinning is induced. Drying is shown to ultimately pin the contact line permanently, and the associated total flow distances and times are revealed to be strong functions of channel width and drying rate. In general, lower drying rates coupled with intermediate channel widths are found to be most conducive to longer flow distances and times. After the advancing contact line permanently pins, internal flows driven by uneven evaporation rates continue to drive polymer to the contact line. This phenomenon promotes a local accumulation of solids and persists until all motion is arrested by drying. The effects of channel width and drying rate are investigated at each stage of this capillary coating process. These results are then applied to case studies of two functional inks commonly used in printed electronics fabrication: a PEDOT:PSS (poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate)) ink and a graphene ink. Although drying is shown to permanently arrest flow in both inks, both systems exhibit an increased resistance to pinning unexplained by mechanisms identified in aqueous polymer systems. Instead, arguments based on chemistry, particle size, and rheology are used to explain their novel behavior. These case studies provide insight into how functional inks can be better designed to optimize flow distances and maximize overall dry film uniformity in capillary coatings.

High-resolution, high-aspect ratio conductive wires embedded in plastic substrates

A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 μm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.