Hygrothermal aging effects on buried molecular structures at epoxy interfaces

Probing Interfacial Aging of Model Adhesion Joints under a Hygrothermal Environment at a Molecular Level

Generally, for adhesive joints, the polar water molecules in humid environments can have a critical effect on the interfacial structures and structural evolution adjacent to the solid substrates. Regarding this, it is still a big challenge to detect and understand the interfacial hygrothermal aging process at the molecular level in real time and in situ. In this study, to trace the interfacial hygrothermal aging process of a classical epoxy formula containing diglycidyl ether of biphenyl A (DGEBA) and 2,2'-(ethylenedioxy) diethylamine (EDDA) with sapphire and fused silica in a typical hygrothermal environment (85 °C and 85% RH), sum frequency generation (SFG) vibrational spectroscopy was used to probe the molecular-level interfacial structural change over the time. The structural evolution dynamics at the buried epoxy/sapphire and epoxy/silica interfaces upon hygrothermal aging were revealed directly in situ. The interfacial delamination during hygrothermal aging was also elucidated from the molecular level. Upon hygrothermal aging, the interfacial CH signals, such as the ones from methyl, methylene, and phenyl groups, decreased significantly and the water OH signals increased substantially, indicating the water molecules had diffused into the interfaces and destroyed the original interactions between the epoxy formula and the substrates. Further analysis indicates that when the integrated signals in the CH range declined to their minimum and leveled off, the interfacial delamination happened. The tensile experiment proved the validity of these spectroscopic experimental results. Our study provides first-hand and molecular-level evidence on a direct correlation between the diffusion of the surrounding water molecules into the interface and the evolution/destruction of the interfacial structures during hygrothermal aging. More importantly, it is proved, SFG can be developed into a powerful tool to noninvasively reveal the local interfacial delamination in real time and in situ under extreme hygrothermal conditions, complemented by the mechanic test.

Spectroscopically Detecting Molecular-Level Bonding Formation between an Epoxy Formula and Steel

The formation of the interfacial adhesion between an epoxy adhesive and a substrate was normally accompanied by the epoxy curing process on the substrate. Although the debate on the formation mechanism of the interfacial adhesion is still ongoing, this issue can causally be resolved by studying the interfacial structural formation between the epoxy adhesive and the substrate. Herein, to reveal the interfacial structural formation of a representative formula composed of epoxy (digylcidyl ether of biphenyl A, DGEBA) and amine hardener (2,2'-(ethylenedioxy) diethylamine, EDDA) with the steel substrate upon curing and postcuring treatments, sum-frequency generation (SFG) vibrational spectroscopy with a sandwiched transparent window/epoxy adhesive/steel setup was applied to detect and track the buried molecular-level structures at the epoxy adhesive/steel interface. An X-ray photoelectron spectroscopic (XPS) experiment was performed to probe the intentionally exposed interface to disclose the occurring interfacial chemical reaction. The reaction between the epoxy groups and the steel-surface OH groups and the molecular reconstruction of interfacial epoxy methyl groups upon curing and postcuring steps were confirmed. The latter also indirectly indicated the formation of the additional hydrogen bonding and the former bonding reaction at the interface. The above two spectroscopic experimental results matched up with the further examination of the adhesion strength. Therefore, this work elucidates the formation of the interfacial bonding between the epoxy formula and the steel substrate upon curing and postcuring treatments at the molecular level, thus providing an in-depth insight into the origin of the interfacial adhesion.

Molecular-Level Correlation between Spectral Evidence and Interfacial Bonding Formation for Epoxy Adhesives on Solid Substrates

Interfacial bonding strength of an epoxy-based adhesive depends on the interfacial interaction between the adhesive and the substrate. Normally, the curing process at the interface accompanied by the interfacial bonding formation is different from that in the bulk, and it is still a big challenge to probe the interfacial bonding formation at a molecular level. In this study, to trace the interfacial structural evolution of a representative formula of epoxy (digylcidyl ether of biphenyl A, DGEBA) and amine hardener [1,2-bis(2-aminoethoxy)ethane, EDDA] with the sapphire and silica substrates upon curing and post-curing steps, sum frequency generation (SFG) vibrational spectroscopy is employed to detect the molecular-level interfacial structural information. For the sapphire substrate, upon curing, backbone methylene (CH₂) stretching signals decrease, indicating the formation of a rigid chain network structure and thus losing the local methylene order, while vibrational signals of the sapphire surface hydroxyl (OH) groups (including hydrogen-bonded and unbonded) increase significantly, indicating the formation of a strong hydrogen-bonding and polar interaction between the epoxy adhesive and the sapphire surface. Upon post-curing, increased backbone CH₂ signals and decreased sapphire OH signals suggest interfacial chemical bonding formation due to the reaction between the epoxy rings and the sapphire surface OH groups. Orientation analysis confirms the enhanced ordering of the sapphire surface OH groups upon curing and post-curing, in comparison to the uncured epoxy formula. As for the fused silica, weak vibrational signals of the methylene (CH₂) and methyl (CH₃) groups are observed before curing, while both of them increase slightly for the cured and post-cured epoxy formulae, suggesting relatively less hydrophilic nature of the silica surface compared to that of the sapphire surface, also evidenced by the very weak OH signals upon curing and post-curing. Further measurement on the adhesion strength matches up with the above spectroscopic experimental results, substantiating the correlation between the macroscopic bonding strength of the epoxy adhesive and the microscopic molecular-level structure.

Dynamic behaviour of water molecules in heterogeneous free space formed in an epoxy resin

Although an epoxy resin is a stable material, it absorbs moisture over a long period of time, causing deterioration of its material properties. We here applied a full-atomistic molecular dynamics (MD) simulation to study where water molecules exist in an epoxy resin and how they dynamically behave. First, the curing reaction was simulated to obtain a network structure so that the time course of the density, and thereby the free space, in the resin were obtained. The results made it possible to discuss the formation and size distribution of the free spaces which were not connected to each other. Then, a few percent of water were inserted into the free space of the cured epoxy resin to examine the location and dynamics of their molecules. We found that several water molecules were clustered at a preferred site, where hydrogen bonds can be formed with hydroxy, ether and amino groups of the network, in the free space, and they heterogeneously moved from there to other sites.

Moisture Ingress at the Molecular Scale in Hygrothermal Aging of Fiber-Epoxy Interfaces

Almost all applications of carbon fiber reinforced composites are susceptible to water aging, either via ambient humidity or through direct exposure to liquid water environments. Although the impacts of water aging in composites can be readily quantified via experimental efforts, details regarding the mechanisms of moisture ingress and aging, particularly at the incipient stages of aging under hygrothermal conditions, have proven challenging to resolve using experimental techniques alone. A deeper understanding of the factors that drive incipient moisture ingress during aging is required for more targeted approaches to combat water aging. Here, molecular dynamics simulations of a novel epoxy/carbon fiber interface exposed to liquid water under hygrothermal conditions are used to elucidate molecular details of the moisture ingress mechanisms at the incipient stages of the aging process. Remarkably, the simulations show that the fiber-matrix interface is not vulnerable to a moisture-wicking type of incipient water ingress and does not readily flood in these early stages of water aging. Instead, water is preferentially absorbed via the matrix-water interface, an ingress pathway that is facilitated by the dynamic mobility of polymer chains at this interface. These chains present electronegative sites that can capture water molecules and provide a conduit to transiently exposed pores and channels on the polymer surface, which creates a presoaked staging reservoir for subsequent deeper ingress into the composite. Characterization of the absorbed water is according to hydrogen bonding to the matrix, and the distributions and transport behavior of these waters are consistent with experimental observations. This work introduces new insights regarding the molecular-level details of moisture ingress and spatial distribution of water in these materials during hygrothermal aging, informing future design directions for extending both the service life and shelf life of next-generation composites.

Sum Frequency Generation Vibrational Spectroscopy for Characterization of Buried Polymer Interfaces

Sum frequency generation vibrational spectroscopy (SFG-VS) has become one of the most appealing technologies to characterize molecular structures at interfaces. In this focal point review, we focus on SFG-VS studies at buried polymer interfaces and review many of the recent publications in the field. We also cover the essential theoretical background of SFG-VS and discuss the experimental implementation of SFG-VS.

Plasma treatment effect on polymer buried interfacial structure and property

Adhesion is important in many industrial applications including those in the microelectronics industry.

Characterization of polymer/epoxy buried interfaces with silane adhesion promoters before and after hygrothermal aging for the elucidation of molecular level details relevant to adhesion

Buried interfacial structures containing epoxy underfills are incredibly important in the microelectronics industry and their structures determine the interfacial adhesion properties and ultimately their lifetime.

In situ observation of water behavior at the surface and buried interface of a low-k dielectric film

Water adsorption in porous low-k dielectrics has become a significant challenge for both back-end-of-line integration and reliability. A simple method is proposed here to achieve in situ observation of water structure and water-induced structure changes at the poly(methyl silsesquioxane) (PMSQ) surface and the PMSQ/solid buried interface at the molecular level by combining sum frequency generation (SFG) vibrational spectroscopic and Fourier transform infrared (FTIR) spectroscopic studies. First, in situ SFG investigations of water uptake were performed to provide direct evidence that water diffuses predominantly along the PMSQ/solid interface rather than through the bulk. Furthermore, SFG experiments were conducted at the PMSQ/water interface to simulate water behavior at the pore inner surfaces for porous low-k materials. Water molecules were found to form strong hydrogen bonds at the PMSQ surface, while weak hydrogen bonding was observed in the bulk. However, both strongly and weakly hydrogen bonded water components were detected at the PMSQ/SiO2 buried interface. This suggests that the water structures at PMSQ/solid buried interfaces are also affected by the nature of solid substrate. Moreover, the orientation of the Si-CH3 groups at the buried interface was permanently changed by water adsorption, which might due to low flexibility of Si-CH3 groups at the buried interface. In brief, this study provides direct evidence that water molecules tend to strongly bond (chemisorbed) with low-k dielectric at pore inner surfaces and at the low-k/solid interface of porous low-k dielectrics. Therefore, water components at the surfaces, rather than the bulk, are likely more responsible for chemisorbed water related degradation of the interconnection layer. Although the method developed here was based on a model system study, we believe it should be applicable to a wide variety of low-k materials.

Molecular behavior at buried epoxy/poly(ethylene terephthalate) interface

Epoxies are widely used as main components in packaging underfills for microelectronics. Their strong adhesion to different substrate materials is an important factor for the functioning of electronic devices. Amines are commonly used cross-linking agents for epoxides. However, the molecular mechanisms of epoxide-amine mixture adhesion to substrate materials remain unclear. In this research we investigated the adhesion mechanism of epoxide-amine mixtures at poly(ethylene terephthalate) (PET) interfaces using attenuated total-internal reflection Fourier transform infrared (ATR-FTIR) spectroscopy and sum frequency generation (SFG) vibrational spectroscopy. Results show that both epoxide and amine could diffuse into the PET film. They could also dissolve or modify the PET film at the interphase region. In the process of epoxy curing on PET, epoxide molecules could cross-link with the modified PET film, providing strong adhesion. This hypothesis was further confirmed by adding reactive and nonreactive silanes to the epoxies and measuring the adhesion strengths of such mixtures to PET. The reactive silanes could cross-link with the system, showing good adhesion, while the nonreactive silane prevented sufficient cross-linking, showing poor adhesion. This research developed an in-depth insight for molecular behaviors at the epoxy/PET interface which helped clarify the related adhesion mechanism.