Optical Properties of Perfluorocyclobutane Aryl Ether Polymers for Polymer Photonic Devices

Ring-Forming Polymerization toward Perfluorocyclobutyl and Ortho-Diynylarene-Derived Materials: From Synthesis to Practical Applications

Many desirable characteristics of polymers arise from the method of polymerization and structural features of their repeat units, which typically are responsible for the polymer’s performance at the cost of processability. While linear alternatives are popular, polymers composed of cyclic repeat units across their backbones have generally been shown to exhibit higher optical transparency, lower water absorption, and higher glass transition temperatures. These specifically include polymers built with either substituted alicyclic structures or aromatic rings, or both. In this review article, we highlight two useful ring-forming polymer groups, perfluorocyclobutyl (PFCB) aryl ether polymers and ortho-diynylarene- (ODA) based thermosets, both demonstrating outstanding thermal stability, chemical resistance, mechanical integrity, and improved processability. Different synthetic routes (with emphasis on ring-forming polymerization) and properties for these polymers are discussed, followed by their relevant applications in a wide range of aspects.

Fluorinated and Thermo-Cross-Linked Polyhedral Oligomeric Silsesquioxanes: New Organic-Inorganic Hybrid Materials for High-Performance Dielectric Application

A fluorinated and thermo-cross-linked polyhedral oligomeric silsesquioxane (POSS) has been successfully synthesized by thermal polymerization of a fluorinated POSS monomer having an inorganic silsesquioxane core and organic side chains bearing thermo-cross-linkable trifluorovinyl ether groups. This new inorganic-organic hybrid polymer shows high thermostability with a 5 wt % loss temperature of 436 °C, as well as good transparency (a sheet with an average thickness of 1.5 mm shows high transmittance of 92% varying from 400 to 1100 nm). Moreover, the polymer exhibits both low dielectric constant (<2.56) and low dissipation factor (<3.1 × 10^-3) in a wide range of frequencies from 40 Hz to 30 MHz even at a high frequency of 5 GHz. The polymer also shows low water uptake (<0.04%) and low D_k (near 2.63) after immersing it in water at room temperature for 3 days. These data imply that this polymer is very suitable to be utilized as a high-performance dielectric material for fabrication of high-frequency printed circuit boards or encapsulation resins for integrated circuit dies in the microelectronic industry. Furthermore, this work also provides a route for the preparation of fluorinated POSS-based polymers.

A new glass-forming molecule having a fluorene skeleton: synthesis and conversion to the polymer with a low dielectric constant, high hydrophobicity and thermostability

A new glass-forming molecule having a fluorene skeleton and thermally cross-linkable trifluorovinyl-ether side chains is reported here.

Dendrimeric organosiloxane with thermopolymerizable –OCFCF2 groups as the arms: synthesis and transformation to the polymer with both ultra-low k and low water uptake

A novel fluoro-containing dendrimeric macromolecule with cyclic siloxane as the core and aryl-trifluorovinyl-ether (–OCFCF₂) units as the arms was reported.

Phenylethynyl- and naphthylethynyl-terminated hyperbranched polyimides with low melt viscosity

In the past decades, 4-phenylethynyl phthalic anhydride has been the most commonly used endcapper for polyimide (PI). A series of different groups of terminated hyperbranched PIs (HBPIs) were synthesized from 1,3,5-tris(2-trifluoromethyl-4-aminophenoxy)benzene, bis[4-(3,4-dicarboxyphenoxy)phenyl]ether dianhydride, and 4-phenylethynylphthalic anhydride or 4-(1-naphthylethynyl)phthalic anhydride. The glass transition temperatures ( Tgs) of the polymers varied from 166°C to 193°C. The 5% weight loss temperatures of polymers were in the range of 548 to 571°C and those of the endcapped HBPIs increased to the range of 600 to 601°C after curing. The PIs exhibited rather low melt viscosity at processing temperature and the complex viscosity increased continuously with the temperature increase. Because there is a large temperature difference between the Tg and cross-linking exothermic temperature, HBPIs provided a wide processing window.

Synthesis of a new cross-linkable perfluorocyclobutane-based hole-transport material

[reaction: see text] A new curable arylamine containing a perfluorocyclobutane (PFCB) structure without an acidic group was synthesized. The material was thermally cured on ITO after spin-coating. The polymer showed excellent solvent resistance, high thermal stability, high transparency, and good surface smoothness.

Facile preparation of fluorovinylene aryl ether telechelic polymers with dual functionality for thermal chain extension and tandem crosslinking

New fluorovinylene aromatic ether polymers, possessing dual reactivity, have been successfully prepared via the step-growth polymerization of commercial bis(trifluorovinyl) aromatic ethers and bisphenols.