Design of reversible cross-linkers for step and flash imprint lithography imprint resists

Design of asymmetric particles containing a charged interior and a neutral surface charge: comparative study on in vivo circulation of polyelectrolyte microgels

Lowering the modulus of hydrogel particles could enable them to bypass in vivo physical barriers that would otherwise filter particles with similar size but higher modulus. Incorporation of electrolyte moieties into the polymer network of hydrogel particles to increase the swelling ratio is a straightforward and quite efficient way to decrease the modulus. In addition, charged groups in hydrogel particles can also help secure cargoes. However, the distribution of charged groups on the surface of a particle can accelerate the clearance of particles. Herein, we developed a method to synthesize highly swollen microgels of precise size with near-neutral surface charge while retaining interior charged groups. A strategy was employed to enable a particle to be highly cross-linked with very small mesh size, and subsequently PEGylated to quench the exterior amines only without affecting the internal amines. Acidic degradation of the cross-linker allows for swelling of the particles to microgels with a desired size and deformability. The microgels fabricated demonstrated extended circulation in vivo compared to their counterparts with a charged surface, and could potentially be utilized in in vivo applications including as oxygen carriers or nucleic acid scavengers.

Large area, facile oxide nanofabrication via step-and-flash imprint lithography of metal-organic hybrid resins

Step-and-flash imprint lithography (S-FIL) is a wafer-scale, high-resolution nanoimprint technique capable of expansion of nanoscale patterns via serial patterning of imprint fields. While S-FIL patterning of organic resins is well known, patterning of metal-organic resins followed by calcination to form structured oxide films remains relatively unexplored. However, with calcination shrinkage, there is tremendous potential utility in easing accessibility of arbitrary nanostructures at 20 nm resolution and below. However, barriers to commercial adoption exist due to difficulties in formulating polymerizable oxide precursors with good dispensability, long shelf life, and resistance to auto-homopolymerization. Here we propose a solution to these issues in the form of a versatile resin formulation scheme that is applicable to a host of functional oxides (Al2O3, HfO2, TiO2, ZrO2, Ta2O5, and Nb2O5). This scheme utilizes a reaction of metal alkoxides with 2-(methacryloyloxy)ethyl acetoacetate (MAEAA), a polymerizable chelating agent. Formation of these inorganic coordination complexes enables remarkable resistance to auto-homopolymerization, greatly improving dispensability and shelf life, thus enabling full scale-up of this facile nanofabrication approach. Results include successively imprinted fields consisting of 100 nm linewidth gratings. Isothermal calcination of these structures resulted in corresponding shrinkage of 75-80% without loss of mechanical integrity or aspect ratio, resulting in 20 nm linewidth oxide nanostructures.

Imprint lithography with degradable elastomeric polyanhydrides

A photocurable, degradable polyanhydride cross-linked elastomer that can be used as a stamp in imprint lithography applications has been developed. The degradable stamp materials are based on polyanhydrides synthesized using thiol-ene polymerization. In this study, curing the monomers 4-pentenoic anhydride and pentaerythritol tetrakis(3-mercaptopropionate) on a master mold yields low modulus, elastomeric, degradable polyanhydride polymer stamps that are a negative of the master. These stamps can be then used as a sacrificial template during the fabrication of a replica of the master, and can be readily degraded away from the replica using water. The resultant imprinted materials exhibited excellent uniformity over a large area. Compared with other conventional imprint lithography stamp materials, the thiol-ene polymerized polyanhydrides are degradable, master mold safe, show great release properties, have fast cure rates, are relatively low cost, and can be fabricated onto variety of substrates and materials.

A fast thermal-curing nanoimprint resist based on cationic polymerizable epoxysiloxane

We synthesized a series of epoxysiloxane oligomers with controllable viscosity and polarity and developed upon them a thermal-curable nanoimprint resist that was cross-linked in air at 110°C within 30 s if preexposed to UV light. The oligomers were designed and synthesized via hydrosilylation of 4-vinyl-cyclohexane-1,2-epoxide with poly(methylhydrosiloxane) with tunable viscosity, polarity, and cross-linking density. The resist exhibits excellent chemical and physical properties such as insensitivity toward oxygen, strong mechanical strength, and high etching resistance. Using this resist, nanoscale patterns of different geometries with feature sizes as small as 30 nm were fabricated via a nanoimprint process based on UV-assisted thermal curing. The curing time for the resist was on the order of 10 s at a moderate temperature with the help of UV light preexposure. This fast thermal curing speed was attributed to the large number of active cations generated upon UV exposure that facilitated the thermal polymerization process.

Direct patterning of TiO₂ using step-and-flash imprint lithography

Although step-and-flash imprint lithography, or S-FIL, has brought about tremendous advancement in wafer-scale fabrication of sub-100 nm features of photopolymerizable organic and organo-silicon-based resists, it has not been successful in direct patterning of inorganic materials such as oxides because of the difficulties associated with resist formulation and its dispensing. In this paper, we demonstrate the proof-of-concept S-FIL of titanium dioxide (TiO(2)) carried by an acrylate-based formulation containing an allyl-functionalized titanium complex. The prepolymer formulation contains 48 wt % metal precursor, but it exhibits low enough viscosity (∼5 mPa·s) to be dispensed by an automatic dispensing system, adheres and spreads well on the substrate, is insensitive to pattern density variations, and rapidly polymerizes when exposed to broadband UV radiation to give a yield close to 95%. Five fields, each measuring 1 cm × 1 cm, consisting of 100 nm gratings were successively imprinted. Heat-treatment of the patterned structures at 450 °C resulted in the loss of organics and their subsequent shrinkage without the loss of integrity or aspect ratio and converted them to TiO(2) anatase nanostructures as small as 30 nm wide. With this approach, wafer-scale direct patterning of functional oxides on a sub-100 nm scale using S-FIL can become a distinct possibility.

Photocurable silsesquioxane-based formulations as versatile resins for nanoimprint lithography

Methacrylate octafunctionalized silsesquioxane (SSQMA) was shown to be an ideal material with high performance for ultraviolet (UV)-based nanoimprint lithography (NIL). The total viscosity of SSQMA-based formulations was adjusted to between 0.8 and 50 cP by incorporating low-viscosity acrylic additives, making the formulations suitable for UV-based NIL. The cured SSQMA-based formulations showed numerous desirable characteristics, including low volumetric shrinkage (4%), high Young's modulus (2.445-4.272 GPa), high resistance to oxygen plasma, high transparency to UV light, and high resistance to organic/aqueous media, as a functional imprint material for UV-based NIL and step-and-flash imprint lithography (SFIL). Using both techniques, the SSQMA-based formulations were easily transferred to relief structures with excellent imprint fidelity and minimal residual thickness. Formulations containing 50% SSQMA (wt %) were able to reproduce high-aspect-ratio nanostructures with aspect ratios as high as 4.5 using bilayer SFIL. Transparent rigiflex molds and hard replica molds with sub-50-nm size features were reproducibly duplicated by using UV-NIL with the SSQMA-based resin. Nanostructures with feature sizes down to 50 nm were successfully reproduced using these molds in both UV- and thermal-NIL processes. After repeating 20 imprinting cycles at relatively high temperature and pressure, no detectable collapse or contamination on the replica surface was observed. These properties of the SSQMA-based resins make them suitable as inexpensive and convenient components in all NIL processes that are based on physical contact.

Silylcarborane acrylate nanoimprint lithography resists

The synthesis of a novel silylcarborane acrylate monomer is reported as well as its application as an etch-resistant component for the formulation of imprint layers for UV nanoimprint lithography (NIL). By introduction of 10% by weight of the silylcarborane acrylate monomer into NIL resist formulations, the oxygen plasma etch rate of the resulting film was reduced by nearly a factor of 2. When used in NIL, the patterned resist layer had excellent oxygen plasma etch resistance, leading to effective image transfer to the underlying poly(hydroxyethyl methacrylate) lift-off layer. The latter allowed for the fabrication of metallic interdigitated electrode patterns via a NIL/lift-off process. This work demonstrates the robustness of silylcarborane-containing resists and paves the way for the investigation of new, high-resolution patterning methods.