Investigation of a complete squeeze-film damping model for MEMS devices

Thermoelastic damping in MEMS gyroscopes at high frequencies

Microelectromechanical systems (MEMS) gyroscopes are widely used, e.g., in modern automotive and consumer applications, and require signal stability and accuracy in rather harsh environmental conditions. In many use cases, device reliability must be guaranteed under large external loads at high frequencies. The sensitivity of the sensor to such external loads depends strongly on the damping, or rather quality factor, of the high-frequency mechanical modes of the structure. In this paper, we investigate the influence of thermoelastic damping on several high-frequency modes by comparing finite element simulations with measurements of the quality factor in an application-relevant temperature range. We measure the quality factors over different temperatures in vacuum, to extract the relevant thermoelastic material parameters of the polycrystalline MEMS device. Our simulation results show a good agreement with the measured quantities, therefore proving the applicability of our method for predictive purposes in the MEMS design process. Overall, we are able to uniquely identify the thermoelastic effects and show their significance for the damping of the high-frequency modes of an industrial MEMS gyroscope. Our approach is generic and therefore easily applicable to any mechanical structure with many possible applications in nano- and micromechanical systems.

Bandwidth Optimization of MEMS Accelerometers in Fluid Medium Environment

There is a constraint between the dynamic range and the bandwidth of MEMS accelerometers. When the input acceleration is comparatively large, the squeeze film damping will increase dramatically with the increase in the oscillation amplitude, resulting in a decrease in bandwidth. Conventional models still lack a complete vibration response analysis in large amplitude ratios and cannot offer a suitable guide in the optimization of such devices. In this paper, the vibration response analysis of the sensing unit of an accelerometer in large amplitude ratios is first completed. Then, the optimal design of the sensing unit is proposed to solve the contradiction between the dynamic range and the bandwidth of the accelerometer. Finally, the results of the vibration experiment prove that the maximum bandwidth can be achieved with 0~10g external acceleration, which shows the effectiveness of the design guide. The new vibration analysis with the complete model of squeeze film damping is applicable to all sensitive structures based on vibration, not limited to the MEMS accelerometer studied in this thesis. The bandwidth optimal scheme also provides a strong reference for similar structures with large oscillation amplitude ratios.

Design and Implementation of Low-Voltage Tunable Capacitive Micro-Machined Transducers (CMUT) for Portable Applications

Capacitive micromachined ultrasonic transducers (CMUT) are MEMS-based transducers with advantages over conventional ultrasonic transducers, such as their small size, the ease of integration with semiconductor electronics, and batch fabrication. In this study, the effect of different membrane topologies on the displacement, resonant frequency, and output pressure of the CMUT membrane is investigated in the transmission mode in an air environment. A novel structural-support feature, the rocker stem, is introduced, where the membrane is weakly held to the substrate in order to minimize mechanical constraints. Four different CMUT topologies are designed and assessed to analyze the impacts of topological variations. A new CMUT array configuration is also designed to provide an approach for maximizing CMUT density. This study aims to contribute to efficient CMUT design and the determination of optimum structural parameters for portable applications in air.

Simulation and Test of a MEMS Arming Device for a Fuze

To solve the structural strength problem of a MEMS arming device for a fuze, a kind of arming device applied to a certain type of 40 mm grenade is designed. This paper introduces the working principle of the arming device; simulates the shear pin, rotary pin and locking mechanism in the device; designs a variety of different test tools for test verification; and further increases the explosion reliability and arming safety tests. The results show that the arming device improves the structural strength and can meet the action requirements of a certain type of 40 mm grenade for safety release, as well as the application requirements of explosion reliability and arming safety.

Built-In Packaging for Single Terminal Devices

An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.

Accurate mechanical-optical theoretical model of cross-axis sensitivity of an interferometric micro-optomechanical accelerometer

An interferometric micro-optomechanical accelerometer usually has ultrahigh sensitivity and accuracy. However, cross-axis interference inevitably degrades the performance, including its detection accuracy and output signal contrast. To accurately clarify the influence of cross-axis interference, a modified mechanical-optical theoretical model is established. The rotation of the proof mass and the detected light intensity are quantitatively investigated with a load of cross-axis acceleration. A simulation and experiment are performed to verify the correctness of the theoretical model when the cross-axis acceleration is from 0 to 0.175 g. The results demonstrate that this model has a more than fivefold accuracy increase compared with conventional theoretical models when the cross-axis acceleration is from 0.06 to 0.175 g. In addition, we provide a suppression method to diminish the rotation of the proof mass based on squeeze film air damping, which significantly suppresses the contrast reduction caused by cross-axis interference.

Extending the Validity of Squeeze Film Damping Models with Lower Aspect Ratios

Squeeze film air damping is a significant factor in the design of MEMS devices owing to its great impact on the dynamic performance of vibrating structures. However, the traditional theoretical results of squeeze film air damping are derived from the Reynolds equation, wherein there exists a deviation from the true results, especially in low aspect ratios. While expensive efforts have been undertaken to prove that this deviation is caused by the neglect of pressure change across the film, a quantitative study has remained elusive. This paper focuses on the investigation of the finite size effect of squeeze film air damping and conducts numerical research using a set of simulations. A modified expression is extended to lower aspect ratio conditions from the original model of squeeze film air damping. The new quick-calculating formulas based on the simulation results reproduce the squeeze film air damping with a finite size effect accurately with a maximum error of less than 1% in the model without a border effect and 10.185% in the compact model with a border effect. The high consistency between the new formulas and simulation results shows that the finite size effect was adequately considered, which offers a previously unattainable precise damping design guide for MEMS devices.