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Hu T, Sheng B. A Highly Sensitive Strain Sensor with Wide Linear Sensing Range Prepared on a Hybrid-Structured CNT/Ecoflex Film via Local Regulation of Strain Distribution. ACS APPLIED MATERIALS & INTERFACES 2024. [PMID: 38603806 DOI: 10.1021/acsami.4c00648] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/13/2024]
Abstract
With the development of information technology, high-performance wearable strain sensors with high sensitivity and stretchability have played a significant role in motion detection. However, many high-sensitivity and outstanding-stretchability strain sensors possess a limited linear sensing range, which limits the enhancement of the flexible strain sensors' performance. Herein, we develop a hybrid-structured carbon nanotube (CNT)/Ecoflex strain sensor with laser-engraved grooves along with punched circular holes in a composite CNT/Ecoflex film by vacuum filtration and permeation. By optimizing the distribution of grooves and circular holes, the strain in the sensing layer can be locally regulated, which alters the morphology of cracks under strain and allows the hybrid-structured CNT/Ecoflex strain sensor to simultaneously exhibit high sensitivity (GF = 43.8) as well as a wide linear sensing range (200%). On the basis of excellent performance, the hybrid-structured CNT/Ecoflex strain sensor is capable of detecting movements in various parts of the human body, including movements of larynx and joint bending.
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Affiliation(s)
- Tao Hu
- School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
- Shanghai Key Laboratory of Modern Optical Systems, Engineering Research Center of Optical Instruments and Systems, Shanghai 200093, China
| | - Bin Sheng
- School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
- Shanghai Key Laboratory of Modern Optical Systems, Engineering Research Center of Optical Instruments and Systems, Shanghai 200093, China
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He X, Cui Z, Zhang F, Li Y, Tu J, Cao J, Wang J, Qiao Y, Xi P, Xu T, Chen X, Zhang X. Multiscale Heterogeneities-Based Piezoresistive Interfaces with Ultralow Detection Limitation and Adaptively Switchable Pressure Detectability. ACS NANO 2024; 18:8296-8306. [PMID: 38452476 DOI: 10.1021/acsnano.3c12513] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 03/09/2024]
Abstract
Mechanical compliance and electrical enhancement are crucial for pressure sensors to promote performances when perceiving external stimuli. Here we propose a bioinspired multiscale heterogeneity-based interface to adaptively regulate its structure layout and switch to desirable piezoresistive behaviors with ultralow detection limitation. In such a multiscale heterogeneities system, the micro-/nanoscale spiny Ag-MnO2 heterostructure contributes to an ultralow detection limitation of 0.008 Pa and can perceive minor pressure increments under preloads with high resolution (0.0083%). The macroscale heterogeneous orientation of the cellular backbone enables anisotropic deformation, allowing the sensor to switch to rational sensitivity and working range (e.g., 580 kPa-1 for 0-20 kPa/54 kPa-1 for 60-140 kPa) as required. The sensor's stepwise activation progresses from the micro-/nanoscale heterostructure to the macroscale heterogeneous orientation, which can adaptively match diverse sensing tasks in complex applications scenarios. This multiscale heterogeneous and switchable design holds immense potential in the development of intelligent electromechanical devices, including wearable sensors, soft robotics, and smart actuators.
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Affiliation(s)
- Xuecheng He
- The Institute for Advanced Study (IAS), Shenzhen University, Shenzhen 518060, P. R. China
- Research Center for Bioengineering and Sensing Technology, University of Science and Technology Beijing, Beijing 100083, P. R. China
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Zequn Cui
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Feilong Zhang
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Yanzhen Li
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Jiaqi Tu
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Jinwei Cao
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Jianwu Wang
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Yuchun Qiao
- Research Center for Bioengineering and Sensing Technology, University of Science and Technology Beijing, Beijing 100083, P. R. China
| | - Pengxu Xi
- Research Center for Bioengineering and Sensing Technology, University of Science and Technology Beijing, Beijing 100083, P. R. China
| | - Tailin Xu
- The Institute for Advanced Study (IAS), Shenzhen University, Shenzhen 518060, P. R. China
| | - Xiaodong Chen
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Xueji Zhang
- The Institute for Advanced Study (IAS), Shenzhen University, Shenzhen 518060, P. R. China
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Choi YK, Kim TH, Song JH, Jung BK, Kim W, Bae JH, Choi HJ, Kwak J, Shim JW, Oh SJ. Charge transport transition of PEDOT:PSS thin films for temperature-insensitive wearable strain sensors. NANOSCALE 2023; 15:7980-7990. [PMID: 37067237 DOI: 10.1039/d2nr05688g] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/05/2023]
Abstract
In this study, a temperature-insensitive strain sensor that detects only the strain without responding to the temperature was designed. The transport mechanism and associated temperature coefficient of resistance (TCR) of a poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) thin film were modified through secondary doping with dimethyl sulfoxide (DMSO). Upon DMSO-doping, the carrier transport mechanism of the PEDOT:PSS thin film transitioned from hopping to band-like transport, with a morphological change. At the DMSO doping level, which caused the critical point of the transport transition, the resistance of the thin film was maintained with a change in temperature. Consequently, the TCR of the optimized PEDOT:PSS thin film was less than 9 × 10-5 K-1, which is 102 times lower than that of the as-prepared films. The carrier mobility of the PEDOT:PSS thin film was effectively improved with the morphological change due to DMSO doping and was investigated through combinational analysis. Ultimately, the wearable strain sensor prepared using the optimized PEDOT:PSS thin film responded stably to the applied strain with a gauge factor of 2 and exhibited excellent temperature anti-interference.
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Affiliation(s)
- Young Kyun Choi
- Department of Materials Science and Engineering, Korea University, 145, Anam-ro Seongbuk-gu Seoul, 02841, Republic of Korea.
| | - Tae Hyuk Kim
- School of Electrical Engineering, Korea University, 145, Anam-ro Seongbuk-gu Seoul, 02841, Republic of Korea.
| | - Jeong Han Song
- Department of Electrical and Computer Engineering, Inter-university Semiconductor Research Center, and Soft Foundry Institute, Seoul National University, Seoul 08826, Republic of Korea.
| | - Byung Ku Jung
- Department of Materials Science and Engineering, Korea University, 145, Anam-ro Seongbuk-gu Seoul, 02841, Republic of Korea.
| | - Woosik Kim
- Department of Materials Science and Engineering, Korea University, 145, Anam-ro Seongbuk-gu Seoul, 02841, Republic of Korea.
| | - Jung Ho Bae
- Department of Materials Science and Engineering, Korea University, 145, Anam-ro Seongbuk-gu Seoul, 02841, Republic of Korea.
| | - Hyung Jin Choi
- Department of Materials Science and Engineering, Korea University, 145, Anam-ro Seongbuk-gu Seoul, 02841, Republic of Korea.
| | - Jeonghun Kwak
- Department of Electrical and Computer Engineering, Inter-university Semiconductor Research Center, and Soft Foundry Institute, Seoul National University, Seoul 08826, Republic of Korea.
| | - Jae Won Shim
- School of Electrical Engineering, Korea University, 145, Anam-ro Seongbuk-gu Seoul, 02841, Republic of Korea.
| | - Soong Ju Oh
- Department of Materials Science and Engineering, Korea University, 145, Anam-ro Seongbuk-gu Seoul, 02841, Republic of Korea.
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Lee J, So H. 3D-printing-assisted flexible pressure sensor with a concentric circle pattern and high sensitivity for health monitoring. MICROSYSTEMS & NANOENGINEERING 2023; 9:44. [PMID: 37033109 PMCID: PMC10076430 DOI: 10.1038/s41378-023-00509-z] [Citation(s) in RCA: 8] [Impact Index Per Article: 8.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 08/18/2022] [Revised: 01/01/2023] [Accepted: 02/06/2023] [Indexed: 06/19/2023]
Abstract
In this study, a flexible pressure sensor is fabricated using polydimethylsiloxane (PDMS) with a concentric circle pattern (CCP) obtained through a fused deposition modeling (FDM)-type three-dimensional (3D) printer and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) as the active layer. Through layer-by-layer additive manufacturing, the CCP surface is generated from a thin cone model with a rough surface by the FDM-type 3D printer. A novel compression method is employed to convert the cone shape into a planar microstructure above the glass transition temperature of a polylactic acid (PLA) filament. To endow the CCP surface with conductivity, PDMS is used to replicate the compressed PLA, and PEDOT:PSS is coated by drop-casting. The size of the CCP is controlled by changing the printing layer height (PLH), which is one of the 3D printing parameters. The sensitivity increases as the PLH increases, and the pressure sensor with a 0.16 mm PLH exhibits outstanding sensitivity (160 kPa-1), corresponding to a linear pressure range of 0-0.577 kPa with a good linearity of R 2 = 0.978, compared to other PLHs. This pressure sensor exhibits stable and repeatable operation under various pressures and durability under 6.56 kPa for 4000 cycles. Finally, monitoring of various health signals such as those for the wrist pulse, swallowing, and pronunciation of words is demonstrated as an application. These results support the simple fabrication of a highly sensitive, flexible pressure sensor for human health monitoring.
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Affiliation(s)
- Jihun Lee
- Department of Mechanical Engineering, Hanyang University, Seoul, 04763 South Korea
| | - Hongyun So
- Department of Mechanical Engineering, Hanyang University, Seoul, 04763 South Korea
- Institute of Nano Science and Technology, Hanyang University, Seoul, 04763 South Korea
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Kang Y, Mouring S, de Clerck A, Mao S, Ng W, Ruan H. Development of a Flexible Integrated Self-Calibrating MEMS Pressure Sensor Using a Liquid-to-Vapor Phase Change. SENSORS (BASEL, SWITZERLAND) 2022; 22:9737. [PMID: 36560105 PMCID: PMC9787870 DOI: 10.3390/s22249737] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 11/03/2022] [Revised: 12/05/2022] [Accepted: 12/06/2022] [Indexed: 06/17/2023]
Abstract
Self-calibration capabilities for flexible pressure sensors are greatly needed for fluid dynamic analysis, structure health monitoring and wearable sensing applications to compensate, in situ and in real time, for sensor drifts, nonlinearity effects, and hysteresis. Currently, very few self-calibrating pressure sensors can be found in the literature, let alone in flexible formats. This paper presents a flexible self-calibrating pressure sensor fabricated from a silicon-on-insulator wafer and bonded on a polyimide substrate. The sensor chip is made of four piezoresistors arranged in a Wheatstone bridge configuration on a pressure-sensitive membrane, integrated with a gold thin film-based reference cavity heater, and two thermistors. With a liquid-to-vapor thermopneumatic actuation system, the sensor can create precise in-cavity pressure for self-calibration. Compared with the previous work related to the single-phase air-only counterpart, testing of this two-phase sensor demonstrated that adding the water liquid-to-vapor phase change can improve the effective range of self-calibration from 3 psi to 9.5 psi without increasing the power consumption of the cavity micro-heater. The calibration time can be further improved to a few seconds with a pulsed heating power.
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Affiliation(s)
| | - Scott Mouring
- Department of Mechanical Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USA
| | - Albrey de Clerck
- Nanosonic, Inc., Pembroke, VA 24136, USA
- Department of Mechanical Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USA
| | - Shuo Mao
- Department of Mechanical Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USA
| | - Wing Ng
- Department of Mechanical Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USA
| | - Hang Ruan
- Nanosonic, Inc., Pembroke, VA 24136, USA
- Department of Mechanical Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USA
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Zhou Y, Lian H, Li Z, Yin L, Ji Q, Li K, Qi F, Huang Y. Crack engineering boosts the performance of flexible sensors. VIEW 2022. [DOI: 10.1002/viw.20220025] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022] Open
Affiliation(s)
- Yunlei Zhou
- School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan China
- State Key Laboratory of Digital Manufacturing Equipment and Technology Flexible Electronics Research Center Huazhong University of Science and Technology Wuhan China
| | - Haoxiang Lian
- School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan China
- State Key Laboratory of Digital Manufacturing Equipment and Technology Flexible Electronics Research Center Huazhong University of Science and Technology Wuhan China
| | - Zhenlei Li
- School of Mechanical and Electric Engineering Soochow University Suzhou China
| | - Liting Yin
- School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan China
- State Key Laboratory of Digital Manufacturing Equipment and Technology Flexible Electronics Research Center Huazhong University of Science and Technology Wuhan China
| | - Qian Ji
- School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan China
| | - Kan Li
- School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan China
- State Key Laboratory of Digital Manufacturing Equipment and Technology Flexible Electronics Research Center Huazhong University of Science and Technology Wuhan China
| | - Fei Qi
- School of Mechanical and Electric Engineering Soochow University Suzhou China
| | - YongAn Huang
- School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan China
- State Key Laboratory of Digital Manufacturing Equipment and Technology Flexible Electronics Research Center Huazhong University of Science and Technology Wuhan China
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