Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface

Efficient Catalytic Production of Hydrogen Peroxide Using Tin-containing Zeolite Fixed Palladium Nanoparticles with Oxidation Resistance

The metal surfaces tend to be oxidized in air through dissociation of the O-O bond of oxygen to reduce the performances in various fields. Although several ligand modification routes have alleviated the oxidation of bulky metal surfaces, it is still a challenge for the oxidation resistance of small-size metal nanoparticles. Herein, we fixed the small-size Pd nanoparticles in tin-contained MFI zeolite crystals, where the tin acts as an electron donor to efficiently hinder the oxidation of Pd by weakening the adsorption of molecular oxygen and suppressing the O-O cleavage. This oxidation-resistant Pd catalyst exhibited superior performance in directly synthesizing hydrogen peroxide from hydrogen and oxygen, with the productivity of hydrogen peroxide at ≈10,170 mmol gPd -1 h-1 , steadily outperforming the catalysts tested previously. This work leads to the hypothesis that tin is an electron donor to realize oxidation-resistant Pd within zeolite crystals for efficient catalysis to overcome the limitation of generally supported Pd catalysts and further motivates the use of oxidation-resistant metal nanoparticles in various fields.

Atomistic mechanisms of water vapor-induced surface passivation

The microscopic mechanisms underpinning the spontaneous surface passivation of metals from ubiquitous water have remained largely elusive. Here, using in situ environmental electron microscopy to atomically monitor the reaction dynamics between aluminum surfaces and water vapor, we provide direct experimental evidence that the surface passivation results in a bilayer oxide film consisting of a crystalline-like Al(OH)3 top layer and an inner layer of amorphous Al2O3. The Al(OH)3 layer maintains a constant thickness of ~5.0 Å, while the inner Al2O3 layer grows at the Al2O3/Al interface to a limiting thickness. On the basis of experimental data and atomistic modeling, we show the tunability of the dissociation pathways of H2O molecules with the Al, Al2O3, and Al(OH)3 surface terminations. The fundamental insights may have practical significance for the design of materials and reactions for two seemingly disparate but fundamentally related disciplines of surface passivation and catalytic H2 production from water.

Porous Ni3Fe intermetallic compounds as efficient and stable catalysts for the hydrogen evolution reaction in alkaline solutions

It is crucial to develop cost-effective novel non-noble metal catalysts with high activity and durability for large-scale industrial hydrogen production via water splitting. Here, based on a facile powder metallurgy method, Ni3Fe intermetallic electrodes with porous structures and controllable phases have been designed and fabricated by sintering mixed Ni and Fe powders under an Ar atmosphere. The effects of sintering temperature on the morphology, porous structure and phase composition of the intermetallic were studied. The resultant Ni3Fe-900 intermetallic electrode exhibits promising HER activity in alkaline electrolytes with an overpotential of 112 mV to drive a current density of 10 mA cm-2. Additionally, the Ni3Fe-900 intermetallic electrode shows good alkali corrosion resistance and stability in the HER process at a current density as high as 500 mA cm-2 for 24 h with no significant changes of the surface morphology, porous structure and phases. The efficient HER performance of the Ni3Fe-900 electrode is attributed to the unique intrinsic activity of the intermetallic electrode, increased accessible active sites originating from the porous structure and accelerated charge transfer. This work provides new insights into the design of electrocatalysts for industrial large-scale hydrogen production by water splitting.

Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing

Highly (111)-oriented nanotwinned Cu (nt-Cu) films were fabricated on silicon wafers for thermal-stress characterization. We tailored the microstructural features (grain scale and orientation) of the films by tuning the electroplating parameters. The films were heat-treated and the relaxation behaviors of thermal stresses in the films were explored using a bending beam system. Focused ion beam (FIB) and electron back-scattered diffraction (EBSD) were then employed to characterize the transformations of the microstructure, grain size, and orientation degree of the films. The results indicated that the degree of (111)-preferred orientation and grain size significantly decrease with increasing the current density. The nt-Cu films with a higher degree of (111)-preferred orientation and larger grains exhibit the slower rates of stress relaxation. The film with larger grains possesses a smaller grain boundary area; thus, the grain boundary diffusion for the thermal-stress release is suppressed. In addition, the induced tensile stress in the films with larger grains is smaller leading to the difference in microstructural changes under annealing.

Atomistic Origins of Reversible Noncatalytic Gas-Solid Interfacial Reactions

Noncatalytic gas-solid reactions are a large group of heterogeneous reactions that are usually assumed to occur irreversibly because of the strong driving force to favor the forward direction toward the product formation. Using the example of Ni oxidation into NiO with CO2, herein, we demonstrate the existence of the reverse element that results in the NiO reduction from the countering effect of the gaseous product of CO. Using in situ electron microscopy observations and atomistic modeling, we show that the oxidation process occurs via preferential CO2 adsorption along step edges that results in step-flow growth of NiO layers, and the presence of Ni atoms on the flat NiO surface promotes the nucleation of NiO layers. Simultaneously, the NiO reduction happens via preferential step-edge adsorption of CO that leads to the receding motion of atomic steps, and the presence of Ni vacancies in the NiO surface facilitates the CO-adsorption-induced surface pitting. Temperature and CO2 pressure effect maps are constructed to illustrate the spatiotemporal dynamics of the competing NiO redox reactions. These results demonstrate the rich gas-solid surface reaction dynamics induced by the coexisting forward and reverse reaction elements and have practical applicability in manipulating gas-solid reactions via controlling the gas environment or atomic structure of the solid surface to steer the reaction toward the desired direction.

Flat-surface-assisted and self-regulated oxidation resistance of Cu(111)

Oxidation can deteriorate the properties of copper that are critical for its use, particularly in the semiconductor industry and electro-optics applications^1–7. This has prompted numerous studies exploring copper oxidation and possible passivation strategies⁸. In situ observations have, for example, shown that oxidation involves stepped surfaces: Cu₂O growth occurs on flat surfaces as a result of Cu adatoms detaching from steps and diffusing across terraces^9–11. But even though this mechanism explains why single-crystalline copper is more resistant to oxidation than polycrystalline copper, the fact that flat copper surfaces can be free of oxidation has not been explored further. Here we report the fabrication of copper thin films that are semi-permanently oxidation resistant because they consist of flat surfaces with only occasional mono-atomic steps. First-principles calculations confirm that mono-atomic step edges are as impervious to oxygen as flat surfaces and that surface adsorption of O atoms is suppressed once an oxygen face-centred cubic (fcc) surface site coverage of 50% has been reached. These combined effects explain the exceptional oxidation resistance of ultraflat Cu surfaces.

The fabrication of copper thin films with ultraflat surfaces and only occasional mono-atomic steps, which show semi-permanent resistance to oxidation over long periods, is reported and the mechanism explained using first-principles calculations.

In situ STEM study on the morphological evolution of copper-based nanoparticles during high-temperature redox reactions

Despite the broad relevance of copper nanoparticles in industrial applications, the fundamental understanding of oxidation and reduction of copper at the nanoscale is still a matter of debate and remains within the realm of bulk or thin film-based systems. Moreover, the reported studies on nanoparticles vary widely in terms of experimental parameters and are predominantly carried out using either ex situ observation or environmental transmission electron microscopy in a gaseous atmosphere at low pressure. Hence, dedicated studies in regards to the morphological transformations and structural transitions of copper-based nanoparticles at a wider range of temperatures and under industrially relevant pressure would provide valuable insights to improve the application-specific material design. In this paper, copper nanoparticles are studied using in situ Scanning Transmission Electron Microscopy to discern the transformation of the nanoparticles induced by oxidative and reductive environments at high temperatures. The nanoparticles were subjected to a temperature of 150 °C to 900 °C at 0.5 atm partial pressure of the reactive gas, which resulted in different modes of copper mobility both within the individual nanoparticles and on the surface of the support. Oxidation at an incremental temperature revealed the dependency of the nanoparticles' morphological evolution on their initial size as well as reaction temperature. After the formation of an initial thin layer of oxide, the nanoparticles evolved to form hollow oxide shells. The kinetics of formation of hollow particles were simulated using a reaction-diffusion model to determine the activation energy of diffusion and temperature-dependent diffusion coefficient of copper in copper oxide. Upon further temperature increase, the hollow shell collapsed to form compact and facetted nanoparticles. Reduction of copper oxide was carried out at different temperatures starting from various oxide phase morphologies. A reduction mechanism is proposed based on the dynamic of the reduction-induced fragmentation of the oxide phase. In a broader perspective, this study offers insights into the mobility of the copper phase during its oxidation-reduction process in terms of microstructural evolution as a function of nanoparticle size, reaction gas, and temperature.

Defect-driven selective metal oxidation at atomic scale

Nanoscale materials modified by crystal defects exhibit significantly different behaviours upon chemical reactions such as oxidation, catalysis, lithiation and epitaxial growth. However, unveiling the exact defect-controlled reaction dynamics (e.g. oxidation) at atomic scale remains a challenge for applications. Here, using in situ high-resolution transmission electron microscopy and first-principles calculations, we reveal the dynamics of a general site-selective oxidation behaviour in nanotwinned silver and palladium driven by individual stacking-faults and twin boundaries. The coherent planar defects crossing the surface exhibit the highest oxygen binding energies, leading to preferential nucleation of oxides at these intersections. Planar-fault mediated diffusion of oxygen atoms is shown to catalyse subsequent layer-by-layer inward oxide growth via atomic steps migrating on the oxide-metal interface. These findings provide an atomistic visualization of the complex reaction dynamics controlled by planar defects in metallic nanostructures, which could enable the modification of physiochemical performances in nanomaterials through defect engineering.

Crystal defects critically influence surface chemical reactions in nanomaterials, yet the basic mechanisms at play are still elusive. Here, the authors show the atomic-scale dynamics of surface oxidation at coherent planar defects in Ag and Pd, revealing how twins and stacking-faults selectively oxidize metallic nanocrystals.

Resolving single Cu nanoparticle oxidation and Kirkendall void formation with in situ plasmonic nanospectroscopy and electrodynamic simulations

Copper nanostructures are ubiquitous in microelectronics and heterogeneous catalysis and their oxidation is a topic of high current interest and broad relevance. It relates to important questions, such as catalyst active phase, activity and selectivity, as well as fatal failure of microelectronic devices. Despite the obvious importance of understanding the mechanism of Cu nanostructure oxidation, numerous open questions remain, including under what conditions homogeneous oxide layer growth occurs and when the nanoscale Kirkendall void forms. Experimentally, this is not trivial to investigate because when a large number of nanoparticles are simultaneously probed, ensemble averaging makes rigorous conclusions difficult. On the other hand, when (in situ) electron-microscopy approaches with single nanoparticle resolution are applied, concerns about beam effects that may both reduce the oxide or prevent oxidation via the deposition and cross-linking of carbonaceous species cannot be neglected. In response we present how single particle plasmonic nanospectroscopy can be used for the in situ real time characterization of multiple individual Cu nanoparticles during oxidation. Our analysis of their optical response combined with post mortem electron microscopy imaging and detailed Finite-Difference Time-Domain electrodynamics simulations enables in situ identification of the oxidation mechanism both in the initial oxide shell growth phase and during Kirkendall void formation, as well as the transition between them. In a wider perspective, this work presents the foundation for the application of single particle plasmonic nanospectroscopy in investigations of the impact of parameters like particle size, shape and grain structure with respect to defects and grain boundaries on the oxidation of metal nanoparticles.

A nanofluidic device for parallel single nanoparticle catalysis in solution

Studying single catalyst nanoparticles, during reaction, eliminates averaging effects that are an inherent limitation of ensemble experiments. It enables establishing structure-function correlations beyond averaged properties by including particle-specific descriptors such as defects, chemical heterogeneity and microstructure. Driven by these prospects, several single particle catalysis concepts have been implemented. However, they all have limitations such as low throughput, or that they require very low reactant concentrations and/or reaction rates. In response, we present a nanofluidic device for highly parallelized single nanoparticle catalysis in solution, based on fluorescence microscopy. Our device enables parallel scrutiny of tens of single nanoparticles, each isolated inside its own nanofluidic channel, and at tunable reaction conditions, ranging from the fully mass transport limited regime to the surface reaction limited regime. In a wider perspective, our concept provides a versatile platform for highly parallelized single particle catalysis in solution and constitutes a promising application area for nanofluidics.

Enhanced photolysis stability of Cu2O grown on Cu nanowires with nanoscale twin boundaries

Cuprous oxide (Cu₂O) that has a direct bandgap corresponding to visible-light absorption exhibits versatile functionalities, which are appealing to solar cell, photocatalyst, bio-sensing and water splitting applications. However, photolysis stability has long been a problem for Cu₂O under light exposure and a humid environment. Here, we found that the Cu₂O layer grown on Cu nanowires (CuNWs) with high-density nanoscale twin boundaries can maintain the integrity of Cu/Cu₂O core-shell structure under ambient air conditions for more than one year. The Cu₂O on nanotwinned CuNWs also demonstrates much higher stability in humid air and water with light exposure than its counterpart on nanocrystalline CuNWs. The superior photolysis stability of Cu₂O is attributed to (1) photoelectrons drained to the Cu core, (2) limited vacancy sources in the Cu₂O layer and (3) the suppressed out-diffusion of Cu cations through the oxide layer. It is suggested that the presence of nanoscale twin boundaries modifies the atomic surface structure of the CuNWs and alters the photolysis reaction of Cu₂O.

NiFe Alloy Nanotube Arrays as Highly Efficient Bifunctional Electrocatalysts for Overall Water Splitting at High Current Densities

A bubble-releasing assisted pulse electrodeposition method was developed to create metallic alloy, NiFe, nanotube arrays in one step. The NiFe alloy nanotube array exhibited excellent bifunctional electrolytic activities, achieving low overpotentials of 100 mV for the hydrogen evolution reaction and 236 mV for the oxygen evolution reaction at 10 mA cm^-2, both in 1 M KOH at room temperature. For overall water splitting, the NiFe alloy nanotube array delivered 10 mA cm^-2 at an ultralow cell voltage of 1.58 V, among the top tier of the state-of-the-art bifunctional electrocatalysts. The NiFe alloy nanotube array also exhibited ultrastability at high current densities, experiencing only a minor chronoamperometric decay of 6.5% after a 24 h operation at 400 mA cm^-2. The success of the present binder-free nanotube array-based electrode can be attributed to the much enlarged reaction surface area, one-dimensionally guided charge transport and mass transfer offered by the nanotube structure, and improved product crystallinity provided by the pulse current electrodeposition. The nanotube array structure proves to be a promising new architecture design for electrocatalysts.

Borax promotes the facile formation of hollow structure in Cu single crystalline nanoparticles for multifunctional electrocatalysis

Hollow Cu₂O and Cu are efficiently prepared using borax as structure-directing agent for electrocatalysis of glucose oxidation and H₂O₂ reduction.

Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core-shell nanowires

Lattice-mismatch is an important factor for the heteroepitaxial growth of core-shell nanostructures. A large lattice-mismatch usually leads to a non-coherent interface or a polycrystalline shell layer. In this study, a conformal Ag layer is coated on Cu nanowires with dense nanoscale twin boundaries through a galvanic replacement reaction. Despite a large lattice mismatch between Ag and Cu (∼12.6%), the Ag shell replicates the twinning structure in Cu nanowires and grows epitaxially on the nanotwinned Cu nanowire. A twin-mediated growth mechanism is proposed to explain the epitaxy of high lattice-mismatch bimetallic systems in which the misfit dislocations are accommodated by coherent twin boundaries.