1
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Luo C, Wu J, Zhang X, Fu Q, Wang W, Yu Y, Zeng P, Ni Z, Zhang J, Lu J. Broadband mid-infrared photodetectors utilizing two-dimensional van der Waals heterostructures with parallel-stacked pn junctions. NANOTECHNOLOGY 2024; 35:365203. [PMID: 38861963 DOI: 10.1088/1361-6528/ad568e] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/07/2024] [Accepted: 06/11/2024] [Indexed: 06/13/2024]
Abstract
Optimizing the width of depletion region is a key consideration in designing high performance photovoltaic photodetectors, as the electron-hole pairs generated outside the depletion region cannot be effectively separated, leading to a negligible contribution to the overall photocurrent. However, currently reported photovoltaic mid-infrared photodetectors based on two-dimensional heterostructures usually adopt a single pn junction configuration, where the depletion region width is not maximally optimized. Here, we demonstrate the construction of a high performance broadband mid-infrared photodetector based on a MoS2/b-AsP/MoS2npn van der Waals heterostructure. The npn heterojunction can be equivalently represented as two parallel-stacked pn junctions, effectively increasing the thickness of the depletion region. Consequently, the npn device shows a high detectivity of 1.3 × 1010cmHz1/2W-1at the mid-infrared wavelength, which is significantly improved compared with its single pn junction counterpart. Moreover, it exhibits a fast response speed of 12 μs, and a broadband detection capability ranging from visible to mid-infrared wavelengths.
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Affiliation(s)
- Chen Luo
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
| | - Jianfeng Wu
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
- School of Integrated Circuits, Southeast University, Nanjing 210096, People's Republic of China
| | - Xinlei Zhang
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
| | - Qiang Fu
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
| | - Wenhui Wang
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
| | - Yuanfang Yu
- State Key Laboratory for Organic Electronics and Information Displays, Institute of Advanced Materials, School of Materials Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210023, People's Republic of China
| | - Peiyu Zeng
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
| | - Zhenhua Ni
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
- School of Electronic Science and Engineering, Southeast University, Nanjing 210096, People's Republic of China
| | - Jialin Zhang
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
| | - Junpeng Lu
- School of Physics, Key Laboratory of Quantum Materials and Devices of Ministry of Education, Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing 211189, People's Republic of China
- School of Electronic Science and Engineering, Southeast University, Nanjing 210096, People's Republic of China
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2
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Li K, Yao J, Zhao P, Luo Y, Ge X, Yang R, Cheng X, Miao X. Ovonic threshold switching-based artificial afferent neurons for thermal in-sensor computing. MATERIALS HORIZONS 2024; 11:2106-2114. [PMID: 38545857 DOI: 10.1039/d4mh00053f] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/08/2024]
Abstract
Artificial afferent neurons in the sensory nervous system inspired by biology have enormous potential for efficiently perceiving and processing environmental information. However, the previously reported artificial afferent neurons suffer from two prominent challenges: considerable power consumption and limited scalability efficiency. Herein, addressing these challenges, a bioinspired artificial thermal afferent neuron based on a N-doped SiTe ovonic threshold switching (OTS) device is presented for the first time. The engineered OTS device shows remarkable uniformity and robust endurance, ensuring the reliability and efficacy of the artificial afferent neurons. A substantially decreased leakage current of the SiTe OTS device by nitrogen doping results in ultra-low power consumption less than 0.3 nJ per spike for artificial afferent neurons. The inherent temperature response exhibited by N-doped SiTe OTS materials allows us to construct a highly compact artificial thermal afferent neuron over a wide temperature range. An edge detection task is performed to further verify its thermal perceptual computing function. Our work provides an insight into OTS-based artificial afferent neurons for electronic skin and sensory neurorobotics.
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Affiliation(s)
- Kai Li
- School of Integrated Circuits, Hubei Key Laboratory for Advanced Memories, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Jiaping Yao
- School of Integrated Circuits, Hubei Key Laboratory for Advanced Memories, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Peng Zhao
- School of Integrated Circuits, Hubei Key Laboratory for Advanced Memories, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Yunhao Luo
- School of Integrated Circuits, Hubei Key Laboratory for Advanced Memories, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Xiang Ge
- School of Integrated Circuits, Hubei Key Laboratory for Advanced Memories, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Rui Yang
- School of Integrated Circuits, Hubei Key Laboratory for Advanced Memories, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.
- Hubei Yangtze Memory Laboratories, Wuhan 430205, China
| | - Xiaomin Cheng
- School of Integrated Circuits, Hubei Key Laboratory for Advanced Memories, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.
- Hubei Yangtze Memory Laboratories, Wuhan 430205, China
| | - Xiangshui Miao
- School of Integrated Circuits, Hubei Key Laboratory for Advanced Memories, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China.
- Hubei Yangtze Memory Laboratories, Wuhan 430205, China
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3
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Li F, Li D, Wang C, Liu G, Wang R, Ren H, Tang Y, Wang Y, Chen Y, Liang K, Huang Q, Sawan M, Qiu M, Wang H, Zhu B. An artificial visual neuron with multiplexed rate and time-to-first-spike coding. Nat Commun 2024; 15:3689. [PMID: 38693165 PMCID: PMC11063071 DOI: 10.1038/s41467-024-48103-9] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/02/2023] [Accepted: 04/17/2024] [Indexed: 05/03/2024] Open
Abstract
Human visual neurons rely on event-driven, energy-efficient spikes for communication, while silicon image sensors do not. The energy-budget mismatch between biological systems and machine vision technology has inspired the development of artificial visual neurons for use in spiking neural network (SNN). However, the lack of multiplexed data coding schemes reduces the ability of artificial visual neurons in SNN to emulate the visual perception ability of biological systems. Here, we present an artificial visual spiking neuron that enables rate and temporal fusion (RTF) coding of external visual information. The artificial neuron can code visual information at different spiking frequencies (rate coding) and enables precise and energy-efficient time-to-first-spike (TTFS) coding. This multiplexed sensory coding scheme could improve the computing capability and efficacy of artificial visual neurons. A hardware-based SNN with the RTF coding scheme exhibits good consistency with real-world ground truth data and achieves highly accurate steering and speed predictions for self-driving vehicles in complex conditions. The multiplexed RTF coding scheme demonstrates the feasibility of developing highly efficient spike-based neuromorphic hardware.
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Affiliation(s)
- Fanfan Li
- School of Materials Science and Engineering, Zhejiang University, Hangzhou, China
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
| | - Dingwei Li
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
| | - Chuanqing Wang
- CenBRAIN Neurotech, School of Engineering, Westlake University, Hangzhou, China
| | - Guolei Liu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
| | - Rui Wang
- Key Laboratory of Wide Band Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xi'an, China
| | - Huihui Ren
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
| | - Yingjie Tang
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
| | - Yan Wang
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
| | - Yitong Chen
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
| | - Kun Liang
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
| | - Qi Huang
- Westlake Institute for Optoelectronics, Westlake University, Hangzhou, China
| | - Mohamad Sawan
- CenBRAIN Neurotech, School of Engineering, Westlake University, Hangzhou, China
- Westlake Institute for Optoelectronics, Westlake University, Hangzhou, China
- Institute of Advanced Technology, Westlake Institute for Advanced Study, Hangzhou, China
| | - Min Qiu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China
- Westlake Institute for Optoelectronics, Westlake University, Hangzhou, China
- Institute of Advanced Technology, Westlake Institute for Advanced Study, Hangzhou, China
| | - Hong Wang
- Key Laboratory of Wide Band Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xi'an, China.
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, China.
- Westlake Institute for Optoelectronics, Westlake University, Hangzhou, China.
- Institute of Advanced Technology, Westlake Institute for Advanced Study, Hangzhou, China.
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4
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Wu Y, Deng W, Li K, Wang X, Liu B, Li J, Chen Z, Zhang Y. A Spiking Artificial Vision Architecture Based on Fully Emulating the Human Vision. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2312094. [PMID: 38320173 DOI: 10.1002/adma.202312094] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/13/2023] [Revised: 01/29/2024] [Indexed: 02/08/2024]
Abstract
Intelligent vision necessitates the deployment of detectors that are always-on and low-power, mirroring the continuous and uninterrupted responsiveness characteristic of human vision. Nonetheless, contemporary artificial vision systems attain this goal by the continuous processing of massive image frames and executing intricate algorithms, thereby expending substantial computational power and energy. In contrast, biological data processing, based on event-triggered spiking, has higher efficiency and lower energy consumption. Here, this work proposes an artificial vision architecture consisting of spiking photodetectors and artificial synapses, closely mirroring the intricacies of the human visual system. Distinct from previously reported techniques, the photodetector is self-powered and event-triggered, outputting light-modulated spiking signals directly, thereby fulfilling the imperative for always-on with low-power consumption. With the spiking signals processing through the integrated synapse units, recognition of graphics, gestures, and human action has been implemented, illustrating the potent image processing capabilities inherent within this architecture. The results prove the 90% accuracy rate in human action recognition within a mere five epochs utilizing a rudimentary artificial neural network. This novel architecture, grounded in spiking photodetectors, offers a viable alternative to the extant models of always-on low-power artificial vision system.
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Affiliation(s)
- Yi Wu
- Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
- Key Laboratory of Optoelectronics Technology of Education Ministry of China, Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
| | - Wenjie Deng
- Key Laboratory of Optoelectronics Technology of Education Ministry of China, Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
| | - Kexin Li
- Key Laboratory of Optoelectronics Technology of Education Ministry of China, Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
| | - Xiaoting Wang
- Key Laboratory of Optoelectronics Technology of Education Ministry of China, Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
| | - Bo Liu
- Key Laboratory of Optoelectronics Technology of Education Ministry of China, Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
| | - Jingzhen Li
- Key Laboratory of Optoelectronics Technology of Education Ministry of China, Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
| | - Zhijie Chen
- Key Laboratory of Optoelectronics Technology of Education Ministry of China, Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
| | - Yongzhe Zhang
- Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
- Key Laboratory of Optoelectronics Technology of Education Ministry of China, Faculty of Information Technology, Beijing University of Technology, Beijing, 100124, China
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5
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Yan J, Ye K, Jia Z, Zhang Z, Li P, Liu L, Mu C, Huang H, Cheng Y, Nie A, Xiang J, Wang S, Liu Z. High-Performance Broadband Image Sensing Photodetector Based on MnTe/WS 2 van der Waals Epitaxial Heterostructures. ACS APPLIED MATERIALS & INTERFACES 2024; 16:19112-19120. [PMID: 38579811 DOI: 10.1021/acsami.4c00159] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/07/2024]
Abstract
Two-dimensional transition metal dichalcogenide (TMDC) heterostructure is receiving considerable attention due to its novel electronic, optoelectronic, and spintronic devices with design-oriented and functional features. However, direct design and synthesis of high-quality TMDC/MnTe heterostructures remain difficult, which severely impede further investigations of semiconductor/magnetic semiconductor devices. Herein, the synthesis of high-quality vertically stacked WS2/MnTe heterostructures is realized via a two-step chemical vapor deposition method. Raman, photoluminescence, and scanning transmission electron microscopy characterizations reveal the high-quality and atomically sharp interfaces of the WS2/MnTe heterostructure. WS2/MnTe-based van der Waals field effect transistors demonstrate high rectification behavior with rectification ratio up to 106, as well as a typical p-n electrical transport characteristic. Notably, the fabricated WS2/MnTe photodetector exhibits sensitive and broadband photoresponse ranging from UV to NIR with a maximum responsivity of 1.2 × 103 A/W, a high external quantum efficiency of 2.7 × 105%, and fast photoresponse time of ∼50 ms. Moreover, WS2/MnTe heterostructure photodetectors possess a broadband image sensing capability at room temperature, suggesting potential applications in next-generation high-performance and broadband image sensing photodetectors.
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Affiliation(s)
- Junxin Yan
- Center for High Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
| | - Kun Ye
- Center for High Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
- Anhui Key Laboratory of Magnetic Functional Materials and Devices, School of Materials Science and Engineering, Anhui University, Hefei 230601, China
- Institute of Quantum Materials and Devices, School of Electronics and Information Engineering, Tiangong University, Tianjin 300387, China
| | - Zhiyan Jia
- Institute of Quantum Materials and Devices, School of Electronics and Information Engineering, Tiangong University, Tianjin 300387, China
| | - Zeyu Zhang
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Penghui Li
- Center for High Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
| | - Lixuan Liu
- Institute of Quantum Materials and Devices, School of Electronics and Information Engineering, Tiangong University, Tianjin 300387, China
| | - Congpu Mu
- Center for High Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
| | - He Huang
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Yingchun Cheng
- Center for High Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
| | - Anmin Nie
- Center for High Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
| | - Jianyong Xiang
- Center for High Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
| | - Shouguo Wang
- Anhui Key Laboratory of Magnetic Functional Materials and Devices, School of Materials Science and Engineering, Anhui University, Hefei 230601, China
| | - Zhongyuan Liu
- Center for High Pressure Science (CHiPS), State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
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6
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Niu H, Li H, Zhang Q, Kim ES, Kim NY, Li Y. Intuition-and-Tactile Bimodal Sensing Based on Artificial-Intelligence-Motivated All-Fabric Bionic Electronic Skin for Intelligent Material Perception. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2024; 20:e2308127. [PMID: 38009787 DOI: 10.1002/smll.202308127] [Citation(s) in RCA: 3] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/16/2023] [Revised: 10/27/2023] [Indexed: 11/29/2023]
Abstract
Developing electronic skins (e-skins) with extraordinary perception through bionic strategies has far-reaching significance for the intellectualization of robot skins. Here, an artificial intelligence (AI)-motivated all-fabric bionic (AFB) e-skin is proposed, where the overall structure is inspired by the interlocked bionics of the epidermis-dermis interface inside the skin, while the structural design inspiration of the dielectric layer derives from the branch-needle structure of conifers. More importantly, AFB e-skin achieves intuition sensing in proximity mode and tactile sensing in pressure mode based on the fringing and iontronic effects, respectively, and is simulated and verified through COMSOL finite element analysis. The proposed AFB e-skin in pressure mode exhibits maximum sensitivity of 15.06 kPa-1 (<50 kPa), linear sensitivity of 6.06 kPa-1 (50-200 kPa), and fast response/recovery time of 5.6 ms (40 kPa). By integrating AFB e-skin with AI algorithm, and with the support of material inference mechanisms based on dielectric constant and softness/hardness, an intelligent material perception system capable of recognizing nine materials with indistinguishable surfaces within one proximity-pressure cycle is established, demonstrating abilities that surpass human perception.
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Affiliation(s)
- Hongsen Niu
- School of Microelectronics, Shandong University, Jinan, 250101, China
- RFIC Centre, Kwangwoon University, Seoul, 01897, South Korea
| | - Hao Li
- School of Microelectronics, Shandong University, Jinan, 250101, China
| | - Qichong Zhang
- Key Laboratory of Multifunctional Nanomaterials and Smart Systems, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, China
| | - Eun-Seong Kim
- RFIC Centre, Kwangwoon University, Seoul, 01897, South Korea
| | - Nam-Young Kim
- RFIC Centre, Kwangwoon University, Seoul, 01897, South Korea
| | - Yang Li
- School of Microelectronics, Shandong University, Jinan, 250101, China
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7
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Wang F, Zhu S, Chen W, Han J, Duan R, Wang C, Dai M, Sun F, Jin Y, Wang QJ. Multidimensional detection enabled by twisted black arsenic-phosphorus homojunctions. NATURE NANOTECHNOLOGY 2024; 19:455-462. [PMID: 38225358 DOI: 10.1038/s41565-023-01593-y] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/04/2023] [Accepted: 12/12/2023] [Indexed: 01/17/2024]
Abstract
A light field carrying multidimensional optical information, including but not limited to polarization, intensity and wavelength, is essential for numerous applications such as environmental monitoring, thermal imaging, medical diagnosis and free-space communications. Simultaneous acquisition of this multidimensional information could provide comprehensive insights for understanding complex environments but remains a challenge. Here we demonstrate a multidimensional optical information detection device based on zero-bias double twisted black arsenic-phosphorus homojunctions, where the photoresponse is dominated by the photothermoelectric effect. By using a bipolar and phase-offset polarization photoresponse, the device operated in the mid-infrared range can simultaneously detect both the polarization angle and incident intensity information through direct measurement of the photocurrents in the double twisted black arsenic-phosphorus homojunctions. The device's responsivity makes it possible to retrieve wavelength information, typically perceived as difficult to obtain. Moreover, the device exhibits an electrically tunable polarization photoresponse, enabling precise distinction of polarization angles under low-intensity light exposure. These demonstrations offer a promising approach for simultaneous detection of multidimensional optical information, indicating potential for diverse photonic applications.
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Affiliation(s)
- Fakun Wang
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore
| | - Song Zhu
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore
| | - Wenduo Chen
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore
| | - Jiayue Han
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore
| | - Ruihuan Duan
- School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore
| | - Chongwu Wang
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore
| | - Mingjin Dai
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore
| | - Fangyuan Sun
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore
| | - Yuhao Jin
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore
| | - Qi Jie Wang
- School of Electrical & Electronic Engineering, Nanyang Technological University, Singapore, Singapore.
- Centre for Disruptive Photonic Technologies, School of Physical and Mathematical Sciences, Nanyang Technological University, Singapore, Singapore.
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8
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Chen Z, Lin Z, Yang J, Chen C, Liu D, Shan L, Hu Y, Guo T, Chen H. Cross-layer transmission realized by light-emitting memristor for constructing ultra-deep neural network with transfer learning ability. Nat Commun 2024; 15:1930. [PMID: 38431669 PMCID: PMC10908859 DOI: 10.1038/s41467-024-46246-3] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/14/2023] [Accepted: 02/20/2024] [Indexed: 03/05/2024] Open
Abstract
Deep neural networks have revolutionized several domains, including autonomous driving, cancer detection, and drug design, and are the foundation for massive artificial intelligence models. However, hardware neural network reports still mainly focus on shallow networks (2 to 5 layers). Implementing deep neural networks in hardware is challenging due to the layer-by-layer structure, resulting in long training times, signal interference, and low accuracy due to gradient explosion/vanishing. Here, we utilize negative ultraviolet photoconductive light-emitting memristors with intrinsic parallelism and hardware-software co-design to achieve electrical information's optical cross-layer transmission. We propose a hybrid ultra-deep photoelectric neural network and an ultra-deep super-resolution reconstruction neural network using light-emitting memristors and cross-layer block, expanding the networks to 54 and 135 layers, respectively. Further, two networks enable transfer learning, approaching or surpassing software-designed networks in multi-dataset recognition and high-resolution restoration tasks. These proposed strategies show great potential for high-precision multifunctional hardware neural networks and edge artificial intelligence.
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Affiliation(s)
- Zhenjia Chen
- Institute of Optoelectronic Display, National & Local United Engineering Lab of Flat Panel Display Technology, Fuzhou University, Fuzhou, 350002, China
- Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
| | - Zhenyuan Lin
- Institute of Optoelectronic Display, National & Local United Engineering Lab of Flat Panel Display Technology, Fuzhou University, Fuzhou, 350002, China
- Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
| | - Ji Yang
- College of Computer and Data Science, Fuzhou University, Fuzhou, Fujian, China
| | - Cong Chen
- Institute of Optoelectronic Display, National & Local United Engineering Lab of Flat Panel Display Technology, Fuzhou University, Fuzhou, 350002, China
- Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
| | - Di Liu
- Institute of Optoelectronic Display, National & Local United Engineering Lab of Flat Panel Display Technology, Fuzhou University, Fuzhou, 350002, China
- Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
| | - Liuting Shan
- Institute of Optoelectronic Display, National & Local United Engineering Lab of Flat Panel Display Technology, Fuzhou University, Fuzhou, 350002, China
- Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
| | - Yuanyuan Hu
- Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha, 410082, China
| | - Tailiang Guo
- Institute of Optoelectronic Display, National & Local United Engineering Lab of Flat Panel Display Technology, Fuzhou University, Fuzhou, 350002, China
- Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China
| | - Huipeng Chen
- Institute of Optoelectronic Display, National & Local United Engineering Lab of Flat Panel Display Technology, Fuzhou University, Fuzhou, 350002, China.
- Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China.
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9
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Pang X, Wang Y, Zhu Y, Zhang Z, Xiang D, Ge X, Wu H, Jiang Y, Liu Z, Liu X, Liu C, Hu W, Zhou P. Non-volatile rippled-assisted optoelectronic array for all-day motion detection and recognition. Nat Commun 2024; 15:1613. [PMID: 38383735 PMCID: PMC10881999 DOI: 10.1038/s41467-024-46050-z] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/28/2023] [Accepted: 02/13/2024] [Indexed: 02/23/2024] Open
Abstract
In-sensor processing has the potential to reduce the energy consumption and hardware complexity of motion detection and recognition. However, the state-of-the-art all-in-one array integration technologies with simultaneous broadband spectrum image capture (sensory), image memory (storage) and image processing (computation) functions are still insufficient. Here, macroscale (2 × 2 mm2) integration of a rippled-assisted optoelectronic array (18 × 18 pixels) for all-day motion detection and recognition. The rippled-assisted optoelectronic array exhibits remarkable uniformity in the memory window, optically stimulated non-volatile positive and negative photoconductance. Importantly, the array achieves an extensive optical storage dynamic range exceeding 106, and exceptionally high room-temperature mobility up to 406.7 cm2 V-1 s-1, four times higher than the International Roadmap for Device and Systems 2028 target. Additionally, the spectral range of each rippled-assisted optoelectronic processor covers visible to near-infrared (405 nm-940 nm), achieving function of motion detection and recognition.
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Affiliation(s)
- Xingchen Pang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China
| | - Yang Wang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China.
- State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, 200083, China.
- Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University, Shanghai, 200433, China.
| | - Yuyan Zhu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China
| | - Zhenhan Zhang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China
| | - Du Xiang
- State Key Laboratory of Integrated Chip and System, Frontier Institute of Chip and System, Fudan University, Shanghai, 200433, China.
- Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.
- Shanghai Qi Zhi Institute, Shanghai, 200232, China.
| | - Xun Ge
- State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, 200083, China
| | - Haoqi Wu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China
| | - Yongbo Jiang
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China
| | - Zizheng Liu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China
| | - Xiaoxian Liu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China
| | - Chunsen Liu
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China
- State Key Laboratory of Integrated Chip and System, Frontier Institute of Chip and System, Fudan University, Shanghai, 200433, China
| | - Weida Hu
- State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, 200083, China.
| | - Peng Zhou
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, 200433, China.
- Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University, Shanghai, 200433, China.
- State Key Laboratory of Integrated Chip and System, Frontier Institute of Chip and System, Fudan University, Shanghai, 200433, China.
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10
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Liu A, Zhang X, Liu Z, Li Y, Peng X, Li X, Qin Y, Hu C, Qiu Y, Jiang H, Wang Y, Li Y, Tang J, Liu J, Guo H, Deng T, Peng S, Tian H, Ren TL. The Roadmap of 2D Materials and Devices Toward Chips. NANO-MICRO LETTERS 2024; 16:119. [PMID: 38363512 PMCID: PMC10873265 DOI: 10.1007/s40820-023-01273-5] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/30/2023] [Accepted: 10/30/2023] [Indexed: 02/17/2024]
Abstract
Due to the constraints imposed by physical effects and performance degradation, silicon-based chip technology is facing certain limitations in sustaining the advancement of Moore's law. Two-dimensional (2D) materials have emerged as highly promising candidates for the post-Moore era, offering significant potential in domains such as integrated circuits and next-generation computing. Here, in this review, the progress of 2D semiconductors in process engineering and various electronic applications are summarized. A careful introduction of material synthesis, transistor engineering focused on device configuration, dielectric engineering, contact engineering, and material integration are given first. Then 2D transistors for certain electronic applications including digital and analog circuits, heterogeneous integration chips, and sensing circuits are discussed. Moreover, several promising applications (artificial intelligence chips and quantum chips) based on specific mechanism devices are introduced. Finally, the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed, and potential development pathways or roadmaps are further speculated and outlooked.
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Affiliation(s)
- Anhan Liu
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China
| | - Xiaowei Zhang
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China
| | - Ziyu Liu
- School of Microelectronics, Fudan University, Shanghai, 200433, People's Republic of China
| | - Yuning Li
- School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, 100044, People's Republic of China
| | - Xueyang Peng
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, People's Republic of China
- School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing, 100049, People's Republic of China
| | - Xin Li
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China
| | - Yue Qin
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China
| | - Chen Hu
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, People's Republic of China
- School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing, 100049, People's Republic of China
| | - Yanqing Qiu
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, People's Republic of China
- School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing, 100049, People's Republic of China
| | - Han Jiang
- School of Microelectronics, Fudan University, Shanghai, 200433, People's Republic of China
| | - Yang Wang
- School of Microelectronics, Fudan University, Shanghai, 200433, People's Republic of China
| | - Yifan Li
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China
| | - Jun Tang
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China
| | - Jun Liu
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China
| | - Hao Guo
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China.
| | - Tao Deng
- School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, 100044, People's Republic of China.
| | - Songang Peng
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, People's Republic of China.
- IMECAS-HKUST-Joint Laboratory of Microelectronics, Beijing, 100029, People's Republic of China.
| | - He Tian
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China.
| | - Tian-Ling Ren
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China.
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