Silicon Photonics Transmitter with SOA and Semiconductor Mode-Locked Laser

Sub-wavelength tunneling barrier in rib waveguide microring modulators with vanishing bending losses

Silicon photonics ring resonators in rib waveguide configuration are among the most important components for wavelength-division-multiplexed communication networks. While the rib waveguide enables simple electrical connectivity in microring modulators and add-drop multiplexers, it also results in unacceptable bending losses once the circumference is shrunk below a few micrometers, limiting achievable free spectral ranges and resonant enhancements. We introduce a sub-wavelength tunneling barrier at the critical radius at which the conformally mapped effective index of the slab exceeds that of the waveguide in order to suppress these bending losses, while increasing the resonator's resistance only slightly. The fundamental working principle is explained and illustrated with a design study based on the finite difference eigenmode method. Three-dimensional finite difference time domain simulations verify the design and a proof-of-concept microring modulator is modeled based on the novel geometry.

High-speed silicon microresonator modulators with high optical modulation amplitude (OMA) at input powers >10 mW

A high-speed silicon photonic microdisc modulator is used with more than 10 mW optical power in the bus waveguide, extending the optical power handling regime used with compact silicon resonant modulators at 1550 nm. We present an experimental study of the wavelength tuning range and biasing path required to shift the resonant frequency to the optimal point versus on chip power. We measure the optical modulation amplitude (OMA) along different biasing trajectories of the microdisc under active modulation and demonstrate an OMA of 4.1 mW with 13.5 mW optical power in the bus waveguide at 20 Gbit/s non-return to zero (NRZ) data modulation.

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography

Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. As a key advantage, the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips, thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision alignment. However, while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments, it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability requirements. In this paper, we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode fibres. In a first experiment, we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation. A second experiment is dedicated to a four-channel coherent transmitter, operating at a net data rate of 732.7 Gbit/s - a record for coherent silicon photonic transmitters with co-packaged lasers. Using dedicated test chips, we further demonstrate automated mass production of photonic wire bonds with insertion losses of (0.7 ± 0.15) dB, and we show their resilience in environmental-stability tests and at high optical power. These results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

8-channel WDM silicon photonics transceiver with SOA and semiconductor mode-locked laser

We demonstrate an integrated 8 by 14 Gbps dense wavelength division multiplexed silicon photonics transceiver that makes use of an external mode-locked laser as a light source and a single semiconductor optical amplifier for post-modulation signal amplification. Remaining components necessary for modulation, filtering and (de‑)multiplexing are monolithically integrated in a single chip. In all system experiments, all eight channels are jointly operated with independent data streams in order to include impairments arising out of nonlinear effects inside the SOA while benchmarking the system performance. The transmitter, measured with a commercial reference receiver, supports on-off keying data transmission with an uncorrected BER ranging between 1e-5 and 5e-7 for all channels in back-to-back configuration and between 8e-4 and 1e-5 after 10 km transmission (both PRBS 2³¹-1). The three best channels of the full link consisting in the silicon photonics transmitter operated with the silicon photonics receiver in back-to-back configuration maintain a BER better than the targeted 5e-5. Based on link budget modeling, we expect this target to be reached for all 8 channels pending improvement of the receiver offset compensation loop.

Wideband multi-stage CROW filters with relaxed fabrication tolerances

We present wideband and large free spectral range optical filters with steep passband edges for the selection of adjacent WDM communication channels that can be reliably fabricated with mainstream silicon photonics technology. The devices are based on three cascaded stages of coupled resonator optical waveguides loaded on a common bus waveguide. These stages differ in the number of resonators but are implemented with exactly identical unit cells, comprised of a matched racetrack resonator layout and a uniform spacing between cells. The different number of resonators in each stage allows a high rejection in the through port response enabled by the interleaved distribution of zeros. Furthermore, the exact replication of a unique cell avoids the passband ripple and high lobes in the stopband that typically arise in apodized coupled resonator optical waveguide based filters due to fabrication and coupling induced variations in the effective path length of each resonator. Silicon photonics filters designed for the selection of 9 adjacent optical carriers generated by a 100 GHz free spectral range comb laser have been successfully fabricated with 248 nm DUV lithography, achieving an out-of-band rejection above 11 dB and an insertion loss of less than 0.5 dB for the worst channels.

Calibrated Link Budget of a Silicon Photonics WDM Transceiver with SOA and Semiconductor Mode-Locked Laser

Based on the single channel characterization of a Silicon Photonics (SiP) transceiver with Semiconductor Optical Amplifier (SOA) and semiconductor Mode-Locked Laser (MLL), we evaluate the optical power budget of a corresponding Wavelength Division Multiplexed (WDM) link in which penalties associated to multi-channel operation and the management of polarization diversity are introduced. In particular, channel cross-talk as well as Cross Gain Modulation (XGM) and Four Wave Mixing (FWM) inside the SOA are taken into account. Based on these link budget models, the technology is expected to support up to 12 multiplexed channels without channel pre-emphasis or equalization. Forward Error Correction (FEC) does not appear to be required at 14 Gbps if the SOA is maintained at 25 °C and MLL-to-SiP as well as SiP-to-SOA interface losses can be maintained below 3 dB. In semi-cooled operation with an SOA temperature below 55 °C, multi-channel operation is expected to be compatible with standard 802.3bj Reed-Solomon FEC at 14 Gbps provided interface losses are maintained below 4.5 dB. With these interface losses and some improvements to the Transmitter (Tx) and Receiver (Rx) electronics, 25 Gbps multi-channel operation is expected to be compatible with 7% overhead hard decision FEC.