Thermo-mechanical improvement of Inconel 718 using ex situ boron nitride-reinforced composites processed by laser powder bed fusion

Phase prediction, microstructure, and mechanical properties of spark plasma sintered Ni-Al-Ti-Mn-Co-Fe-Cr high entropy alloys

The effect of mechanical alloying on the development of Ni-Al-Ti-Mn-Co-Fe-Cr high entropy alloys (HEAs) utilizing the spark plasma sintering (SPS) method is the main goal of this study. A bulk sample was fabricated using SPS after the alloys were mixed for 12 h. Thermodynamic simulation, X-ray diffraction, scanning electron microscopy, nanoindentation, and microhardness were used to investigate the microstructure and mechanical properties of the as-mixed powders. The master alloy was made of NiAl and was subsequently alloyed with Ti, Mn, Co, Fe, and Cr at different compositions to develop HEAs at a sintering temperature of 850 °C, a heating rate of 100 °C/min, a pressure of 50 MPa, and a dwelling time of 5 min. A uniform dispersion of the alloying material can be seen in the microstructure of the sintered HEAs with different weight elements. The grain size analysis shows that the Ni25Al25Ti8Mn8Co15Fe14Cr5 alloy exhibited a refined structure with a grain size of 2.36 ± 0.27 µm compared to a coarser grain size of 8.26 ± 0.43 μm attained by the NiAl master alloy. Similarly, the HEAs with the highest alloying content had a greater microstrain value of 0.0449 ± 0.0036, whereas the unalloyed NiAl had 0.00187 ± 0.0005. Maximum microhardness of 139 ± 0.8 HV, nanohardness of 18.8 ± 0.36 GPa, elastic modulus of 207.5 ± 1.65 GPa, elastic recovery (We/Wt) of 0.556 ± 0.035, elastic strain to failure (H/Er) of 0.09.06 ± 0.0027, yield pressure (H3/[Formula: see text]) of 0.154 ± 0.0055 GPa, and the least plasticity index (Wp/Wt) of 0.444 ± 0.039 were attained by Ni25Al25Ti8Mn8Co15Fe14Cr5. A steady movement to the left may be seen in the load-displacement curve. Increased resistance to indentation by the developed HEAs was made possible by the increase in alloying metals, which ultimately led to higher nanohardness and elastic modulus.

The Structure and Properties of Laser-Cladded Inconel 625/TiC Composite Coatings

This article presents production results concerning metal matrix composite-coatings made using the laser-cladding technology. The enhancement of the wear resistance of the material surface is the one of the main goals accompanying the manufacturing of composite coatings. Nickel-based superalloys are used in several industries because they are characterized by a number of desirable properties including high tensile and fatigue strength as well as resistance to high-temperature corrosion in aggressive environments. One of the most interesting materials from the group of superalloys is Inconel 625, used as a matrix material in tests discussed in this article. However, nickel-based superalloys are also characterized by an insufficient wear resistance of the surface, therefore, in relation to the tests discussed in this article, Inconel 625-based composite coatings were reinforced by adding 10%, 20% and 40% of titanium carbide particles. The addition of hard phases, i.e., TiC, WC or SiC particles can have a positive effect on the erosion resistance of cladded specimens. The aim of the experiment was to determine the impact of the titanium carbide content on the structure of the alloy and its resistance to corrosive wear, enabling the extension of the service life of Inconel 625/TiC composite coatings. The investigation included microhardness tests, corrosion resistance analysis, penetrant tests, macrostructure and microstructure analyses and X-ray diffraction (XRD) tests. The TiC particles increased the hardness of the coatings and, in general, had a negative impact on the corrosion resistance of pure Inconel 625 coatings. However, the increased homogeneity of composite coatings translated into the improvement of corrosion resistance.

Recent Progress in Fabrication and Application of BN Nanostructures and BN-Based Nanohybrids

Due to its unique physical, chemical, and mechanical properties, such as a low specific density, large specific surface area, excellent thermal stability, oxidation resistance, low friction, good dispersion stability, enhanced adsorbing capacity, large interlayer shear force, and wide bandgap, hexagonal boron nitride (h-BN) nanostructures are of great interest in many fields. These include, but are not limited to, (i) heterogeneous catalysts, (ii) promising nanocarriers for targeted drug delivery to tumor cells and nanoparticles containing therapeutic agents to fight bacterial and fungal infections, (iii) reinforcing phases in metal, ceramics, and polymer matrix composites, (iv) additives to liquid lubricants, (v) substrates for surface enhanced Raman spectroscopy, (vi) agents for boron neutron capture therapy, (vii) water purifiers, (viii) gas and biological sensors, and (ix) quantum dots, single photon emitters, and heterostructures for electronic, plasmonic, optical, optoelectronic, semiconductor, and magnetic devices. All of these areas are developing rapidly. Thus, the goal of this review is to analyze the critical mass of knowledge and the current state-of-the-art in the field of BN-based nanomaterial fabrication and application based on their amazing properties.

Chemical vapor deposition (DLI-CVD) and characterization of multiphasic molybdate-based catalysts for propene oxidation

Deposition by DLI-CVD of a multi-element BiFeCoMo catalyst in the millimetric channels of a monolithic reactor has been achieved. When tested for the oxidation of propene to acrolein the reactors with various coatings are efficient but need to be optimized.

The Influence of the Process Parameters on the Densification and Microstructure Development of Laser Powder Bed Fused Inconel 939

This work aims to investigate the effect of the process parameters on the densification and microstructure of Inconel 939 (IN939) alloy processed by laser powder bed fusion (LPBF). IN939 is a Ni-based superalloy with high creep and corrosion resistance that can be used up to around 850 °C under load, resulting in higher operative temperatures than the ones commonly allowed for Inconel 718 and Inconel 625 alloys (around 650 °C). However, this alloy can suffer from poor weldability involving possible crack formation. In order to minimize the residual porosity and the cracking density, specific process parameters were investigated. The parameters to generate IN939 samples almost pores-free (porosity ≤0.22%) with a cracking density ≤1.36 mm/mm2 as well as samples almost crack-free (≤0.10 mm/mm2) with limited residual porosity (≤0.89%) were determined. The microstructure revealed fine dendritic/cellular structures with the formation of sub-micrometric phases. A high concentration of these phases was also found along the intergranular cracks, suggesting that their presence, coupled to the high thermal stresses, can be the primary reason for crack formation during the LPBF process.

Fine Microstructured In-Sn-Bi Solder for Adhesion on a Flexible PET Substrate: Its Effect on Superplasticity and Toughness

A novel In-Sn-Bi solder with a low electrical resistivity of 14.3 × 10^-6 Ω cm and a melting temperature of 99.3 °C was produced for use in adhesive joining on a flexible poly(ethylene terephthalate) substrate. We determined that the fine microstructure of the In-based solder (which had an average phase size of 62.2 nm) strongly influenced its superplasticity and toughness at diffusive temperatures of 55-85 °C because the late-forming BiIn intermetallic compound (IMC) suppressed the growth of two other IMCs, In₃Sn and In_0.2Sn_0.8, which formed earlier in the soldering process. Thus, an elongation of 858.3% and toughness of 36.0 MPa were obtained at a temperature of 85 °C and a strain rate of 0.0020 s^-1. However, due to phase boundary fracturing, the phase-refined solder exhibited a slightly more brittle nature (with an elongation of 74.3%) at room temperature compared with a standard In-Sn solder consisting only of the In₃Sn and In_0.2Sn_0.8 IMCs, which had a slightly larger phase size of 84.9 nm and higher ductility (with an elongation of 80.7%). In terms of superplastic deformation, the conventional fracture system based on the Hall-Petch effect transformed into phase boundary sliding at the solder operating temperature, significantly enhancing ductility.

A Modular Solder System with Hierarchical Morphology and Backward Compatibility

A modular solder system with hierarchical morphology and micro/nanofeatures in which solder nanoparticles are distributed on the surface of template micropowders is reported. A core-shell structure of subsidiary nanostructures, which improved the intended properties of the modular solder is also presented. In addition, polymer additives can be used not only as an adhesive (like epoxy resin) but also to impart other functions. By combining all of these, it is determined that the modular solder system is able to increase reflowability on a heat-sensitive plastic substrate, oxidation resistance, and electrical conductivity. In this respect, the system could be readily modified by changing the structure and composition of each constituent and adopting backward compatibility with which the knowledge and information attained from a previously designed solder can offer feedback toward further improving the properties of a newly designed one. In practice, In-Sn-Bi nanoparticles engineered on the surface of Sn-Zn micropowders result in pronounced reflowing on a flexible Au-coated polyethylene terephthalate (PET) substrate even at the low temperature of 110 °C. Depending on their respective concentrations, the incorporation of CuO@CeO2 nanostructures and poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) polymers increases oxidation resistance and electrical conductivity of the modular solder.