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Das RN, Bolkhovsky V, Wynn A, Birenbaum J, Golden E, Rastogi R, Zarr S, Tyrrell B, Johnson LM, Schwartz ME, Yoder JL, Juodawlkis PW. Extremely large area (88 mm × 88 mm) superconducting integrated circuit (ELASIC). Sci Rep 2023; 13:11796. [PMID: 37479799 PMCID: PMC10361992 DOI: 10.1038/s41598-023-39032-6] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/17/2023] [Accepted: 07/19/2023] [Indexed: 07/23/2023] Open
Abstract
Superconducting integrated circuit is a promising "beyond-CMOS" device technology enables speed-of-light, nearly lossless communications to advance cryogenic (4 K or lower) computing. However, the lack of large-area superconducting IC has hindered the development of scalable practical systems. Herein, we describe a novel approach to interconnect 16 high-resolution deep UV (DUV EX4, 248 nm lithography) full reticle circuits to fabricate an extremely large (88 mm × 88 mm) area superconducting integrated circuit (ELASIC). The fabrication process starts by interconnecting four high-resolution DUV EX4 (22 mm × 22 mm) full reticles using a single large-field (44 mm × 44 mm) I-line (365 nm lithography) reticle, followed by I-line reticle stitching at the boundaries of 44 mm × 44 mm fields to fabricate the complete ELASIC field (88 mm × 88 mm). The ELASIC demonstrated a 2X-12X reduction in circuit features and maintained high-stitched line superconducting critical currents. We examined quantum flux parametron circuits to demonstrate the viability of common active components used for data buffering and transmission. Considering that no stitching requirement for high-resolution EX4 DUV reticles is employed, the present fabrication process has the potential to advance the scaling of superconducting qubits and other tri-layer junction-based devices.
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Affiliation(s)
- Rabindra N Das
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA.
| | - Vladimir Bolkhovsky
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Alex Wynn
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Jeffrey Birenbaum
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Evan Golden
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Ravi Rastogi
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Scott Zarr
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Brian Tyrrell
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Leonard M Johnson
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Mollie E Schwartz
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Jonilyn L Yoder
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
| | - Paul W Juodawlkis
- Quantum Information and Integrated Nanosystems Group, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, 02421, USA
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A Mini Review on Thin Film Superconductors. Processes (Basel) 2022. [DOI: 10.3390/pr10061184] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022] Open
Abstract
Thin superconducting films have been a significant part of superconductivity research for more than six decades. They have had a significant impact on the existing consensus on the microscopic and macroscopic nature of the superconducting state. Thin-film superconductors have properties that are very different and superior to bulk material. Amongst the various classification criteria, thin-film superconductors can be classified into Fe based thin-film superconductors, layered titanium compound thin-film superconductors, intercalation compounds of layered and cage-like structures, and other thin-film superconductors that do not fall into these groups. There are various techniques of manufacturing thin films, which include atomic layer deposition (ALD), chemical vapour deposition (CVD), physical vapour deposition (PVD), molecular beam epitaxy (MBE), sputtering, electron beam evaporation, laser ablation, cathodic arc, and pulsed laser deposition (PLD). Thin film technology offers a lucrative scheme of creating engineered surfaces and opens a wide exploration of prospects to modify material properties for specific applications, such as those that depend on surfaces. This review paper reports on the different types and groups of superconductors, fabrication of thin-film superconductors by MBE, PLD, and ALD, their applications, and various challenges faced by superconductor technologies. Amongst all the thin film manufacturing techniques, more focus is put on the fabrication of thin film superconductors by atomic layer deposition because of the growing popularity the process has gained in the past decade.
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