The Influence of Copper on Halogenation/Dehalogenation Reactions of Aromatic Compounds and Its Role in the Destruction of Polyhalogenated Aromatic Contaminants

The effect of copper and its compounds on halogenation and dehalogenation of aromatic compounds will be discussed in the proposed article. Cu oxidized to appropriate halides is an effective halogenation catalyst not only for the synthesis of halogenated benzenes or their derivatives as desired organic fine chemicals, but is also an effective catalyst for the undesirable formation of thermodynamically stable and very toxic polychlorinated and polybrominated aromatic compounds such as polychlorinated biphenyls, dibenzo-p-dioxins and dibenzofurans accompanied incineration of waste contaminated with halogenated compounds or even inorganic halides. With appropriate change in reaction conditions, copper and its alloys or oxides are also able to effectively catalyze dehalogenation reactions, as will be presented in this review.

Surface Characterization and Corrosion Behavior of 90/10 Copper-Nickel Alloy in Marine Environment

Surface characterization and corrosion behavior of 90/10 copper-nickel alloy in seawater from Xiamen bay at 30 °C for 56 days were investigated in this study. The results indicated that the corrosion product layer was mainly a mixture of CuO, Cu₂O, and Cu(OH)₂, with a transition to CuCl, CuCl₂, and Cu₂(OH)₃Cl during the corrosion process. However, as corrosion proceeds, the resistance of the product film was reduced due to its heterogeneous and fairly porous structures, which led to local corrosion of the alloy. The corrosion potentials (E_corr) increase while corrosion current densities (I_corr) decrease with time because of the formation of protective oxide film.

Chloride-induced morphology transformations of the Cu(110) surface in dilute HCl

Morphological changes of a bare Cu(110) substrate in 10 mM HCl aqueous solution have been studied using cyclic voltammetry (CV), electrochemical scanning tunneling microscopy (EC-STM), and reflectance anisotropy spectroscopy (RAS). At cathodic potentials more positive than the hydrogen evolution reaction, a bare copper surface (1 × 1) structure is found by EC-STM. At anodic potentials more negative than the copper(II) dissolution reaction, a furrowed structure is found. The governing factor that rules Cu(110)-Cl interface processes is discussed as an interplay among Cl(-) adsorption/desorption, the dynamic rearrangement of the surface atoms on the substrate, and strain in order to reduce the surface energy. The information provided by EC-STM and RAS complements that of CV, supplies detailed information on the surface morphology, and correlates peaking Faraday currents to structural modifications. Furthermore, RAS and EC-STM show changes in the surface appearance in a potential range where no specific charge transfer is observed. CV indicates that the Cu(110) surface chemistry compares much better to that of amorphous Cu than to that of the more stable (100) and (111) surfaces, respectively.