Room temperature processed protective layer for printed silver electrodes

Low-temperature processed printed silver electrodes pave the way for electrical connections in flexible substrates with reduced energy consumption. Despite their excellent performance and simple process, printed silver electrodes' poor stability limits their applications. This study demonstrates a transparent protective layer without thermal annealing for printed silver electrodes, which maintains its electrical properties for a long period of time. A fluoropolymer, specifically a cyclic transparent optical polymer (CYTOP), was used as a protective layer for silver. The CYTOP is room temperature processable and chemically stable against carboxyl acid. The introduction of the CYTOP film on the printed silver electrodes mitigates the chemical reaction between silver and carboxyl acid, thereby elongating its lifetime. Under heated acetic acid, the printed silver electrodes with a CYTOP protective layer maintained their initial resistance for up to 300 hours, while the electrodes without a protective layer were damaged within a few hours. A microscopic image shows that the protective layer enables printed electrodes to maintain their shape without damage. Hence, the protective layer guarantees the accurate and reliable performance of electronic devices with printed electrodes under actual operating conditions. This research will contribute to designing chemically reliable flexible devices in the near future.

3D printed electronics with nanomaterials

A large variety of printing, deposition and writing techniques have been incorporated to fabricate electronic devices in the last decades. This approach, printed electronics, has gained great interest in research and practical applications and is successfully fuelling the growth in materials science and technology. On the other hand, a new player is emerging, additive manufacturing, called 3D printing, introducing a new capability to create geometrically complex constructs with low cost and minimal material waste. Having such tremendous technology in our hands, it was just a matter of time to combine advances of printed electronics technology for the fabrication of unique 3D structural electronics. Nanomaterial patterning with additive manufacturing techniques can enable harnessing their nanoscale properties and the fabrication of active structures with unique electrical, mechanical, optical, thermal, magnetic and biological properties. In this paper, we will briefly review the properties of selected nanomaterials suitable for electronic applications and look closer at the current achievements in the synergistic integration of nanomaterials with additive manufacturing technologies to fabricate 3D printed structural electronics. The focus is fixed strictly on techniques allowing as much as possible fabrication of spatial 3D objects, or at least conformal ones on 3D printed substrates, while only selected techniques are adaptable for 3D printing of electronics. Advances in the fabrication of conductive paths and circuits, passive components, antennas, active and photonic components, energy devices, microelectromechanical systems and sensors are presented. Finally, perspectives for development with new nanomaterials, multimaterial and hybrid techniques, bioelectronics, integration with discrete components and 4D-printing are briefly discussed.

Facile and scalable fabrication of self-assembled Cu architecture with superior antioxidative properties and improved sinterability as a conductive ink for flexible electronics

The inherent susceptibility to oxidation and poor sinterability significantly limit the practical application of Cu-based conductive inks. Most methodologies employed for the inks like organic polymer coatings and inorganic metal deposition are generally ineffective. Herein, we report the design of a novel hierarchical Cu architecture to simultaneously improve the antioxidative and sinterability via a self-passivation mechanism and loose interior structures. The hierarchical Cu architecture was prepared using copper hydroxide, L-ascorbic acid, and polyvinylpyrrolidone in aqueous solution; 40 g Cu were prepared in a scale-up experiment. A possible growth mechanism is proposed, involving the Cu₂O-templated and mediated nucleation and growth of Cu nanocrystals, followed by the PVP-directed electrostatic self-assembly of Cu nanocrystals. The synthesized Cu shows high oxidation resistance after stored in ambient environment for 90 d by self-passivation, wherein the dense oxidized external layer prevented further oxidation of Cu, unlike other antioxidative strategies. In addition, the structure became 2D flake after a simple ball-milling for 10 min of 2000r, thus forming a good conductive network at the temperature of 180 °C. Importantly, no obvious decline in the electrical performance after severe surface oxidation. Although the structure cannot offer excellent conductive performance, but it proposes a new solution for the balance of antioxidative capabilities and good sinterability in Cu nanomaterials, thus facilitating greater utilization of Cu-based conductive inks for emerging flexible electronic applications.

Printed Thin-Film Transistors: Research from China

Thin-film transistors (TFTs) have experienced tremendous development during the past decades and show great promising applications in flat displays, sensors, radio frequency identification tags, logic circuit, and so on. The printed TFTs are the key components for rapid development and commercialization of printed electronics. The researchers in China play important roles to accelerate the development and commercialization of printed TFTs. In this review, we comprehensively summarize the research progress of printed TFTs on rigid and flexible substrates from China. The review will focus on printing techniques of TFTs, printed TFT components including semiconductors, dielectrics and electrodes, as well as fully printed TFTs and printed flexible TFTs. Furthermore, perspectives on the remaining challenges and future developments are proposed.

Integration of Heterogeneous Materials for Wearable Sensors

Wearable sensors are of interest for several application areas, most importantly for their potential to allow for the design of personal continuous health monitoring systems. For wearable sensors, flexibility is required and imperceptibility is desired. Wearable sensors must be robust to strain, motion, and environmental exposure. A number of different strategies have been utilized to achieve flexibility, imperceptibility, and robustness. All of these approaches require the integration of materials having a range of chemical, mechanical, and thermal properties. We have given a concise review of the range of materials that must be incorporated in wearable sensors regardless of the strategies adopted to achieve wearability. We first describe recent advances in the range of wearable sensing materials and their processing requirements and then discuss the potential routes to the integration of these heterogeneous materials.

Inorganic nanomaterials for printed electronics: a review

Owing to their capability of bypassing conventional high-priced and inflexible silicon based electronics to manufacture a variety of devices on flexible substrates by using large-scale and high-volume printing techniques, printed electronics (PE) have attracted increasing attention in the field of manufacturing industry for electronic devices. This simple and cost-effective approach could enhance current methods of constructing a patterned surface for nanomaterials and offer opportunities for developing fully-printed functional devices, especially offering the possibility of ubiquitous low-cost and flexible devices. This review presents a summary of work to date on the inorganic nanomaterials involved in PE applications, focused on the utilization of inorganic nanomaterials-based inks in the successful preparation of printed conductive patterns, electrodes, sensors, thin film transistors (TFTs) and other micro-/nanoscale devices. The printing techniques, sintering methods and printability of functional inks with their associated challenges are discussed, and we look forward so you can glimpse the future of PE applications.

Versatile Molecular Silver Ink Platform for Printed Flexible Electronics

A silver molecular ink platform formulated for screen, inkjet, and aerosol jet printing is presented. A simple formulation comprising silver neodecanoate, ethyl cellulose, and solvent provides improved performance versus that of established inks, yet with improved economics. Thin, screen-printed traces with exceptional electrical (<10 mΩ/□/mil or 12 μΩ·cm) and mechanical properties are achieved following thermal or photonic sintering, the latter having never been demonstrated for silver-salt-based inks. Low surface roughness, submicron thicknesses, and line widths as narrow as 41 μm outperform commercial ink benchmarks based on flakes or nanoparticles. These traces are mechanically robust to flexing and creasing (less than 10% change in resistance) and bind strongly to epoxy-based adhesives. Thin traces are remarkably conformal, enabling fully printed metal-insulator-metal band-pass filters. The versatility of the molecular ink platform enables an aerosol jet-compatible ink that yields conductive features on glass with 2× bulk resistivity and strong adhesion to various plastic substrates. An inkjet formulation is also used to print top source/drain contacts and demonstrate printed high-mobility thin film transistors (TFTs) based on semiconducting single-walled carbon nanotubes. TFTs with mobility values of ∼25 cm² V^-1 s^-1 and current on/off ratios >10⁴ were obtained, performance similar to that of evaporated metal contacts in analogous devices.

A high-sensitivity printed antenna prepared by rapid low-temperature sintering of silver ink

Rapid, low-temperature, and eco-friendly fabrication of printed dipole antennas with high sensitivity is achieved by hot-water sintering of silver precursor-based ink.

Recent developments and directions in printed nanomaterials

In this review, we survey several recent developments in printing of nanomaterials for contacts, transistors, sensors of various kinds, light-emitting diodes, solar cells, memory devices, and bone and organ implants. The commonly used nanomaterials are classified according to whether they are conductive, semiconducting/insulating or biological in nature. While many printing processes are covered, special attention is paid to inkjet printing and roll-to-roll printing in light of their complexity and popularity. In conclusion, we present our view of the future development of this field.

Contact resistivity decrease at a metal/semiconductor interface by a solid-to-liquid phase transitional metallo-organic silver

We present a new approach to ensure the low contact resistivity of a silver paste at a metal/semiconductor interface over a broad range of peak firing temperatures by using a solid-to-liquid phase transitional metallo-organic silver, that is, silver neodecanoate. Silver nanoclusters, thermally derived from silver neodecanoate, are readily dissolved into the melt of metal oxide glass frit even at low temperatures, at which point the molten metal oxide glass frit lacks the dissociation capability of bulk silver into Ag(+) ions. In the presence of O(2-) ions in the melt of metal oxide glass frit, the redox reaction from Ag(+) to Ag(0) augments the noble-metal-assisted etching capability to remove the passivation layer of silicon nitride. Moreover, during the cooling stage, the nucleated silver atoms enrich the content of silver nanocolloids in the solidified metal oxide glass layer. The resulting contact resistivity of silver paste with silver neodecanoate at the metal/semiconductor interface thus remains low-between 4.12 and 16.08 mΩ cm(2)-whereas without silver neodecanoate, the paste exhibits a contact resistivity between 2.61 and 72.38 mΩ cm(2) in the range of peak firing temperatures from 750 to 810 °C. The advantage of using silver neodecanoate in silver paste becomes evident in that contact resistivity remains low over the broad range of peak firing temperatures, thus providing greater flexibility with respect to the firing temperature required in silicon solar cell applications.

The exothermic reaction route of a self-heatable conductive ink for rapid processable printed electronics

We report the exothermic reaction route and new capability of a self-heatable conductive ink (Ag2O and silver 2,2-dimethyloctanoate) in order to achieve both a low sintering temperature and electrical resistivity within a short sintering time for flexible printed electronics and display appliances. Unlike conventional conductive ink, which requires a costly external heating instrument for rapid sintering, self-heatable conductive ink by itself is capable of generating heat as high as 312 °C when its exothermic reaction is triggered at a temperature of 180 °C. This intensive exothermic reaction is found to result from the recursive reaction of the 2,2-dimethyloctanoate anion, which is thermally dissociated from silver 2,2-dimethyloctanoate, with silver oxide microparticles. Through this recursive reaction, a massive number of silver atoms are supplied from silver oxide microparticles, and the nucleation of silver atoms and the fusion of silver nanoparticles become the major source of heat. This exothermic reaction eventually realizes the electrical resistivity of self-heatable conductive ink as low as 27.5 μΩ cm within just 40 s by combining chemical annealing, which makes it suitable for the roll-to-roll printable electronics such as a flexible touch screen panel.

Rapid two-step metallization through physicochemical conversion of Ag2O for printed "black" transparent conductive films

A rapid two-step metallization for fabrication of a "black" transparent conductive film on a flexible substrate for display applications is presented, using a mixture of silver oxide (Ag2O) and silver neodecanoate (C10H19AgO2), and its electrical conductivity and colour transition behaviours are investigated. Silver nanoparticles, which are physicochemically converted from silver oxide microparticles in the presence of silver neodecanoate in the course of the first metallization step at 150 °C for 10 min, are chemically annealed by immersing them in an acidic ferric chloride (FeCl3) solution at room temperature for 10 s. During this second metallization step, silver nanoparticles are found to be tightly packed through Ostwald ripening, which eventually leads to the dramatic enhancement of electrical conductivity by six orders of magnitude from 1.33 S m(-1) to 1.0 × 10(7) S m(-1), which corresponds to 15.9% of the electrical conductivity of bulk silver. In addition to the enhancement of electrical conductivity, the silver chloride (AgCl) layer formed on the surface of the silver layer due to ferric ions (Fe(3+)) enhances the blackness of the transparent conductive film by a factor of 1.69, from 36.29 B to 61.51 B. The sheet resistance and optical transparency of a roll-to-roll printed black transparent conductive film for a touch screen panel are found to be as low as 0.9 Ω□(-1) and 81%, respectively, after conducting the proposed two-step metallization.