Facile fabrication and low-temperature bonding of Cu@Sn–Bi core–shell particles for conductive pastes

Cu@Sn–Bi core–shell particles were synthesized and used as conductive fillers of ink applied to flexible printed circuits. This work provides new insights into the low-temperature bonding and anti-oxidation protection of Cu-based conductive pastes.

Fabrication of micron-SiO2@nano-Ag based conductive line patterns through silk-screen printing

A low-cost micro/nano-structure SiO₂@Ag based conductive paste was prepared and silk-screen printed on a PI substrate to fabricate conductive line patterns, which were applied in connecting a LED into a circuit.