Polymers Containing Diethylsiloxane Segment and Active Functional Group by Ring-Opening Polymerization of Hexaethylcyclotrisiloxane under the Catalysis of Linear Chlorinated Phosphazene Acid

Linear chlorinated phosphazene acid is prepared using PCl5 and NH4Cl as raw materials. Using hexaethylcyclotrisiloxane as the monomer, 1,1,3,3-tetramethyldisiloxane or 1,3-divinyl-1,1,3,3-tetramethyldisiloxane as the end-capping agent, and linear chlorinated phosphazene acid as the catalyst, polydiethylsiloxane oligomers terminated with active Si-H or Si-CH=CH2 groups have been prepared. Using hexaethylcyclotrisiloxane and 1,3,5,7-octamethylcyclotetrasiloxane as comonomers, 1,1,3,3-tetramethyldisiloxane or hexamethyldisiloxane as the end-capping agent, or using hexaethylcyclotrisiloxane and octamethylcyclotetrasiloxane as comonomers, 1,1,3,3-tetramethyldisiloxane as the end-capping agent, copolymers containing active Si-H bonds and dimethylsiloxane segments have been prepared under the catalysis of linear chlorinated phosphazene acid. The effects of catalyst dosage, reaction temperature, reaction time, end-capping agent, and polymerization monomer dosage on polymer yield and structure were investigated. Using 300 ppm of linear chlorinated phosphazene acid, oligomers and copolymers containing an active Si-H bond and diethylsiloxane segment were prepared under mild conditions. The molecular weight of the obtained polymers was close to their designed values, but their PDI values were small. The highest yield of α, ω-bisdimethylsiloxyl-terminated PDES oligomers reached 93%. Using oligomers and copolymers containing Si-H bonds and diethylsiloxane segments as crosslinkers, a silicone gel containing diethylsiloxane segments was prepared by hydrosilylation reaction. With the introduction of a diethylsiloxane segment, the glass transition temperature of the silicone gel decreased relative to that of the PDMS oligomer, but the temperature at 5% weight loss in nitrogen atmosphere decreased from 347 °C to 312 °C. The mechanism of the ring-opening polymerization of hexaethylcyclotrisiloxane catalyzed by linear chlorinated phosphazene acid is also discussed.

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Based on the excellent physical properties and flexible molecular modifiability, modified silicone resins have received favorable attention in the field of microelectronics, and recently a number of modified silicone resins have appeared while few breakthroughs have been made in low dielectric constant (low-k) materials field due to the limitations of structure or the curing process. In this work, functional silicone resin with different BCB contents was prepared with two monomers. The resins showed low dielectric constant (k = 2.77 at 10 MHz) and thermal stability (T_5% = 495.0 °C) after curing. Significant performance changes were observed with the increase in BCB structural units, and the functional silicone obtained does not require melting and dissolution during processing because of good fluidity at room temperature. Moreover, the mechanical properties of silicone resins can be also controlled by adjusting the BCB content. The obtained silicone resins could be potentially used in the field of electronic packaging materials.

Hard Coating Materials Based on Photo-Reactive Silsesquioxane for Flexible Application: Improvement of Flexible and Hardness Properties by High Molecular Weight

EPOSS of polyhedral oligomeric silsesquioxanes (POSS) mixture structure and LPSQ of ladder-like polysilsesquioxane (LPSQ) structure were synthesized via sol–gel reaction. EPSQ had a high molecular weight due to polycondensation by potassium carbonate. The EPSQ film showed uniform surface morphology due to regular double-stranded structure. In contrast, the EPOSS-coated film showed nonuniform surface morphology due to strong aggregation. Due to the aggregation, the EPOSS film had shorter d-spacing (d1) than the EPSQ film in XRD analysis. In pencil hardness and nanoindentation analysis, EPSQ film showed higher hardness than the EPOSS film due to regular double-stranded structure. In addition, in the in-folding (r = 0.5 mm) and out-folding (r = 5 mm) tests, the EPSQ film did not crack unlike the EPOSS coated film.

Fast Curable Polysiloxane-Silphenylene Hybrimer with High Transparency and Refractive Index for Optical Applications

In this study, a fast curable polysiloxane-silphenylene hybrimer (PSH) was synthesized by the nonhydrolytic sol–gel condensation of phenyl-vinyl-oligosiloxane (PVO) and tris(dimethylhydrosilyl)benzene (TDMSB) under a Pt catalyst to investigate its optical property and thermal stability. The combination of PVO and tripod-type TDMSB results in a hybrimer with a fast curing time of 30 min. The PSH exhibited a high refractive index of 1.60, 1.59, and 1.58 at 450, 520, and 635 nm, respectively. High transmittance of 97% at 450 nm was obtained. The PSH exhibited a very high transmittance of 97% before thermal aging. The high optical transmittance of the PSH was only slightly decreased by 0.5% of the transmittance at 180 °C for 72 h after thermal aging, and high transparency was maintained almost constant even after 72 h of high-temperature treatment.

A transparent cyclo-linear polyphenylsiloxane elastomer integrating high refractive index, thermal stability and flexibility

A cyclo-linear structured transparent polyphenylsiloxane elastomer combining high refractive index, high thermal stability and superior flexibility was prepared by a one-pot hydrosilylation reaction.

Zirconia/phenylsiloxane nano-composite for LED encapsulation with high and stable light extraction efficiency

To obtain a rapid processible LED encapsulant that leads to high and stable light extraction efficiency (LEE), UV curable ZrO₂/phenyl-siloxane nano-composite (ZSC) double-layer encapsulants were prepared and optimized. The highly crystalline ZrO₂ nanoparticles with a diameter of ∼14 nm were synthesized through a modified hydrothermal method at mild conditions, and a UV curable methacryl-diphenyl-polysiloxane (MDPS) with a refractive index (RI) of 1.54 (at 633 nm) was synthesized from self-condensation of diphenylsilanediol and an end-capping reaction. High refractive indexes (RIs) from 1.54–1.61 have been obtained for ZSC composites by adding 0–20 wt% ZrO₂. Before and after sulfur vapor erosion, the double-layer encapsulated sample (M-10/M) showed 11.2% and 64.8% higher LEE respectively than that of Dow Corning OE-7662. Meanwhile, the variation of LED light color temperature (T_c) was less than 1%. The effect of the ZrO₂ nanoparticle content on LEE of double-layer and single-layer encapsulation were compared and discussed based on Fresnel loss and Rayleigh scattering theories. The double-layered UV curing processing took only 1/6 of the time needed for common thermal curing.

The double-layer encapsulation by a highly crystalline ZrO₂/polydiphenylsiloxane composite affords 11.2% and 64.8% higher LEE respectively than that of OE-7662 before and after sulfur vapor erosion.

Exceptionally stable quantum dot/siloxane hybrid encapsulation material for white light-emitting diodes with a wide color gamut

Herein, we report a luminescent light-emitting diode (LED) encapsulating material using a thermally curable quantum dot (QD)/siloxane hybrid (TSE-QD) color converter, which has superior long-term stability even at elevated temperatures, in high humidity, and in various chemicals. The TSE-QD is cured by a thermal-induced hydrosilylation reaction of an in situ sol-gel synthesized QD dispersed siloxane resin (QD/siloxane resin) without additional ligand-exchange processes. QDs are successfully encapsulated by highly condensed and linear structured siloxane networks with additional chemical linkages between the surface ligands of the QDs and organic functional groups of the siloxane matrix. Moreover, QDs are uniformly distributed within the siloxane matrix retaining their optical properties during the fabrication processes of the TSE-QD. The result is that the stability, as evaluated by the photoluminescence (PL) quantum yield (QY), is greatly improved under harsh conditions, for example, 120 °C/5% relative humidity (RH), ethanol and acetone for 30 days. Based on the exceptionally stable TSE-QD, we demonstrate a white LED using a blue LED chip directly encapsulated by a yellow emitting TSE-QD that shows excellent spectral stability, outstanding reliability at 85 °C/85% RH and a wide color gamut (116% of NTSC).

UV-curable ladder-like diphenylsiloxane-bridged methacryl-phenyl-siloxane for high power LED encapsulation

A UV curable ladder-like diphenylsiloxane-bridged methacryl-phenyl-siloxane (L-MPS) was synthesized from phenyltrichlorosilane, diphenylsilanediol and methacryloxypropyldimethylmethoxysilane via dehydrochlorination precoupling, supramolecular architecture-directed hydrolysis-condensation and end-capping reactions. The L-MPS has a condensation degree of ∼100%, and can be complete crosslinked by UV curing. XRD, TEM and molecular simulation suggest that the ladder-like molecules are close packed with a periodic distance of ca. 1.2 nm. The L-MPS shows transmittance of 98% and a refractive index of ca. 1.61 at 450 nm. The cured L-MPS with a T_d5% value of 465.5 °C showed excellent anti-yellowing and anti-sulfidation properties. The cured L-MPS film and the encapsulated LED samples were compared with those of Dow Corning OE-6630 and OE-7662. It is believed that the dense nano-ladder unit also contributes to the thermal, gas barrier and even optical properties. L-MPS shows promising potential as a high power LED encapsulant and optical coating for use in harsh environments. This work provides an approach to integrate this novel ladder structure with advanced properties.

UV-curable ladder-like polysiloxane was constructed to integrate high RI (1.61/450 nm) with high thermal stability etc. for high power LED encapsulation.

Preparation and Performance of Poly(butyl fumarate)-Based Material for Potential Application in LED Encapsulation

A UV-curable poly(butyl fumarate) (PBF)/poly(propylene fumarate)-diacrylate (PPF-DA) hybrid material with good performance for LED encapsulation is introduced in the paper. They have been prepared by radical polymerization using PBF and PPF-DA macromers with a UV curing system. PBF and PPF-DA were characterized by Fourier-transform infrared (FT-IR) and H-nuclear magnetic resonance (¹H NMR). The thermal behavior, optical and mechanical properties of the material were examined by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), ultraviolet-visible spectroscopy (UV–vis), and a material testing system mechanical testing machine, respectively. The results indicated that the hybrid material has a suitable refractive index (n = 1.537) and high transmittance (99.64% in visible range) before/after thermal aging. With the increasing of the double bond ratio from 0.5 to 2, the water absorption ratios of the prepared encapsulation material were 1.22%, 1.87% and 2.88%, respectively. The mechanical property experiments showed that bonding strength was in the range of 1.86–3.40 MPa, tensile-shear strength ranged from 0.84 MPa to 1.57 MPa, and compression strength was in the range of 5.10–27.65 MPa. The cured PBF/PPF-DA hybrid material can be used as a light-emitting diode (LED) encapsulant, owing to its suitable refractive index, high transparency, excellent thermal stability, lower water absorption, and good mechanical properties.

Preparation and Evaluation of a Zirconia/Oligosiloxane Nanocomposite for LED Encapsulation

A zirconia/oligosiloxane nanocomposite encapsulant has been developed and tested in a high-power LED package against commercial silicone resins. The composite was a marriage of zirconia nanocrystals modified with butyric acid (BA) and 3-methacryloxy propyl trimethoxysilane (MPTMS) and a high-index methacryloxy-oligosiloxanes resin made from MPTMS plus dimethyl, diphenyl, and triphenyl silanes. The modified zirconia had an index of 1.762 (@589 nm) and was dispersible in many solvents. The oligosiloxane resin, however, had an index of 1.5413 with good encapsulation properties and low viscosity allowing the incorporation of more zirconia. The final nanocomposite showed a refractive index of 1.625 with high transparency and a wavelength-independent scattering, both desirable for the light extraction from LED. When tested in a high-power LED package, the composite encapsulant resulted in 13% more light output compared to the commercial encapsulant (OE-6630, Dow Corning Corp.) and showed longer than 1000 h of lifetime (L70) under the steady-state Temperature Humidity Bias (THB) test.

Thermally Stable Siloxane Hybrid Matrix with Low Dielectric Loss for Copper-Clad Laminates for High-Frequency Applications

We report vinyl-phenyl siloxane hybrid material (VPH) that can be used as a matrix for copper-clad laminates (CCLs) for high-frequency applications. The CCLs, with a VPH matrix fabricated via radical polymerization of resin blend consisting of sol-gel-derived linear vinyl oligosiloxane and bulky siloxane monomer, phenyltris(trimethylsiloxy)silane, achieve low dielectric constant (Dk) and dissipation factor (Df). The CCLs with the VPH matrix exhibit excellent dielectric performance (Dk = 2.75, Df = 0.0015 at 1 GHz) with stability in wide frequency range (1 MHz to 10 GHz) and at high temperature (up to 275 °C). Also, the VPH shows good flame resistance without any additives. These results suggest the potential of the VPH for use in high-speed IC boards.

Optically recoverable, deep ultraviolet (UV) stable and transparent sol–gel fluoro siloxane hybrid material for a UV LED encapsulant

A UV transparent and stable fluoro-siloxane hybrid material was prepared for a deep UV-LED encapsulant. The hybrimer was fabricated by hydrosilylation reaction of vinyl-fluoro oligosiloxane resin.

Preparation and properties of vinylphenyl-silicone resins and their application in LED packaging

The results of spectrophotometry and TEM revealed that materials with a higher homogeneity degree of morphological structure could obtain 98.7% of transmittance at a wavelength of 680 nm.

Ultraviolet light stable and transparent sol-gel methyl siloxane hybrid material for UV light-emitting diode (UV LED) encapsulant

An ultraviolet (UV) transparent and stable methyl-siloxane hybrid material was prepared by a facile sol-gel method. The transparency and stability of a UV-LED encapsulant is an important issue because it affects UV light extraction efficiency and long-term reliability. We introduced a novel concept for UV-LED encapsulation using a thermally curable oligosiloxane resin. The encapsulant was fabricated by a hydrosilylation of hydrogen-methyl oligosiloxane resin and vinyl-methyl siloxane resin, and showed a comparable transmittance to polydimethylsiloxane (PDMS) in the UVB (∼300 nm) region. Most remarkably, the methyl-siloxane hybrid materials exhibited long-term UV stability under light soaking in UVB (∼300 nm) for 1000 h.

Light emitting diodes (LEDs) encapsulation of polymer composites based on poly(propylene fumarate) crosslinked with poly(propylene fumarate)-diacrylate

The cured PPF/PPF-DA polymer networks material can be used as a LEDs encapsulant, owing to suitable refractive index, high transparency, appropriate tensile strength, and excellent thermal stability.

Novel phosphorus–nitrogen–silicon flame retardants and their application in cycloaliphatic epoxy systems

In this work, we prepared two novel reactive-type halogen-free and UV-curable phosphorus–nitrogen–silicon synergistic flame retardants.

A facile method for fabrication of titanium-doped hybrid materials with high refractive index

This paper presents a facile route to prepare a series of high refractive index and homogeneous hybrid resins with titanium in the backbone by a non-hydrolytic sol–gel process.