A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance

Because of high conductivity, acceptable cost and good screen-printing process performance, silver pastes have been extensively used for making flexible electronics. However, there are few reported articles focusing on high heat resistance solidified silver pastes and their rheological properties. In this paper, a fluorinated polyamic acids (FPAA) is synthesized by polymerization of the 4,4'-(hexafluoroisopropylidene) diphthalic anhydride and 3,4'-diaminodiphenylether as monomers in the diethylene glycol monobutyl. The nano silver pastes are prepared by mixing the obtained FPAA resin with nano silver powder. The agglomerated particles caused by nano silver powder are divided and the dispersion of nano silver pastes are improved by three-roll grinding process with low roll gaps. The obtained nano silver pastes possess excellent thermal resistance with 5% weight loss temperature higher than 500 °C. The volume resistivity of cured nano silver paste achieves 4.52 × 10^-7 Ω·m, when the silver content is 83% and the curing temperature is 300 °C. Additionally, the nano silver pastes have high thixotropic performance, which contributes to fabricate the fine pattern with high resolution. Finally, the conductive pattern with high resolution is prepared by printing silver nano pastes onto PI (Kapton-H) film. The excellent comprehensive properties, including good electrical conductivity, outstanding heat resistance and high thixotropy, make it a potential application in flexible electronics manufacturing, especially in high-temperature fields.

High-Performance Temperature Sensor by Employing Screen Printing Technology

In the present study, a high-performance n-type temperature sensor was developed by a new and facile synthesis approach, which could apply to ambient temperature applications. As impacted by the low sintering temperature of flexible polyimide substrates, a screen printing technology-based method to prepare thermoelectric materials and a low-temperature heat treatment process applying to polymer substrates were proposed and achieved. By regulating the preparation parameters of the high-performance n-type indium oxide material, the optimal proportioning method and the post-treatment process method were developed. The sensors based on thermoelectric effects exhibited a sensitivity of 162.5 μV/°C, as well as a wide range of temperature measurement from ambient temperature to 223.6 °C. Furthermore, it is expected to conduct temperature monitoring in different scenarios through a sensor prepared in masks and mechanical hands, laying a foundation for the large-scale manufacturing and widespread application of flexible electronic skin and devices.

Facile fabrication and low-temperature bonding of Cu@Sn–Bi core–shell particles for conductive pastes

Cu@Sn–Bi core–shell particles were synthesized and used as conductive fillers of ink applied to flexible printed circuits. This work provides new insights into the low-temperature bonding and anti-oxidation protection of Cu-based conductive pastes.