Formation of GaP nanocones and micro-mesas by metal-assisted chemical etching

Metal-assisted chemical etching beyond Si: applications to III-V compounds and wide-bandgap semiconductors

Metal-assisted chemical etching (MacEtch) has emerged as a versatile technique for fabricating a variety of semiconductor nanostructures. Since early investigations in 2000, research in this field has provided a deeper understanding of the underlying mechanisms of catalytic etching processes and enabled high control over etching conditions for diverse applications. In this Review, we present an overview of recent developments in the application of MacEtch to nanomanufacturing and processing of III-V based semiconductor materials and other materials beyond Si. We highlight the key findings and developments in MacEtch as applied to GaAs, GaN, InP, GaP, InGaAs, AlGaAs, InGaN, InGaP, SiC, β-Ga2O3, and Ge material systems. We further review a series of active and passive devices enabled by MacEtch, including light-emitting diodes (LEDs), field-effect transistors (FETs), optical gratings, sensors, capacitors, photodiodes, and solar cells. By reviewing demonstrated control of morphology, optimization of etch conditions, and catalyst-material combinations, we aim to distill the current understanding of beyond-Si MacEtch mechanisms and to provide a bank of reference recipes to stimulate progress in the field.

Structuring of Si into Multiple Scales by Metal-Assisted Chemical Etching

Structuring Si, ranging from nanoscale to macroscale feature dimensions, is essential for many applications. Metal-assisted chemical etching (MaCE) has been developed as a simple, low-cost, and scalable method to produce structures across widely different dimensions. The process involves various parameters, such as catalyst, substrate doping type and level, crystallography, etchant formulation, and etch additives. Careful optimization of these parameters is the key to the successful fabrication of Si structures. In this review, recent additions to the MaCE process are presented after a brief introduction to the fundamental principles involved in MaCE. In particular, the bulk-scale structuring of Si by MaCE is summarized and critically discussed with application examples. Various approaches for effective mass transport schemes are introduced and discussed. Further, the fine control of etch directionality and uniformity, and the suppression of unwanted side etching are also discussed. Known application examples of Si macrostructures fabricated by MaCE, though limited thus far, are presented. There are significant opportunities for the application of macroscale Si structures in different fields, such as microfluidics, micro-total analysis systems, and microelectromechanical systems, etc. Thus more research is necessary on macroscale MaCE of Si and their applications.

Fabrication of Ultra-High Aspect Ratio (>420:1) Al2O3 Nanotube Arraysby Sidewall TransferMetal Assistant Chemical Etching

We report a robust, sidewall transfer metal assistant chemical etching scheme for fabricating Al2O3 nanotube arrays with an ultra-high aspect ratio. Electron beam lithography followed by low-temperature Au metal assisted chemical etching (MacEtch) is used to pattern high resolution, high aspect ratio, and vertical silicon nanostructures, used as a template. This template is subsequently transferred by an atomic layer deposition of the Al2O3 layer, followed by an annealing process, anisotropic dry etching of the Al2O3 layer, and a sacrificial silicon template. The process and characterization of the Al2O3 nanotube arrays are discussed in detail. Vertical Al2O3 nanotube arrays with line widths as small as 50 nm, heights of up to 21 μm, and aspect ratios up to 420:1 are fabricated on top of a silicon substrate. More importantly, such a sidewall transfer MacEtch approach is compatible with well-established silicon planar processes, and has the benefits of having a fully controllable linewidth and height, high reproducibility, and flexible design, making it attractive for a broad range of practical applications.

Unravelling the strain relaxation processes in silicon nanowire arrays by X-ray diffraction

Investigations performed on silicon nanowires of different lengths by scanning electron microscopy revealed coalescence processes in longer nanowires. Using X-ray diffraction (XRD), it was found that the shape of the pole figure in reciprocal space is ellipsoidal. This is the signature of lattice defects generated by the relaxation of the strain concentrated in the coalescence regions. This observation is strengthened by the deviation of the XRD peaks from Gaussianity and the appearance of the acoustic phonon mode in the Raman spectrum. It implies that bending, torsion and structural defects coexist in the longer nanowires. To separate these effects, a grazing-incidence XRD technique was conceived which allows the nanowire to be scanned along its entire length. Both ω and φ rocking curves were recorded, and their shapes were used to extract the bending and torsion profiles, respectively, along the nanowire length. Dips were found in both profiles of longer nanowires, while they are absent from shorter ones, and these dips correspond to the regions where both bending and torsion relax. The energy dissipated in the nanowires, which tracks the bending and torsion profiles, has been used to estimate the emergent dislocation density in nanowire arrays.

Ordered Al xGa1- xAs Nanopillar Arrays via Inverse Metal-Assisted Chemical Etching

The ternary III-V semiconductor compound, Al _xGa_{1 -x}As, is an important material that serves a central role within a variety of nanoelectronic, optoelectronic, and photovoltaic devices. With all of its uses, the material itself poses a host of fabrication difficulties stemming from conventional top-down processing, including standard wet-chemical etching and reactive-ion etching (RIE). Metal-assisted chemical etching (MacEtch) techniques provide low-cost and benchtop methods that combine many of the advantages of RIE and wet-chemical etching, without being hindered by many of their disadvantages. Here, inverse-progression MacEtch (I-MacEtch) of Au-patterned Al _xGa_{1 -x}As is demonstrated for the first time and is exploited for the generation of vertical and ordered nanopillar arrays. The etching solution employed here consists of citric acid (C₆H₈O₇) and hydrogen peroxide (H₂O₂). The I-MacEtch evolution is tracked in time for Al _xGa_{1 -x}As samples with compositions defined by x = 0.55, x = 0.60, and x = 0.70. The vertical and lateral etch rates (VER and LER, respectively) are shown to be tunable with Al fraction and temperature of the etching solution, based on modification of catalytically injected hole distributions. Control over the VER/LER ratio is demonstrated by tailoring etch conditions for single-step fabrication of ordered AlGaAs nanopillar arrays with predefined aspect ratios. Maximum VER and LER values of ∼40 nm/min and ∼105 nm/min, respectively, are measured for Al_0.55Ga_0.45As at a process temperature of 65 °C. The I-MacEtch nanofabrication methodology outlined in this study may be utilized for the processing of many devices, including high electron mobility transistors, distributed Bragg reflectors, lasers, light-emitting diodes, and multijunction solar cells containing AlGaAs components.

Enhanced Performance of Ge Photodiodes via Monolithic Antireflection Texturing and α-Ge Self-Passivation by Inverse Metal-Assisted Chemical Etching

Surface antireflection micro and nanostructures, normally formed by conventional reactive ion etching, offer advantages in photovoltaic and optoelectronic applications, including wider spectral wavelength ranges and acceptance angles. One challenge in incorporating these structures into devices is that optimal optical properties do not always translate into electrical performance due to surface damage, which significantly increases surface recombination. Here, we present a simple approach for fabricating antireflection structures, with self-passivated amorphous Ge (α-Ge) surfaces, on single crystalline Ge (c-Ge) surface using the inverse metal-assisted chemical etching technology (I-MacEtch). Vertical Schottky Ge photodiodes fabricated with surface structures involving arrays of pyramids or periodic nano-indentations show clear improvements not only in responsivity, due to enhanced optical absorption, but also in dark current. The dark current reduction is attributed to the Schottky barrier height increase and self-passivation effect of the i-MacEtch induced α-Ge layer formed on top of the c-Ge surface. The results demonstrated in this work show that MacEtch can be a viable technology for advanced light trapping and surface engineering in Ge and other semiconductor based optoelectronic devices.

Chemical Imprinting of Crystalline Silicon with Catalytic Metal Stamp in Etch Bath

Conventional lithography using photons and electrons continues to evolve to scale down three-dimensional nanoscale patterns, but the complexity of technology and equipment is increasing due to diffraction and scattering problems. Physical contact lithography methods, such as nanoimprint and soft lithography, have been developed as an alternative technique. These techniques imprint predefined structures on a stamp to the polymer resist and use the polymer resist as a mask to dry etch the nanostructure on the substrate. In this study, we introduce a method of chemically imprinting crystalline silicon (Si) with a catalytic stamp to enable the direct etching of the Si without using a polymer mask. A metal catalyst is deposited on the predefined structure of the stamp. The stamp physically contacts the Si in the etching bath, and metal-assisted chemical etching occurs on the semiconductor surface. Since the metal catalyst is mounted on a stamp, it can be used repeatedly. This is a technology that combines conventional lithography and etching without using a polymer resist. This technology not only produced nano/microscale arrays of circular and square holes and trench structures but also successfully produced complex eagle-shaped structures that contained such structures.

Fabrication of Suspended III-V Nanofoils by Inverse Metal-Assisted Chemical Etching of In0.49Ga0.51P/GaAs Heteroepitaxial Films

Metal-assisted chemical etching (MacEtch) has been established as a low-cost, benchtop, and versatile method for large-scale fabrication of semiconductor nanostructures and has been heralded as an alternative to conventional top-down approaches such as reactive-ion etching. However, extension of this technique to ternary III-V compound semiconductor alloys and heteroepitaxial systems has remained relatively unexplored. Here, Au-assisted and inverse-progression MacEtch (I-MacEtch) of the heteroepitaxial In_0.49Ga_0.51P/GaAs material system is demonstrated, along with a method for fabricating suspended InGaP nanofoils of tunable thickness in solutions of hydrofluoric acid (HF) and hydrogen peroxide (H₂O₂). A comparison between Au- and Cr-patterned samples is used to demonstrate the catalytic role of Au in the observed etching behavior. Vertical etch rates for nominally undoped, p-type, and n-type InGaP are determined to be ∼9.7, ∼8.7, and ∼8.8 nm/min, respectively. The evolution of I-MacEtch in the InGaP/GaAs system is tracked, leading to the formation of nanocavities located at the center of off-metal windows. Upon nanocavity formation, additional localized mass-transport pathways to the underlying GaAs substrate permit its rapid dissolution. Differential etch rates between the epilayer and substrate are exploited in the fabrication of InGaP nanofoils that are suspended over micro-trenches formed in the GaAs substrate. A model is provided for the observed I-MacEtch mechanism, based on an overlap of neighboring injected hole distribution profiles. The nanofabrication methodology shown here can be applied to various heteroepitaxial III-V systems and can directly impact the conventional processing of device applications in photonics, optoelectronics, photovoltaics, and nanoelectronics.

Damage-Free Smooth-Sidewall InGaAs Nanopillar Array by Metal-Assisted Chemical Etching

Producing densely packed high aspect ratio In_0.53Ga_0.47As nanostructures without surface damage is critical for beyond Si-CMOS nanoelectronic and optoelectronic devices. However, conventional dry etching methods are known to produce irreversible damage to III-V compound semiconductors because of the inherent high-energy ion-driven process. In this work, we demonstrate the realization of ordered, uniform, array-based In_0.53Ga_0.47As pillars with diameters as small as 200 nm using the damage-free metal-assisted chemical etching (MacEtch) technology combined with the post-MacEtch digital etching smoothing. The etching mechanism of In_xGa_1-xAs is explored through the characterization of pillar morphology and porosity as a function of etching condition and indium composition. The etching behavior of In_0.53Ga_0.47As, in contrast to higher bandgap semiconductors (e.g., Si or GaAs), can be interpreted by a Schottky barrier height model that dictates the etching mechanism constantly in the mass transport limited regime because of the low barrier height. A broader impact of this work relates to the complete elimination of surface roughness or porosity related defects, which can be prevalent byproducts of MacEtch, by post-MacEtch digital etching. Side-by-side comparison of the midgap interface state density and flat-band capacitance hysteresis of both the unprocessed planar and MacEtched pillar In_0.53Ga_0.47As metal-oxide-semiconductor capacitors further confirms that the surface of the resultant pillars is as smooth and defect-free as before etching. MacEtch combined with digital etching offers a simple, room-temperature, and low-cost method for the formation of high-quality In_0.53Ga_0.47As nanostructures that will potentially enable large-volume production of In_0.53Ga_0.47As-based devices including three-dimensional transistors and high-efficiency infrared photodetectors.

Evidences for redox reaction driven charge transfer and mass transport in metal-assisted chemical etching of silicon

In this work, we investigate the transport processes governing the metal-assisted chemical etching (MacEtch) of silicon (Si). We show that in the oxidation of Si during the MacEtch process, the transport of the hole charges can be accomplished by the diffusion of metal ions. The oxidation of Si is subsequently governed by a redox reaction between the ions and Si. This represents a fundamentally different proposition in MacEtch whereby such transport is understood to occur through hole carrier conduction followed by hole injection into (or electron extraction from) Si. Consistent with the ion transport model introduced, we showed the possibility in the dynamic redistribution of the metal atoms that resulted in the formation of pores/cracks for catalyst thin films that are ≲30 nm thick. As such, the transport of the reagents and by-products are accomplished via these pores/cracks for the thin catalyst films. For thicker films, we show a saturation in the etch rate demonstrating a transport process that is dominated by diffusion via metal/Si boundaries. The new understanding in transport processes described in this work reconcile competing models in reagents/by-products transport, and also solution ions and thin film etching, which can form the foundation of future studies in the MacEtch process.