Expeditious low-temperature sintering of copper nanoparticles with thin defective carbon shells

Mesosphere of Carbon-Shelled Copper Nanoparticles with High Conductivity and Thermal Stability via Direct Carbonization of Polymer Soft Templates

Copper nanoparticle (Cu NP) is a promising replacement for noble metal nanoparticles due to its high electrical conductivity and low cost. However, Cu NPs are relatively active compared to noble metals, and current ways of protecting Cu NPs from oxidation by encapsulation have severe drawbacks, such as a long reaction time and complicated processes. Here, a facial and effective method to prepare the mesosphere of carbon-shelled copper nanoparticles (Cu@MC) was demonstrated, and the resulting Cu@MC was both highly electrically conductive and thermally stable. Cu@organic (100 nm) was first synthesized by the reduction of Cu ions with poly (vinyl pyrrolidone) (PVP) and sodium poly ((naphthalene-formaldehyde) sulfonate) (Na-PNFS) as soft templates. Then, the carbon shells were obtained by in situ carbonization of the polymer soft templates. The Cu@organic and Cu@MC showed an anti-oxidation ability up to 175 and 250 °C in the air atmosphere, respectively. Furthermore, the Cu@MC exhibited excellent volume resistivity of 7.2 × 10^-3 Ω·cm under 20 MPa, and showed promising application potential in electric sensors and devices.

Droplet-Based Techniques for Printing of Functional Inks for Flexible Physical Sensors

Printed electronics (PE) is an emerging technology that uses functional inks to print electrical components and circuits on variety of substrates. This technology has opened up new possibilities to fabricate flexible, bendable, and form-fitting devices at low-cost and fast speed. There are different printing technologies in use, among which droplet-based techniques are of great interest as they provide the possibility of printing computer-controlled design patterns with high resolution, and greater production flexibility. Nanomaterial inks form the heart of this technology, enabling different functionalities. To this end, intensive research has been carried out on formulating inks with conductive, semiconductive, magnetic, piezoresistive, and piezoelectric properties. Here, a detailed landscape view on different droplet-based printing technologies (inkjet, aerosol jet, and electrohydrodynamic jet) is provided, with comprehensive discussion on their working principals. This is followed by a detailed research overview of different functional inks (metal, carbon, polymer, and ceramic). Different sintering methods and common substrates being used in printed electronics are also discussed, followed by an in-depth review of different physical sensors fabricated by droplet-based techniques. Finally, the challenges facing the field are considered and a perspective on possible ways to overcome them is provided.

Cu@Ni core-shell nanoparticles prepared via an injection approach with enhanced oxidation resistance for the fabrication of conductive films

Building core-shell structures is a valuable method of enhancing the oxidation-resistance performance of Cu nanoparticles for practical applications in the field of printed circuit boards. In this study, Cu@Ni core-shell nanoparticles are synthesized via an injection solution approach utilizing Cu seeds produced during the reactions to induce the epitaxial growth of Ni shells. The thickness of the Ni shell can be controlled by varying the Cu:Ni molar ratios in the injected precursor solution, whereas changing the injection rate of the Cu precursor solution affects the size of the Cu seeds and thus controls the eventual size of the core-shell nanoparticles. Thermogravimetric analysis reveals a superior thermal stability against oxidation for Cu@Ni core-shell nanoparticles, as compared with Cu nanoparticles. The oxidation resistance of Cu@Ni conductive films increases with an increase in the Ni:Cu ratio, while the conductivity increases with a decrease in the Ni:Cu ratio. A relatively low resistivity of 27.4 µΩ cm is achieved for Cu@Ni conductive films. The results demonstrate that coating Cu nanoparticles with Ni shells via epitaxial growth can form closed shells with smooth surfaces which are valuable for Cu nanoparticles in applications where oxidation resistance is a requirement .

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

Self-Assembly of Graphene-Encapsulated Cu Composites for Nonenzymatic Glucose Sensing

Cu has recently received great interest as a potential candidate for glucose sensing to overcome the problems with noble metals. In this work, reduced graphene oxide-encapsulated Cu nanoparticles (Cu@RGO) have been prepared via an electrostatic self-assembly method. This core/shell composites were found to be more stable than conventional Cu-decorated graphene composites and bare copper nanoparticles in an air atmosphere because the graphene shell can effectively protect the Cu nanoparticles from oxidation. In addition, the obtained Cu@RGO composites also showed an outstanding electrocatalytic activity toward glucose oxidation with a wide linear detection range of 1 μM to 2 mM, low detection limit of 0.34 μM (S/N = 3), and a sensitivity of 150 μA mM-1 cm-2. Moreover, Cu@RGO composites exhibited a satisfactory reproducibility, selectivity, and long effective performance. These excellent properties indicated that Cu@RGO nanoparticles have great potential application in glucose detection.

Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air

The development of a thermal sintering method for Cu-based inks under an air atmosphere could greatly expand their application for printed electronics. However, it is well-known that Cu-based inks cannot produce conductive Cu films when sintered at low temperatures in air because Cu readily oxidizes under such conditions. In this study, we have successfully demonstrated air atmosphere sintering at low temperatures (less than 150 °C) via a simple hot plate heat treatment for producing conductive Cu films on flexible polymer substrates, using a novel Cu-based composite ink with sub-10 nm Cu nanoparticles protected with 1-amino-2-propanol with micrometer-sized Cu particles and submicrometer-sized Cu particles; oxalic acid was also added to prevent the oxidation of the Cu during sintering. The Cu films showed a minimum resistivity of 5.5 × 10^-5 Ω·cm when sintered in air at 150 °C for a very short period of 10 s. To the best of our knowledge, this is the first report of sintering of Cu-based inks in air at less than 150 °C. Another novel property of the present Cu-based composite ink is the lowest reported resistivity at 80 °C under N₂ flow (5.3 × 10^-5 Ω·cm at 80 °C and 8.4 × 10^-6 Ω·cm at 120 °C). This fast, efficient, and inexpensive technology for thermal sintering in ambient air using composite inks could be a commercially viable method for fabricating printed electronics on flexible substrates.

The roles of surface chemistry, dissolution rate, and delivered dose in the cytotoxicity of copper nanoparticles

The understanding of nanoparticle (NP) cytotoxicity is challenging because of incomplete information about physicochemical changes particles undergo once they come into contact with biological fluids. It is therefore essential to characterize changes in NP properties to better understand their biological fate and effects in mammalian cells. In this paper, we present a study on the effect of particle surface oxidation and dissolution rates of Cu NPs. Particle dissolution, cell-associated Cu doses, and oxidative stress responses in A549 luciferase reporter cells were examined for Cu NPs modified with mercaptocarboxylic acids with different carbon chain lengths and a thiotic acid appended-PEG ligand (TA). We found that these Cu NPs released ionic species together with small particles upon oxidation and that surface chemistry influenced the morphology and dissolution rate. The dissolution rate was also shown to impact both the cellular Cu dosimetry and associated oxidative stress responses. The convergent results from dissolution and dosimetry measurements demonstrate that both intracellular and extracellular (i.e., NP uptake-independent) release of ionic species from Cu NPs greatly affect the cytotoxicity.

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion during heating and the effect of organic residues on the resistivity have not been studied. In this study, the decomposition process of dispersions containing mixtures of a copper complex and copper particles with various sizes was studied. The effect of organic residues on the resistivity was also studied using thermogravimetric analysis. In addition, the choice of copper salts in the copper complex was also discussed. In this work, a low-resistivity sintered copper film (7 × 10⁻⁶ Ω·m) at a temperature as low as 100 °C was achieved without using any reductive gas.

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

A novel low cost sintering process of copper fine particles to a copper conductive layer with Cu²⁺-alkanolamine metallacycle complexes at as low as 100 °C without reductive gas flow.

High-Concentration Synthesis of Sub-10-nm Copper Nanoparticles for Application to Conductive Nanoinks

A simple, high-concentration (up to 0.6 M Cu salt) synthesis of sub-10-nm copper nanoparticles (Cu NPs) was developed in ethylene glycol at room temperature under ambient air conditions using 1-amino-2-propanol (AmIP) as the stabilizer. Monodispersed AmIP-Cu NPs of 3.5 ± 1.0 nm were synthesized in a high yield of ∼90%. Thus, nearly 1 g of sub-10-nm Cu NP powder was obtained using a one-step synthesis for the first time. It is proposed that metallacyclic coordination stability of a five-membered ring type between the Cu and AmIP causes the high binding force of Am IP onto the Cu surface, resulting in the superior stability of the AmIP-Cu NPs in a solution. The purified powder of AmIP-Cu NPs can be redispersed in alcohol-based solvents up to high Cu contents of 45 wt % for the preparation of Cu nanoink. The resistivity of the conductive Cu film obtained from the Cu nanoink was 30 μΩ cm after thermal heating at 150 °C for 15 min under a nitrogen flow. The long-term resistance stability of the Cu film under an air atmosphere was also demonstrated.