In situ thermomechanical testing methods for micro/nano-scale materials

A temperature-adjustable in situ infrared diffuse reflectance spectroscopy system for catalysts

We introduce an innovative in situ infrared diffuse reflection rapid detection system, endowed with a temperature regulation function. This system is adept at conducting rapid infrared spectra scanning as well as simulating the catalytic environment of diverse reaction systems. The infrared absorption spectra of four kinds of Pt-based catalysts under vacuum conditions across a wide temperature spectrum ranging from -180 to 300 °C are obtained and analysed through IR correlation spectroscopy. A key finding is the notable variance in peak intensity within Pt/CeO2/CNT catalysts, highlighting a robust adsorption capacity for oxygen-containing groups at lower temperatures and a marked desorption at higher temperatures. By enabling rapid and accurate assessments of catalyst behavior under varying temperatures, it not only accelerates the evaluation process but also provides valuable insights that can guide the synthesis of more efficient catalysts.

A 3D printed tensile testing system for micro-scale specimens

Mechanical property characterization of micro-scale material systems, such as free-standing films or small diameter wires (<20 µm), often requires expensive, specialized test systems. Conventional tensile test systems are usually designed for millimeter scale specimens with the force sensing capability of >1N while microdevice-based testers are intended for micro-/nano-scale specimens operating within a much smaller force range of <10 mN. This disparity leaves a technology gap in reliable and cost-effective characterization methods for specimens at the intermediate scale. In this research, we introduce the cost-effective and all-in-one tensile testing system with a built-in force sensor, self-aligning mechanisms, and loading frames. Owing to the advantages of 3D printing technologies, the ranges of force measurement (0.001-1 N) and displacement (up to tens of millimeters) of our 3D printed tensile tester can be readily tailored to suit specific material dimension and types. We have conducted a finite element simulation to identify the potential sources of the measurement error during tensile testing and addressed the dominant errors by simply modifying the dimension/design of the loading frames. As a proof-of-concept demonstration, we have characterized fine copper (Cu) wires with 10-25 µm diameters by the 3D printed tensile tester and confirmed that the measured mechanical properties match with the known values of bulk Cu. Our work shows that the proposed 3D printed tensile testing system offers a cost-efficient and easily accessible testing method for accurate mechanical characterization of specimens with cross-sectional dimensions of the order of tens of micrometers.

Timely and atomic-resolved high-temperature mechanical investigation of ductile fracture and atomistic mechanisms of tungsten

Revealing the atomistic mechanisms for the high-temperature mechanical behavior of materials is important for optimizing their properties for service at high-temperatures and their thermomechanical processing. However, due to materials microstructure’s dynamic recovery and the absence of available in situ techniques, the high-temperature deformation behavior and atomistic mechanisms of materials are difficult to evaluate. Here, we report the development of a microelectromechanical systems-based thermomechanical testing apparatus that enables mechanical testing at temperatures reaching 1556 K inside a transmission electron microscope for in situ investigation with atomic-resolution. With this unique technique, we first uncovered that tungsten fractures at 973 K in a ductile manner via a strain-induced multi-step body-centered cubic (BCC)-to-face-centered cubic (FCC) transformation and dislocation activities within the strain-induced FCC phase. Both events reduce the stress concentration at the crack tip and retard crack propagation. Our research provides an approach for timely and atomic-resolved high-temperature mechanical investigation of materials at high-temperatures.

High-temperature deformation of materials is challenging to evaluate. Here the authors develop a novel device that allows atomic resolved in situ high temperature mechanical tests inside a transmission electron microscope and reveal ductile fracture of a single crystal tungsten deformed at 973 K.

Advances in mechanical characterization of 1D and 2D nanomaterials: progress and prospects

Last several decades have sparked a tremendous interest in mechanical properties of low dimensional systems specifically 1D and 2D nanomaterials, in large, due to their remarkable behavior and potential to possess unique and customizable physical properties, which have encouraged the fabrication of new structures to be tuned and utilized for targeted applications. In this critical review we discuss examples that represent evolution of the mechanical characterization techniques developed for 1D and 2D nanomaterials, with special emphasis on specimen fabrication and manipulation, and the different strategies, tools and metrologies, employed for precise positioning and accurate measurements of materials’ strength, elastic modulus, fracture toughness as well as analysis of failure modes. We focus separately on techniques for the mechanical characterization of 1D and 2D nanomaterials and categorize those methods into top-down and bottom-up approaches. Finally, we discuss advantages and some drawbacks in most common methodologies used for 1D and 2D specimen testing and outline future possibilities and potential paths that could boost the development of more universal approaches for technologically viable solutions which would allow for more streamlined and standardized mechanical testing protocols to be developed and implemented.

Achieving micron-scale plasticity and theoretical strength in Silicon

As the backbone material of the information age, silicon is extensively used as a functional semiconductor and structural material in microelectronics and microsystems. At ambient temperature, the brittleness of Si limits its mechanical application in devices. Here, we demonstrate that Si processed by modern lithography procedures exhibits an ultrahigh elastic strain limit, near ideal strength (shear strength ~4 GPa) and plastic deformation at the micron-scale, one order of magnitude larger than samples made using focused ion beams, due to superior surface quality. This extended elastic regime enables enhanced functional properties by allowing higher elastic strains to modify the band structure. Further, the micron-scale plasticity of Si allows the investigation of the intrinsic size effects and dislocation behavior in diamond-structured materials. This reveals a transition in deformation mechanisms from full to partial dislocations upon increasing specimen size at ambient temperature. This study demonstrates a surface engineering pathway for fabrication of more robust Si-based structures.

Silicon is thought to be brittle, which limits its mechanical application in devices. Here, the authors lithographically fabricate silicon and show its superior surface quality leads to near ideal strength and micron-scale plasticity.

Depth-Sensing Indentation as a Micro- and Nanomechanical Approach to Characterisation of Mechanical Properties of Soft, Biological, and Biomimetic Materials

Classical methods of material testing become extremely complicated or impossible at micro-/nanoscale. At the same time, depth-sensing indentation (DSI) can be applied without much change at various length scales. However, interpretation of the DSI data needs to be done carefully, as length-scale dependent effects, such as adhesion, should be taken into account. This review paper is focused on different DSI approaches and factors that can lead to erroneous results, if conventional DSI methods are used for micro-/nanomechanical testing, or testing soft materials. We also review our recent advances in the development of a method that intrinsically takes adhesion effects in DSI into account: the Borodich-Galanov (BG) method, and its extended variant (eBG). The BG/eBG methods can be considered a framework made of the experimental part (DSI by means of spherical indenters), and the data processing part (data fitting based on the mathematical model of the experiment), with such distinctive features as intrinsic model-based account of adhesion, the ability to simultaneously estimate elastic and adhesive properties of materials, and non-destructive nature.

Investigation of reorganization of a nanocrystalline grain boundary network during biaxial creep deformation of nanocrystalline Ni using molecular dynamics simulation

In this paper, simulated biaxial creep deformation behaviour for nanocrystalline (NC) nickel (Ni) has been performed at various applied load (i.e. 1 GPa, 1.4 GPa, 2 GPa, 2.5 GPa and 3 GPa) for a particular temperature (i.e. 1210 K) using molecular dynamics (MD) simulation to investigate underlying deformation mechanism based on the structural evolution during biaxial creep process. Primary, secondary and tertiary stages of creep are observed to be exhibited significantly only at 3 GPa applied stress. While, only primary and secondary stages of creep are exhibited at 1 GPa applied stress. Atomic structural evaluation, dislocation density, shear strains, atomic trajectory, inverse pole figures and grain orientation with texture distribution have been carried out to evaluate structural evolution. Stress exponent (m) for NC Ni is analysed for a particular creep temperature (i.e. 1210 K) and obtained m value is 1.30. According to shear strains counter plot, accumulation of higher shear strains are observed at grain boundary (GB) during biaxial creep deformation. It is found that dislocation density during biaxial creep is increased with the progress of creep process. Grain rotation and texture evaluation during biaxial creep process are studied using grain tracking algorithm (GTA). Grain rotation in ultrafine-grained NC Ni specimen during biaxial creep deformation is happened and exhibits almost distinct distribution, which is occurred due to the atomic shuffling within the GBs. Grain growth of ultrafine grained NC Ni is observed during biaxial creep deformation which is caused by mechanical stress.

Novel high temperature vacuum nanoindentation system with active surface referencing and non-contact heating for measurements up to 800 °C

High temperature nanoindentation is an emerging field with significant advances in instrumentation, calibration, and experimental protocols reported in the past couple of years. Performing stable and accurate measurements at elevated temperatures holds the key for small scale testing of materials at service temperatures. We report a novel high temperature vacuum nanoindentation system, High Temperature Ultra Nanoindentation Tester (UNHT³ HTV), utilizing active surface referencing and non-contact heating capable of performing measurements up to 800 °C. This nanoindenter is based on the proven Ultra Nano-Hardness Tester (UNHT) design that uses two indentation axes: one for indentation and another for surface referencing. Differential displacement measurement between the two axes enables stable measurements to be performed over long durations. A vacuum level of 10^-7 mbar prevents sample surface oxidation at elevated temperatures. The indenter, reference, and sample are heated independently using integrated infrared heaters. The instrumental design details for developing a reliable and accurate high temperature nanoindenter are described. High temperature calibration procedures to minimize thermal drift at elevated temperatures are reported. Indentation data on copper, fused silica, and a hard coating show that this new generation of instrumented indenter can achieve unparalleled stability over the entire temperature range up to 800 °C with minimum thermal drift rates of <2 nm/min at elevated temperatures.

Temperature dependent Young's modulus of ZnO nanowires

A thermal resonant method was developed to accurately determine the temperature-dependent Young's moduli of nanowires. In this method, the frequency spectra of a [0001]-oriented ZnO nanowire cantilever at elevated temperatures were measured using scanning laser Doppler vibrometry. The temperature-dependent Young's moduli were derived from the resonant frequencies using Euler-Bernoulli beam theory. It was found that the modulus of ZnO nanowires decreased linearly with the increase of temperature from 300 to 650 K, independent of the nanowire diameter ranged from 101 to 350 nm. The temperature coefficient that defines the linear relationship between the dimensionless modulus and temperature is [Formula: see text] which agrees with that of [Formula: see text] being calculated using molecular dynamics with a partially charged rigid ion model.

A Novel Method for In Situ Electromechanical Characterization of Nanoscale Specimens

Electrically assisted deformation (EAD) is increasingly being used to improve the formability of metals during processes such as sheet metal rolling and forging. Adoption of this technique is proceeding despite disagreement concerning the underlying mechanism responsible for EAD. The experimental procedure described herein enables a more explicit study compared to previous EAD research by removing thermal effects, which are responsible for disagreement in interpreting previous EAD results. Furthermore, as the procedure described here enables EAD observation in situ and in real time in a transmission electron microscope (TEM), it is superior to existing post-mortem methods that observe EAD effects post-test. Test samples consist of a single crystal copper (SCC) foil having a free-standing tensile test section of nanoscale thickness, fabricated using a combination of laser and ion beam milling. The SCC is mounted to an etched silicon base that provides mechanical support and electrical isolation while serving as a heat sink. Using this geometry, even at high current density (~3,500 A/mm²), the test section experiences a negligible temperature increase (<0.02 °C), thus eliminating Joule heating effects. Monitoring material deformation and identifying the corresponding changes to microstructures, e.g. dislocations, are accomplished by acquiring and analyzing a series of TEM images. Our sample preparation and in situ experiment procedures are robust and versatile as they can be readily utilized to test materials with different microstructures, e.g., single and polycrystalline copper.