3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review

The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility in production from macro to micro-MID products, high fracture toughness when subjected to mechanical loading, and they are lightweight. This survey proposes a detailed review of different types of 3D-MID modules, also presents the requirement criteria for manufacture a polymer substrate and the main surface modification techniques used to enhance the polymer substrate. The findings presented here allow to fundamentally understand the concept of 3D-MID, which can be used to manufacture a novel polymer composite substrate.

Using a novel rigid-fluoride polymer to control the interfacial thickness of graphene and tailor the dielectric behavior of poly(vinylidene fluoride–trifluoroethylene–chlorotrifluoroethylene) nanocomposites

A rigid liquid crystalline fluoride-polymer has been chosen to tailor the shell thickness of rGO to investigate the effect of interfacial thickness on the dielectric behavior of polymer conductive nanocomposites.