1
|
Yan Y, Han M, Jiang Y, Ng ELL, Zhang Y, Owh C, Song Q, Li P, Loh XJ, Chan BQY, Chan SY. Electrically Conductive Polymers for Additive Manufacturing. ACS APPLIED MATERIALS & INTERFACES 2024; 16:5337-5354. [PMID: 38284988 DOI: 10.1021/acsami.3c13258] [Citation(s) in RCA: 4] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/30/2024]
Abstract
The use of electrically conductive polymers (CPs) in the development of electronic devices has attracted significant interest due to their unique intrinsic properties, which result from the synergistic combination of physicochemical properties in conventional polymers with the electronic properties of metals or semiconductors. Most conventional methods adopted for the fabrication of devices with nonplanar morphologies are still challenged by the poor ionic/electronic mobility of end products. Additive manufacturing (AM) brings about exciting prospects to the realm of CPs by enabling greater design freedom, more elaborate structures, quicker prototyping, relatively low cost, and more environmentally friendly electronic device creation. A growing variety of AM technologies are becoming available for three-dimensional (3D) printing of conductive devices, i.e., vat photopolymerization (VP), material extrusion (ME), powder bed fusion (PBF), material jetting (MJ), and lamination object manufacturing (LOM). In this review, we provide an overview of the recent research progress in the area of CPs developed for AM, which advances the design and development of future electronic devices. We consider different AM techniques, vis-à-vis, their development progress and respective challenges in printing CPs. We also discuss the material requirements and notable advances in 3D printing of CPs, as well as their potential electronic applications including wearable electronics, sensors, energy storage and conversion devices, etc. This review concludes with an outlook on AM of CPs.
Collapse
Affiliation(s)
- Yinjia Yan
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
| | - Miao Han
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
| | - Yixue Jiang
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
- Department of Materials Science and Engineering, College of Design and Engineering, National University of Singapore, 9 Engineering Drive 1, 117575, Singapore
| | - Evelyn Ling Ling Ng
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
| | - Yanni Zhang
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
| | - Cally Owh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
- Department of Biomedical Engineering, College of Design and Engineering, National University of Singapore, 9 Engineering Drive 1, 117575, Singapore
| | - Qing Song
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China
| | - Peng Li
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China
| | - Xian Jun Loh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
| | - Benjamin Qi Yu Chan
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
| | - Siew Yin Chan
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis #08-03, Singapore 138634, Republic of Singapore
| |
Collapse
|
2
|
Słoma M. 3D printed electronics with nanomaterials. NANOSCALE 2023; 15:5623-5648. [PMID: 36880539 DOI: 10.1039/d2nr06771d] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
A large variety of printing, deposition and writing techniques have been incorporated to fabricate electronic devices in the last decades. This approach, printed electronics, has gained great interest in research and practical applications and is successfully fuelling the growth in materials science and technology. On the other hand, a new player is emerging, additive manufacturing, called 3D printing, introducing a new capability to create geometrically complex constructs with low cost and minimal material waste. Having such tremendous technology in our hands, it was just a matter of time to combine advances of printed electronics technology for the fabrication of unique 3D structural electronics. Nanomaterial patterning with additive manufacturing techniques can enable harnessing their nanoscale properties and the fabrication of active structures with unique electrical, mechanical, optical, thermal, magnetic and biological properties. In this paper, we will briefly review the properties of selected nanomaterials suitable for electronic applications and look closer at the current achievements in the synergistic integration of nanomaterials with additive manufacturing technologies to fabricate 3D printed structural electronics. The focus is fixed strictly on techniques allowing as much as possible fabrication of spatial 3D objects, or at least conformal ones on 3D printed substrates, while only selected techniques are adaptable for 3D printing of electronics. Advances in the fabrication of conductive paths and circuits, passive components, antennas, active and photonic components, energy devices, microelectromechanical systems and sensors are presented. Finally, perspectives for development with new nanomaterials, multimaterial and hybrid techniques, bioelectronics, integration with discrete components and 4D-printing are briefly discussed.
Collapse
Affiliation(s)
- Marcin Słoma
- Micro- and Nanotechnology Division, Institute of Metrology and Biomedical Engineering, Faculty of Mechatronics, Warsaw University of Technology, 8 Sw. A Boboli St., 02-525 Warsaw, Poland.
| |
Collapse
|
3
|
Choi J, Han C, Cho S, Kim K, Ahn J, Del Orbe D, Cho I, Zhao ZJ, Oh YS, Hong H, Kim SS, Park I. Customizable, conformal, and stretchable 3D electronics via predistorted pattern generation and thermoforming. SCIENCE ADVANCES 2021; 7:eabj0694. [PMID: 34644113 PMCID: PMC8514101 DOI: 10.1126/sciadv.abj0694] [Citation(s) in RCA: 13] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/21/2021] [Accepted: 08/19/2021] [Indexed: 06/01/2023]
Abstract
Recently, three-dimensional electronics (3DE) is attracting huge interest owing to the increasing demands for seamless integration of electronic systems on 3D curvilinear surfaces. However, it is still challenging to fabricate 3DE with high customizability, conformability, and stretchability. Here, we present a fabrication method of 3DE based on predistorted pattern generation and thermoforming. Through this method, custom-designed 3DE is fabricated through the thermoforming process. The fabricated 3DE has high 3D conformability because the thermoforming process enables the complete replication of both the overall shape and the surface texture of the 3D mold. Furthermore, the usage of thermoplastic elastomer and a liquid metal–based conductive electrode allows for high thermoformability during the device fabrication as well as high stretchability during the device operation. We believe that this technology can enable a wide range of new functionalities and multiscale 3D morphologies in wearable electronics.
Collapse
Affiliation(s)
- Jungrak Choi
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Chankyu Han
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Seokjoo Cho
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Kyuyoung Kim
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Junseong Ahn
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
- Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM),156 Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, South Korea
| | - Dionisio Del Orbe
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Incheol Cho
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Zhi-Jun Zhao
- Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM),156 Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, South Korea
| | - Yong Suk Oh
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Hyunsoo Hong
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Seong Su Kim
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
| | - Inkyu Park
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, South Korea
- KAIST Institute (KI) for the NanoCentury, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, South Korea
| |
Collapse
|
4
|
Elder B, Zou Z, Ghosh S, Silverberg O, Greenwood TE, Demir E, Su VSE, Pak OS, Kong YL. A 3D-Printed Self-Learning Three-Linked-Sphere Robot for Autonomous Confined-Space Navigation. ADVANCED INTELLIGENT SYSTEMS (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2021; 3:2170064. [PMID: 35356413 PMCID: PMC8963778 DOI: 10.1002/aisy.202100039] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 03/01/2021] [Indexed: 06/14/2023]
Abstract
Reinforcement learning control methods can impart robots with the ability to discover effective behavior, reducing their modeling and sensing requirements, and enabling their ability to adapt to environmental changes. However, it remains challenging for a robot to achieve navigation in confined and dynamic environments, which are characteristic of a broad range of biomedical applications, such as endoscopy with ingestible electronics. Herein, a compact, 3D-printed three-linked-sphere robot synergistically integrated with a reinforcement learning algorithm that can perform adaptable, autonomous crawling in a confined channel is demonstrated. The scalable robot consists of three equally sized spheres that are linearly coupled, in which the extension and contraction in specific sequences dictate its navigation. The ability to achieve bidirectional locomotion across frictional surfaces in open and confined spaces without prior knowledge of the environment is also demonstrated. The synergistic integration of a highly scalable robotic apparatus and the model-free reinforcement learning control strategy can enable autonomous navigation in a broad range of dynamic and confined environments. This capability can enable sensing, imaging, and surgical processes in previously inaccessible confined environments in the human body.
Collapse
Affiliation(s)
- Brian Elder
- Department of Mechanical Engineering, University of Utah, Salt Lake City, UT 84112, USA
| | - Zonghao Zou
- Department of Mechanical Engineering, Santa Clara University, Santa Clara, CA 95053, USA
| | - Samannoy Ghosh
- Department of Mechanical Engineering, University of Utah, Salt Lake City, UT 84112, USA
| | - Oliver Silverberg
- Department of Mechanical Engineering, Santa Clara University, Santa Clara, CA 95053, USA
| | - Taylor E Greenwood
- Department of Mechanical Engineering, University of Utah, Salt Lake City, UT 84112, USA
| | - Ebru Demir
- Department of Mechanical Engineering, Santa Clara University, Santa Clara, CA 95053, USA
| | - Vivian Song-En Su
- Department of Mechanical Engineering, University of Utah, Salt Lake City, UT 84112, USA
| | - On Shun Pak
- Department of Mechanical Engineering, Santa Clara University, Santa Clara, CA 95053, USA
| | - Yong Lin Kong
- Department of Mechanical Engineering, University of Utah, Salt Lake City, UT 84112, USA
| |
Collapse
|
5
|
Rich SI, Jiang Z, Fukuda K, Someya T. Well-rounded devices: the fabrication of electronics on curved surfaces - a review. MATERIALS HORIZONS 2021; 8:1926-1958. [PMID: 34846471 DOI: 10.1039/d1mh00143d] [Citation(s) in RCA: 11] [Impact Index Per Article: 2.8] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/13/2023]
Abstract
With the arrival of the internet of things and the rise of wearable computing, electronics are playing an increasingly important role in our everyday lives. Until recently, however, the rigid angular nature of traditional electronics has prevented them from being integrated into many of the organic, curved shapes that interface with our bodies (such as ergonomic equipment or medical devices) or the natural world (such as aerodynamic or optical components). In the past few years, many groups working in advanced manufacturing and soft robotics have endeavored to develop strategies for fabricating electronics on these curved surfaces. This is their story. In this work, we describe the motivations, challenges, methodologies, and applications of curved electronics, and provide a outlook for this promising field.
Collapse
Affiliation(s)
- Steven I Rich
- Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.
| | | | | | | |
Collapse
|
6
|
Kim JH, Lee S, Wajahat M, Ahn J, Pyo J, Chang WS, Seol SK. 3D printing of highly conductive silver architectures enabled to sinter at low temperatures. NANOSCALE 2019; 11:17682-17688. [PMID: 31539002 DOI: 10.1039/c9nr05894j] [Citation(s) in RCA: 8] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/10/2023]
Abstract
Silver (Ag) nanoparticle-based inks are frequently used in printed electronics to form conductive patterns, but often require high-temperature sintering to achieve the optimum electrical conductivity, hindering their use in substrates with poor heat resistance. Herein, a three-dimensional (3D) printing strategy to produce highly conductive Ag 3D architectures that can be sintered at low temperatures is reported. This strategy is based on the additive deposition of Ag nanoparticles and microflakes via extrusion-based 3D printing with the Ag ink that involves poly(acrylic acid) (PAA)-stabilized Ag nanoparticles, Ag microflakes, and NaCl - a destabilizing agent. The designed Ag inks are stable and suitable for ink-extrusion 3D printing. In chemical sintering, Cl- can detach PAA from the Ag nanoparticle surface, enabling nanoparticle coalescence and sintering. An elevated annealing temperature induces increased NaCl density in the printed patterns and accelerates the surface and grain boundary diffusion of Ag atoms, contributing to enhance chemical sintering. On annealing at ∼110 °C for 30 min, the printed structures exhibited an electrical conductivity of ∼9.72 × 104 S cm-1, which is ∼15.6% of that of bulk Ag. Complicated Ag architectures with diverse shapes were successfully fabricated on polymeric substrates. Several structural electronic applications were demonstrated by hybrid 3D printing combining our extrusion-based 3D printing and conventional fused deposition modeling (FDM).
Collapse
Affiliation(s)
- Jung Hyun Kim
- Smart 3D printing TFT, Nano Hybrid Technology Research Center, Korea Electrotechnology Research Institute (KERI), Changwon-si, Gyeongsangnam-do 51543, Republic of Korea.
| | | | | | | | | | | | | |
Collapse
|
7
|
Lee HS, Jo Y, Joo JH, Woo K, Zhong Z, Jung S, Lee SY, Choi Y, Jeong S. Three-Dimensionally Printed Stretchable Conductors from Surfactant-Mediated Composite Pastes. ACS APPLIED MATERIALS & INTERFACES 2019; 11:12622-12631. [PMID: 30855933 DOI: 10.1021/acsami.8b21570] [Citation(s) in RCA: 11] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/09/2023]
Abstract
A stretchable conductor is a critical prerequisite to achieve various forms of stretchable electronics. In particular, directly printable stretchable conductors have gathered considerable attention with recent growing interest in a variety of large-area, deformable electronics. In this study, we have developed a chemical pathway of incorporating a surfactant with a moderate hydrophilic-lipophilic balance in formulating composite pastes for printed stretchable conductors, with a possibility of a vertically stackable, three-dimensional printing process. We demonstrate that the addition of a nonionic surfactant, sorbitane monooleate (commonly called SPAN 80) in Ag flake-based composite pastes, allows a critical reduction in resistance variation under an external strain. The four-layer stacked, surfactant-added composite conductors show a resistance variation of merely 1.6 at a strain of 0.6 and excellent cycling durability over 1000 cycles. The effectiveness of the methods suggested in this study is demonstrated with basic light-emitting diode circuits and the thermal heating characteristics of stretchable conductors.
Collapse
Affiliation(s)
- Hoi Sung Lee
- Division of Advanced Materials , Korea Research Institute of Chemical Technology (KRICT) , 19 Sinseongno , Yuseong-gu, Daejeon 305-600 , Korea
- Department of Advanced Materials Engineering , Chungbuk National University , 1 Chungdae-ro , Seowon-gu, Cheongju , Chungbuk 28644 , Korea
| | - Yejin Jo
- Division of Advanced Materials , Korea Research Institute of Chemical Technology (KRICT) , 19 Sinseongno , Yuseong-gu, Daejeon 305-600 , Korea
- Department of Chemical Convergence Materials , Korea University of Science and Technology (UST) , 217 Gajeongno , Yuseong-gu, Daejeon 305-350 , Korea
| | - Jong Hoon Joo
- Department of Advanced Materials Engineering , Chungbuk National University , 1 Chungdae-ro , Seowon-gu, Cheongju , Chungbuk 28644 , Korea
| | - Kyoohee Woo
- Advanced Manufacturing Systems Research Division , Korea Institute of Machinery and Materials (KIMM) , 156 Gajeongbuk-Ro , Yuseong-Gu, Daejeon 34103 , Republic of Korea
| | - Zhaoyang Zhong
- Advanced Manufacturing Systems Research Division , Korea Institute of Machinery and Materials (KIMM) , 156 Gajeongbuk-Ro , Yuseong-Gu, Daejeon 34103 , Republic of Korea
| | - Sungmook Jung
- Division of Advanced Materials , Korea Research Institute of Chemical Technology (KRICT) , 19 Sinseongno , Yuseong-gu, Daejeon 305-600 , Korea
| | - Su Yeon Lee
- Division of Advanced Materials , Korea Research Institute of Chemical Technology (KRICT) , 19 Sinseongno , Yuseong-gu, Daejeon 305-600 , Korea
| | - Youngmin Choi
- Division of Advanced Materials , Korea Research Institute of Chemical Technology (KRICT) , 19 Sinseongno , Yuseong-gu, Daejeon 305-600 , Korea
- Department of Chemical Convergence Materials , Korea University of Science and Technology (UST) , 217 Gajeongno , Yuseong-gu, Daejeon 305-350 , Korea
| | - Sunho Jeong
- Division of Advanced Materials , Korea Research Institute of Chemical Technology (KRICT) , 19 Sinseongno , Yuseong-gu, Daejeon 305-600 , Korea
- Department of Chemical Convergence Materials , Korea University of Science and Technology (UST) , 217 Gajeongno , Yuseong-gu, Daejeon 305-350 , Korea
| |
Collapse
|
8
|
Kamyshny A, Magdassi S. Conductive nanomaterials for 2D and 3D printed flexible electronics. Chem Soc Rev 2019; 48:1712-1740. [PMID: 30569917 DOI: 10.1039/c8cs00738a] [Citation(s) in RCA: 133] [Impact Index Per Article: 22.2] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/28/2022]
Abstract
This review describes recent developments in the field of conductive nanomaterials and their application in 2D and 3D printed flexible electronics, with particular emphasis on inks based on metal nanoparticles and nanowires, carbon nanotubes, and graphene sheets. We present the basic properties of these nanomaterials, their stabilization in dispersions, formulation of conductive inks and formation of conductive patterns on flexible substrates (polymers, paper, textile) by using various printing technologies and post-printing processes. Applications of conductive nanomaterials for fabrication of various 2D and 3D electronic devices are also briefly discussed.
Collapse
Affiliation(s)
- Alexander Kamyshny
- Casali Center for Applied Chemistry, Institute of Chemistry, The Hebrew University of Jerusalem, Edmond J. Safra Campus, 91904 Jerusalem, Israel.
| | | |
Collapse
|
9
|
Kim C, Ahn BY, Wei TS, Jo Y, Jeong S, Choi Y, Kim ID, Lewis JA. High-Power Aqueous Zinc-Ion Batteries for Customized Electronic Devices. ACS NANO 2018; 12:11838-11846. [PMID: 30395434 DOI: 10.1021/acsnano.8b02744] [Citation(s) in RCA: 58] [Impact Index Per Article: 8.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/08/2023]
Abstract
Wireless electronic devices require small, rechargeable batteries that can be rapidly designed and fabricated in customized form factors for shape conformable integration. Here, we demonstrate an integrated design and manufacturing method for aqueous zinc-ion batteries composed of polyaniline (PANI)-coated carbon fiber (PANI/CF) cathodes, laser micromachined zinc (Zn) anodes, and porous separators that are packaged within three-dimensional printed geometries, including rectangular, cylindrical, H-, and ring-shapes. The PANI/CF cathode possesses high surface area and conductivity giving rise to high rate (∼600 C) performance. Due to outstanding stability of Zn-PANI batteries against oxygen and moisture, they exhibit long cycling stability in an aqueous electrolyte solution. As exemplar, we demonstrated rechargeable battery packs with tunable voltage and capacity using stacked electrodes that are integrated with electronic components in customized wearable devices.
Collapse
Affiliation(s)
- Chanhoon Kim
- Department of Materials Science and Engineering , Korea Advanced Institute of Science and Technology , 291 Daehak-ro , Guseong-dong, Yuseong-gu, Daejeon 34141 , South Korea
| | - Bok Yeop Ahn
- Wyss Institute for Biologically Inspired Engineering , Harvard University , 3 Blackfan Circle , Boston , Massachusetts 02115 , United States
- John A. Paulson School of Engineering and Applied Sciences , Harvard University , 52 Oxford Street , Cambridge , Massachusetts 02138 , United States
| | - Teng-Sing Wei
- John A. Paulson School of Engineering and Applied Sciences , Harvard University , 52 Oxford Street , Cambridge , Massachusetts 02138 , United States
| | - Yejin Jo
- Division of Advanced Materials , Korea Research Institute of Chemical Technology , 176 Gajeong-dong , Yuseong-gu, Daejeon 34114 , South Korea
| | - Sunho Jeong
- Division of Advanced Materials , Korea Research Institute of Chemical Technology , 176 Gajeong-dong , Yuseong-gu, Daejeon 34114 , South Korea
| | - Youngmin Choi
- Division of Advanced Materials , Korea Research Institute of Chemical Technology , 176 Gajeong-dong , Yuseong-gu, Daejeon 34114 , South Korea
| | - Il-Doo Kim
- Department of Materials Science and Engineering , Korea Advanced Institute of Science and Technology , 291 Daehak-ro , Guseong-dong, Yuseong-gu, Daejeon 34141 , South Korea
| | - Jennifer A Lewis
- Wyss Institute for Biologically Inspired Engineering , Harvard University , 3 Blackfan Circle , Boston , Massachusetts 02115 , United States
- John A. Paulson School of Engineering and Applied Sciences , Harvard University , 52 Oxford Street , Cambridge , Massachusetts 02138 , United States
| |
Collapse
|