Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

The copper connectivity technique is essential for achieving electrical interconnection in wafer level packaging (WLP), system in packaging (SiP), and 3D packaging. The essential processing material for copper connectivity is a copper sulfate electroplating solution in which organic additives play a crucial role in the regularity of copper electrodeposition. In this study, electrochemical tests, X-ray diffraction, 3D profiling, and scanning electron microscopy were used to investigate the leveling effect and mechanism of polyquaternary ammonium urea-containing polymer (PUB2) in the process of copper electrodeposition on-chip copper connections. PUB2 has excellent polarization ability on the target surface, remains unaffected by the sulfur additive SPS and poly(ethylene glycol), and displays a strong ability to regulate the copper deposition rate of through-holes and surface wiring. The waviness of the wafer surface wiring was reduced from 130 to approximately 70 nm after optimizing the PUB2 concentration, and the surface roughness was reduced from 10 to approximately 7 nm. The coating was dispersed evenly, and the rate of through-hole filling was improved by 57%. This study not only examined PUB2 leveling performance and mechanisms but also devised a research method and system for electroplating additives to facilitate the development and application of new electroplating additives.

1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler. Galvanostatic Measurements (GMs), Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) tests were carried out to investigate the electrochemical behaviors of HPTT and its synergistic effect with other additives, in comparison with 1-phenyltetrazole-5-thione (PMT). GMs showed a convection-dependent interaction between PEP and HPTT. LSV and EIS tests indicated both HPTT and PMT enhanced the inhibition effect of PEP, and the synergistic effect of HPTT and PEP was stronger than that of PMT. Cross-section images illustrated the filling rate of the microvia with a 150 μm diameter and a 75 μm depth was 95.6% in 60 minutes with HPTT as the leveler. Frontier Molecular Orbitals (FMO) and Electrostatic Potential (ESP) of HPTT and PMT using quantum chemical calculations predicted the reaction sites for electrophilic and nucleophilic attack. Quantum chemical calculations suggested that HPTT is easier than PMT to bond to a copper surface and PEP.

Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler.

Electroplated Functional Materials with 3D Nanostructures Defined by Advanced Optical Lithography and Their Emerging Applications

Electroplating has been favored to date as a surface treatment technology in various industries in the development of semiconductors, automobiles, ships, and steel due to its advantages of being a simple, solution-based process, with low cost and high throughput. Recently, classical electroplating has been reborn as an advanced manufacturing process for functional materials by combining it with unconventional optical three-dimensional (3D) nanofabrication techniques capable of generating polymer templates with high-resolution 3D periodic nanostructures. The bottom-up filling behavior of electroplating rising from a seed layer makes it possible to densely fill the nanoporous network of the template with heterogeneous inorganic materials. At this time, understanding and optimizing the process parameters (e.g., additive, current density, type of current waveform, etc.) of electroplating is critical for defect control. In addition, since electroplating is generally performed near room temperature, unlike other thin film deposition techniques, structural damage to the polymer template by heat during electroplating is almost negligible. Based on the excellent compatibility of electroplating and optical 3D nanofabrication, innovative functional materials with 3D periodic nanostructures targeting electrochemical or energy-related applications have been created. In this mini review, a strategy for producing functional materials with 3D periodic nanostructures through a templating process will be covered, and the recent cases of successful applications to electrodes for energy storage devices, electrocatalysts, and thermoelectric materials will be summarized. We will also discuss technical issues that need to be considered in the process to improve the quality of the resulting functional materials with 3D nanoarchitectures.

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.