Efficient and reliable surface charge transfer doping of black phosphorus via atomic layer deposited MgO toward high performance complementary circuits

Enhanced Performance of P-Channel CuIBr Thin-Film Transistor by ITO Surface Charge-Transfer Doping

The process development and optimization of p-type semiconductors and p-channel thin-film transistors (TFTs) are essential for the development of high-performance circuits. In this study, the Br-doped CuI (CuIBr) TFTs are proposed by the solution process to control copper vacancy generation and suppress excess holes formation in p-type CuI films and improve current modulation capabilities for CuI TFTs. The CuIBr films exhibit a uniform surface morphology and good crystalline quality. The on/off current (ION/IOFF) ratio of CuIBr TFTs increased from 103 to 106 with an increase in the Br doping ratio from 0 to 15%. Furthermore, the performance and operational stability of CuIBr TFTs are significantly enhanced by indium tin oxide (ITO) surface charge-transfer doping. The results obtained from the first-principles calculations well explain the electron-doping effect of ITO overlayer in CuIBr TFT. Eventually, the CuIBr TFT with 15% Br content exhibits a high ION/IOFF ratio of 3 × 106 and a high hole field-effect mobility (μFE) of 7.0 cm2 V-1 s-1. The band-like charge transport in CuIBr TFT is confirmed by the temperature-dependent measurement. This study paves the way for the realization of transparent complementary circuits and wearable electronics.

Printed Electronics Based on 2D Material Inks: Preparation, Properties, and Applications toward Memristors

Printed electronics, which fabricate electrical components and circuits on various substrates by leveraging functional inks and advanced printing technologies, have recently attracted tremendous attention due to their capability of large-scale, high-speed, and cost-effective manufacturing and also their great potential in flexible and wearable devices. To further achieve multifunctional, practical, and commercial applications, various printing technologies toward smarter pattern-design, higher resolution, greater production flexibility, and novel ink formulations toward multi-functionalities and high quality have been insensitively investigated. 2D materials, possessing atomically thin thickness, unique properties and excellent solution-processable ability, hold great potential for high-quality inks. Besides, the great variety of 2D materials ranging from metals, semiconductors to insulators offers great freedom to formulate versatile inks to construct various printed electronics. Here, a detailed review of the progress on 2D material inks formulation and its printed applications has been provided, specifically with an emphasis on emerging printed memristors. Finally, the challenges facing the field and prospects of 2D material inks and printed electronics are discussed.

Two-Dimensional Field-Effect Transistor Sensors: The Road toward Commercialization

The evolutionary success in information technology has been sustained by the rapid growth of sensor technology. Recently, advances in sensor technology have promoted the ambitious requirement to build intelligent systems that can be controlled by external stimuli along with independent operation, adaptivity, and low energy expenditure. Among various sensing techniques, field-effect transistors (FETs) with channels made of two-dimensional (2D) materials attract increasing attention for advantages such as label-free detection, fast response, easy operation, and capability of integration. With atomic thickness, 2D materials restrict the carrier flow within the material surface and expose it directly to the external environment, leading to efficient signal acquisition and conversion. This review summarizes the latest advances of 2D-materials-based FET (2D FET) sensors in a comprehensive manner that contains the material, operating principles, fabrication technologies, proof-of-concept applications, and prototypes. First, a brief description of the background and fundamentals is provided. The subsequent contents summarize physical, chemical, and biological 2D FET sensors and their applications. Then, we highlight the challenges of their commercialization and discuss corresponding solution techniques. The following section presents a systematic survey of recent progress in developing commercial prototypes. Lastly, we summarize the long-standing efforts and prospective future development of 2D FET-based sensing systems toward commercialization.

Defect Engineering in Thickness-Controlled Bi2O2Se-Based Transistors by Argon Plasma Treatment

We present a simple, effective, and controllable method to uniformly thin down the thickness of as-exfoliated two-dimensional Bi₂O₂Se nanoflakes using Ar⁺ plasma treatment. Atomic force microscopy (AFM) images and Raman spectra indicate that the surface morphology and crystalline quality of etched Bi₂O₂Se nanoflakes remain almost unaffected. X-ray photoelectron spectra (XPS) indicate that the O and Se vacancies created during Ar⁺ plasma etching on the top surface of Bi₂O₂Se nanoflakes are passivated by forming an ultrathin oxide layer with UV O₃ treatment. Moreover, a bottom-gate Bi₂O₂Se-based field-effect transistor (FET) was constructed to research the effect of thicknesses and defects on electronic properties. The on-current/off-current (I_on/I_off) ratio of the Bi₂O₂Se FET increases with decreasing Bi₂O₂Se thickness and is further improved by UV O₃ treatment. Eventually, the thickness-controlled Bi₂O₂Se FET achieves a high I_on/I_off ratio of 6.0 × 10⁴ and a high field-effect mobility of 5.7 cm² V^-1 s^-1. Specifically, the variation trend of the I_on/I_off ratio and the electronic transport properties for the bottom-gate Bi₂O₂Se-based FET are well described by a parallel resistor model (including bulk, channel, and defect resistance). Furthermore, the I_ds-V_gs hysteresis and its inversion with UV irradiation were observed. The pulsed gate and drain voltage measurements were used to extract trap time constants and analyze the formation mechanism of different hysteresis. Before UV irradiation, the origin of clockwise hysteresis is attributed to the charge trapping/detrapping of defects at the Bi₂O₂Se/SiO₂ interface and in the Bi₂O₂Se bulk. After UV irradiation, the large anticlockwise hysteresis is mainly due to the tunneling between deep-level oxygen defects in SiO₂ and p⁺⁺-Si gate, which implies the potential in nonvolatile memory.

A Roadmap for Disruptive Applications and Heterogeneous Integration Using Two-Dimensional Materials: State-of-the-Art and Technological Challenges

This Mini Review attempts to establish a roadmap for two-dimensional (2D) material-based microelectronic technologies for future/disruptive applications with a vision for the semiconductor industry to enable a universal technology platform for heterogeneous integration. The heterogeneous integration would involve integrating orthogonal capabilities, such as different forms of computing (classical, neuromorphic, and quantum), all forms of sensing, digital and analog memories, energy harvesting, and so forth, all in a single chip using a universal technology platform. We have reviewed the state-of-the-art 2D materials such as graphene, transition metal dichalcogenides, phosphorene and hexagonal boron nitride, and so forth, and how they offer unique possibilities for a range of futuristic/disruptive applications. Besides, we have discussed the technological and fundamental challenges in enabling such a universal technology platform, where the world stands today, and what gaps are required to be filled.

2D Homojunctions for Electronics and Optoelectronics

In the post-Moore era, 2D materials with rich physical properties have attracted widespread attention from the scientific and industrial communities. Among 2D materials, the 2D homojunctions are of great promise in designing novel electronic and optoelectronic devices due to their unique geometries and properties such as homogeneous components, perfect lattice matching, and efficient charge transfer at the interface. In this article, a pioneering review focusing on the structural design and device application of 2D homojunctions such as p-n homojunctions, heterophase homojunctions, and layer-engineered homojunctions is provided. The preparation strategies to construct 2D homojunctions including vapor-phase deposition, lithium intercalation, laser irradiation, chemical doping, electrostatic doping, and photodoping are summarized in detail. Specifically, a careful review on the applications of the 2D homojunctions in electronics (e.g., field-effect transistors, rectifiers, and inverters) and optoelectronics (e.g., light-emitting diodes, photovoltaics, and photodetectors) is provided. Eventually, the current challenges and future perspectives are commented for promoting the rapid development of 2D homojunctions.

Complementary Driving between 2D Heterostructures and Surface Functionalization for Surpassing Binary Logic Devices

Recently, for overcoming the fundamental limits of conventional silicon technology, multivalued logic (MVL) circuits based on two-dimensional (2D) materials have received significant attention for reducing the power consumption and the complexity of integrated circuits. Compared with the conventional silicon complementary metal oxide semiconductor technology, new functional heterostructures comprising 2D materials can be readily implemented, owing to their unique inherent electrical properties. Furthermore, their process integration does not pose issues of lattice mismatch at junction interfaces. This facilitates the realization of new functional logic gate circuit configurations. However, the reported three-valued NOT gates (ternary inverters) based on 2D materials require stringent operating conditions and complex fabrication processes to obtain three distinct logic states. Herein, a general structure of MVL devices based on a simple series connection of 2D materials with partial surface functionalization is demonstrated. By arranging three 2D materials exhibiting p-type, ambipolar, and n-type conductivities, ternary inverter circuits can be established based on the complementary driving between 2D heterotransistors. This ternary inverter circuit can be further improved for quaternary inverter circuits by controlling the charge neutral point of partial ambipolar 2D materials using surface functionalization, which is an effective and nondestructive doping method for 2D materials.

N-type doping of black phosphorus single crystal by tellurium

Black phosphorus has many potential applications in optoelectronic devices because of its unique properties. Adjusting its performance by doping is an important issue of research. In this paper, we synthesized high-quality Te-doped crystals by the chemical vapor transport method. Tellurium doping with an atomic ratio of 0.1% was confirmed by X-ray photoelectron spectroscopy, X-ray diffraction, and energy dispersive X-ray analysis. The performance of field effect transistors devices shows that the hole mobility of Te-doped black phosphorous (BP) is significantly improved compared with that of undoped-BP. The highest hole mobility at room temperature is 719 cm² V^-1 s^-1, and the electron mobility is 63 cm² V^-1 s^-1. Te-doped BP field effect transistors show an obvious bipolar behavior.

Interface engineering of two-dimensional transition metal dichalcogenides towards next-generation electronic devices: recent advances and challenges

Over the past decade, two-dimensional (2D) transition metal dichalcogenides (TMDCs) have attracted tremendous research interest for future electronics owing to their atomically thin thickness, compelling properties and various potential applications. However, interface engineering including contact optimization and channel modulations for 2D TMDCs represents fundamental challenges in ultimate performance of ultrathin electronics. This article provides a comprehensive overview of the basic understanding of contacts and channel engineering of 2D TMDCs and emerging electronics benefiting from these varying approaches. In particular, we elucidate multifarious contact engineering approaches such as edge contact, phase engineering and metal transfer to suppress the Fermi level pinning effect at the metal/TMDC interface, various channel treatment avenues such as van der Waals heterostructures, surface charge transfer doping to modulate the device properties, and as well the novel electronics constructed by interface engineering such as diodes, circuits and memories. Finally, we conclude this review by addressing the current challenges facing 2D TMDCs towards next-generation electronics and offering our insights into future directions of this field.

Improvement in the quality of black phosphorus by selecting a mineralizer

The low-cost synthesis of high-quality black phosphorus (BP) has always been a challenge. Herein, we selected different mineralizers to synthesize high-crystallinity BP by the chemical vapor transport (CVT) method and demonstrated that the use of Pb instead of Sn can lead to higher purity BP. Residual Sn in Sn-BP was confirmed by X-ray photoelectron spectroscopy (XPS), but no mineralizer impurity was observed in Pb-BP. The performance of FET devices showed that the hole mobility of Pb-BP was significantly higher than that of Sn-BP. On the other hand, the Pb-BP devices exhibited good bipolarity with the highest hole mobility of 523 cm² V^-1 s^-1 at room temperature and electron mobility of up to 28 cm² V^-1 s^-1.

Combustion synthesis of electrospun LaInO nanofiber for high-performance field-effect transistors

One-dimensional semiconductor nanofibers are regarded as ideal materials for electronics due to their distinctive morphology and characteristics. In this work, La-doped indium oxide (LaInO) nanofibers are fabricated as the channel layer to reduce O vacancies and the density of interface trap states; this is clearly confirmed by investigating the stability under positive bias stress and the capacitance-voltage for field-effect transistors (FETs). The In₂O₃ nanofiber FETs optimized by doping with 5 mol% La exhibit excellent electrical performance with a mobility of 4.95 cm² V^-1 s^-1 and an on/off current ratio of 1.1 × 10⁸. In order to further enhance the electrical performance of LaInO nanofiber FETs, ZrAlO _x film, which has a high dielectric constant, is employed as the insulator for the LaInO nanofiber FETs. The LaInO nanofiber FETs with ZrAlO _x insulator have a high mobility of 13.5 cm² V^-1 s^-1. These findings clearly indicate the great promise of La-doped In₂O₃ nanofibers in future one-dimensional nanoelectronics.

Doping-Free Arsenene Heterostructure Metal-Oxide-Semiconductor Field Effect Transistors Enabled by Thickness Modulated Semiconductor to Metal Transition in Arsenene

Two-dimensional (2-D) materials such as MoS₂ and phosphorene provide an ideal platform to realize extremely thin body metal-oxide-semiconductor field effect transistors (MOSFETs) which is highly immune to short channel effects in the ultra-scaled regime. Even with the excellent electrostatic integrity inherent in 2-D system, however, 2-D materials suffer from the lack of efficient doping method which is crucial in MOSFETs technology. Recently, an unusual phase transition from semiconductor to metal driven by the thickness modulation has been predicted in mono-elemental 2-D material arsenene. Utilizing this extraordinary property, we propose doping-free arsenene heterostructure MOSFETs based on the lateral multilayer (metallic source)/monolayer (semiconducting channel)/multilayer (metallic drain) arsenene heterostructure. Metallic multilayer arsenene in the source and drain can serve as electrodes without doping. We investigate the potential performance of arsenene heterostructure MOSFETs through atomistic simulations using density functional theory and nonequilibrium Green’s function. The intrinsic upper limit of the on-state current in arsenene heterostructure MOSFETs is estimated by studying the effect of layer number in the source and drain. We comprehensively analyze the competitiveness of arsenene heterostructure MOSFETs through benchmarking with monolayer arsenene homostructure MOSFETs equipped with the highly degenerate doped source and drain, suggesting superior performance of heterostructure MOSFETs over homostructure MOSFETs.