Synthesis of High-Performance Colorless Polyimides with Asymmetric Diamine: Application in Flexible Electronic Devices

Colorless polyimides (CPIs) are widely used as high-performance materials in flexible electronic devices. From a molecular design standpoint, the industry continues to encounter challenges in developing CPIs with desired attributes, including exceptional optical transparency, excellent thermal stability, and enhanced mechanical strength. This study presents and validates a method for controlling 2-substituents, with a specific emphasis on examining how these substituents affect the thermal, mechanical, optical, and dielectric characteristics of CPIs. The presence of two CF3 groups on the same side of the diamine structure ensured the transmittance of the film. The charge transfer effect and the molecular distance are dynamically regulated by changing the 2-substituent (-OCH3/-CH3/H/F). The polyimide exhibited a well-maintained equilibrium between transparency and thermal stability, with a T500nm value ranging from 86.2 to 89.6% in the visible region, and a glass transition temperature (Tg) ranging from 358.6 to 376.0 °C. Additionally, the 6FDA-2-MTFMB compound, when combined with methyl, excels as a protective layer and base material, exhibiting excellent performance in various aspects. It has been verified as an appropriate option for flexible photodetectors and wearable piezoresistive sensors. In summary, this systematic investigation will provide a comprehensive and demonstrative methodology for developing CPIs that are capable of adapting to flexible electronic devices.

Ultralow Coefficient of Thermal Expansion and a High Colorless Transparent Polyimide Film Realized Through a Reinforced Hydrogen-Bond Network by In Situ Polymerization of Aromatic Polyamide in Colorless Polyimide

Colorless polyimides (CPIs) are a key substrate material for flexible organic light-emitting diode (OLED) displays and have attracted worldwide attention. Here, in this paper, the dispersion and interfacial interaction of aromatic polyamide (PA) in CPI (synthesized from 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFMB)) were significantly improved by in situ polymerization, and colorless transparent macromolecular polyimide composites (CPI-PAx) were successfully prepared by PA and CPI. By adjusting the ratio of PA to CPI, a high-performance engineering plastic with excellent film-forming properties was obtained. Molecular simulations confirmed the uniform distribution of PA in CPI and its interaction in polymers. In CPI-PAx, the CPI was locked by the PA chain, and numerous molecular chains were mutually entangled to form a hydrogen-bond network structure. Due to the strong interaction between the chains imparted by the hydrogen bonds of the PA, they do not slide under external forces and heating. In addition, the additive PA has excellent dimensional stability, thermal, and mechanical properties, and CPI has outstanding optical properties, so the synthesized CPI-PAx combines the comprehensive properties of PA and CPI. The CPI-PAx has excellent thermal and mechanical properties, with a thermal decomposition temperature of 499 °C, a glass transition temperature of 385 °C, a coefficient of thermal expansion of 0.8 ppm K-1, a tensile strength of 50.9 MPa, and an elastic modulus of 3.9 GPa. Particularly, CPI-PAx has a 90% transmittance in the visible region. These data prove that the strategy of combining PA and CPI by in situ polymerization is an effective method to circumvent the bottleneck of CPI in the current flexible window application, and this design strategy is universal.

Constructing Sandwich-Structured Poly(vinyl alcohol) Composite Films with Thermal Conductive and Electrical Performance

With the miniaturization and high integration development in microelectronic devices, the problem of heat dissipation has attracted widespread attention. Highly thermal conductive and electrical insulation polymer composites show great advantages to solve the problems of heat dissipation. Nevertheless, the fabrication of polymer composites with both excellent thermal conductivity and electrical performance is still a great challenge. Herein, to coordinate the thermal and electrical properties of the composite film, the sandwich-structured poly(vinyl alcohol) (PVA)/boron phosphide (BP)-boron nitride nanosheet (BNNS) composite films were prepared, with the PVA/BP composite film as the top and bottom layers and the BNNS layer as the middle layer. When the filler loading was 31.92 wt %, the sandwich-structured composite films showed excellent in-plane thermal conductivity (9.45 W·m^-1·K^-1), low dielectric constant (1.25 at 10² Hz), and excellent breakdown strength. In the composite film, the interconnected BP particles and BNNS layer formed several heat dissipation pathways to increase the thermal conductivity, while the insulated BNNS layer hampered the electron transformation to enhance the electrical resistivity of films. Therefore, the PVA/BP-BNNS composite films showed a potential application in heat dissipation of high power electronic devices.

Overall Improvement in Dielectric, Water Resistance and Mechanical Properties of Polyimide Film via Synergy between GO and Sandwich-type Porous Structure

Simultaneous improvement in dielectric, water resistance and mechanical properties of polyimide (PI) films is critical for their practical use, but difficult to achieve. Herein, a sandwich-type porous GO/PI film with excellent comprehensive properties was obtained through integrating a GO-containing complex, fluorine-containing porous structure and sandwich-type distribution of porous structure by a simple, low-cost and green breath figure method. With the addition of only a small amount of GO-containing complex, a low dielectric constant of 2.21, water absorption of 0.51%, increment in dielectric constant after moisture treatment of 1.60% and high tensile strength of 113.1 MPa, tensile modulus of 1.70 GPa, with 35.39%, 79.42%, 81.81% of reduction and 17.22%, 21.43% of increase compared to PI film were shown, respectively. Moreover, these properties could be adjusted through regulating the component and porous structure by changing the parameters of breath figure method. These outstanding properties make the film a promising candidate for high-performance low-dielectric materials.

Design and synthesis of novel poly (aryl ether ketones) containing trifluoromethyl and trifluoromethoxy groups

The high-frequency and high-speed communication in the 5 G era puts forward requirements for the dielectric properties of polymers. Introducing fluorine into poly(ary ether ketone) can improve its dielectric properties. In this work, by introducing the fluorine group strategy, we successfully designed and synthesized three novel trifluoromethyl (-CF₃) or trifluoromethoxy (-OCF₃)-containing bisphenol monomers and their F-substitution PEK-based polymers (PEK-Ins). All these PEK-Ins exhibited good thermal, mechanical and dielectric properties. The T d5% of the three polymers is all higher than 520℃. The free volume fraction of novel polymers increased from 3.75% to 5.72%. Among the three polymers, exhibited the lowest dielectric constant of the films is 2.839, and the dielectric loss is 0.0048, ascribing to the increasing free volume. The Young's modulus of the polymer film is as high as 2.9 GPa and the tensile strength is as high as 84 MPa. PEK-Ins reduced the dielectric constant by introducing a low fluorine content. This study provides a new way to design PEK to synthesize low dielectric constant polymers.

Reduced coefficient of linear thermal expansion for colorless and transparent polyimide by introducing rigid-rod amide units: synthesis and properties

Polyimide films with high optical transparency and dimensional stability and low linear thermal expansion were synthesized by introducing rigid-rod amide units.

Perfluorocyclobutyl-containing transparent polyimides with low dielectric constant and low dielectric loss

The combination of loose chain packing and high fluoro content endows PFCB-containing polyimides with excellent optical transparency and dielectric properties.

Preparation and Characterization of Intrinsic Low-κ Polyimide Films

Three fluorinated polyimide (PI-FP, PI-FO and PI-FH) films with low dielectric constants and excellent comprehensive properties were successfully prepared using a polycondensation reaction method by incorporating p-phenylenediamine (PDA), 4-4′-diaminodiphenyl ether (ODA) and 4,4′-(Hexafluoroisopropylidene) bis (p-phenyleneoxy) dianiline (HFPBDA) into 4,4′-(Hexafluoroisopropylidene) diphthalic anhydride (6FDA), respectively. The effects of the diamine monomer structure on optical, dielectric and mechanical properties were investigated. Compared with PDA and ODA, HFPBDA can effectively improve the optical and dielectric properties of PI due to due to its special chain structure. Among the three PI films, PI-FH film presents the best optic transmission (highest transmittance = 90.2%) and highest energy gap (2.69 eV). The dielectric properties of PI-FH film improve the most. The dielectric constant and loss at 10⁴ Hz are reduced to 2.05 and 0.0034 at 10⁴ Hz, respectively, and remain stable up to 250 °C. The mechanical properties decrease in turn for PI-FP, PI-FO and PI-FH films due to the increase in free volume fraction. Nevertheless, PI-FH film still exhibits good mechanical properties with a tensile strength of 88.4 Mpa, a tensile modulus of 2.11 GPa and an elongation at break of 4.1%. The correlation between the dielectric and mechanical properties of PI films and their free volume characteristics is well explained with the help of positron annihilation spectroscopy.

New Poly(imide)s Bearing Alkyl Side-Chains: A Study on the Impact of Size and Shape of Lateral Groups on Thermal, Mechanical, and Gas Transport Properties

A set of five new aromatic poly(imide)s (PIs) incorporating pendant acyclic alkyl moieties were synthesized. The difference among them was the length and bulkiness of the pendant group, which comprises of linear alkyl chains from three to six carbon atoms, and a tert-butyl moiety. The effect of the side group length on the physical, thermal, mechanical, and gas transport properties was analyzed. All PIs exhibited low to moderate molecular weights (Mn ranged between 27.930–58.970 Da, and Mw ranged between 41.760–81.310 Da), good solubility in aprotic polar solvents, except for PI-t-4, which had a tert-butyl moiety and was soluble even in chloroform. This behaviour was probably due to the most significant bulkiness of the side group that increased the interchain distance, which was corroborated by the X-ray technique (PI-t-4 showed two d-spacing values: 5.1 and 14.3 Å). Pure gas permeabilities for several gases were reported (PI-3 (Barrer): He(52); H₂(46); O₂(5.4); N₂(1.2); CH₄(1.1); CO₂(23); PI-t-4 (Barrer): He(139); H₂(136); O₂(16.7); N₂(3.3); CH₄(2.3); CO₂(75); PI-5 (Barrer): He(44); H₂(42); O₂(5.9); N₂(1.4); CH₄(1.2); CO₂(27); PI-6 (Barrer): He(45); H₂(43); O₂(6.7); N₂(1.7); CH₄(1.7); CO₂(32)). Consistent higher volume in the side group was shown to yield the highest gas permeability. All poly(imide)s exhibited high thermal stability with 10% weight loss degradation temperature between 448–468 °C and glass transition temperature between 240–270 °C. The values associated to the tensile strength (45–87 MPa), elongation at break (3.2–11.98%), and tensile modulus (1.43–2.19 GPa) were those expected for aromatic poly(imide)s.

Understanding how intrinsic micro-pores affect the dielectric properties of polymers: an approach to synthesize ultra-low dielectric polymers with bulky tetrahedral units as cores

Two fluoro-containing low dielectric polymers have been successfully prepared based on thermo-crosslinkable trifluorovinyl ether (TFVE) monomers with bulky tetrahedral units (adamantane and spirobifluorene).

Quartz fiber cloth-reinforced semi-aromatic thermosetting polyimide composite with high-frequency low dielectric constant

We report a series of semi-aromatic thermosetting polyimide (PI) resins that can be used as matrix for copper-clad laminates for high-frequency applications. The poly(amic ester) (PAE) resins derived from the diester of 1,2,4,5-cyclohexanetetracarboxylic dianhydride, aromatic diamines (the mixture of 2,2′-dimethylbenzidine and 2,2′-bis[4-(4-aminophenoxy) phenyl] propane), and the monoester of nadic anhydride were synthesized by Polymerization of Monomer Reactants (PMR) method. The structure conversion of PAE resins at different temperatures was investigated and the B-stage PI powders prepared by thermally baking the PAE resins at 220°C are nearly fully imidized. The viscosities of the B-stage PI powders and the mechanical and thermal properties of the cured PI resins were optimized by varying the molar ratio of the two diamines. The cured PI resins possess low and steady dielectric constants ( Dk) below 3.0 and dielectric dissipation factors ( Df) of less than 0.01 at high frequency of 1–12 GHz. Furthermore, the quartz fiber cloth-reinforced semi-aromatic thermosetting PI composites (QF/PI) exhibit excellent dielectric performance, good heat resistance, and mechanical properties. At a high frequency of 1–12 GHz, the Dk of QF/PI-4 is stable in the range of 3.16–3.2, and the Df is stable in the range of 0.0026–0.0046. These results suggest the potential of the semi-aromatic QF/PI for use in high-frequency IC boards.