Alghamdi AA. Computational Optimization of Sandwich Silicone Rubber Composite for Improved Thermal Conductivity and Electrical Insulation.
Polymers (Basel) 2024;
16:616. [PMID:
38475300 DOI:
10.3390/polym16050616]
[Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/22/2024] [Revised: 02/17/2024] [Accepted: 02/22/2024] [Indexed: 03/14/2024] Open
Abstract
The efficient dissipation of heat has emerged as a crucial concern for modern electronic devices, given the continuous increase in their power density and consumption. Thus, the utilization of thermally conductive but electrically insulating silicone rubber composites as a thermal interface material has garnered significant interest. In this study, the effects of the filler volume fraction, filler orientation, layer volume fractions, layer configuration, and a number of layers on the thermal conductivity and electrical resistivity of silicone rubber composites were examined using a multiscale finite element modeling strategy. The results demonstrated that modification of the filler orientation can change the thermal conductivity by 28 and 21 times in the in-plane and through-thickness directions, respectively. The in-plane thermal conductivities of silicone rubber/boron nitride and silicone rubber/expanded graphite layers exhibit a percolation phenomenon at filler volume fractions of 35% and 30%, respectively. The electrical resistivity of the composite increases exponentially with a decrease in the number of layers.
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