Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites

Flexible and Stretchable Light-Emitting Diodes and Photodetectors for Human-Centric Optoelectronics

Optoelectronic devices with unconventional form factors, such as flexible and stretchable light-emitting or photoresponsive devices, are core elements for the next-generation human-centric optoelectronics. For instance, these deformable devices can be utilized as closely fitted wearable sensors to acquire precise biosignals that are subsequently uploaded to the cloud for immediate examination and diagnosis, and also can be used for vision systems for human-interactive robotics. Their inception was propelled by breakthroughs in novel optoelectronic material technologies and device blueprinting methodologies, endowing flexibility and mechanical resilience to conventional rigid optoelectronic devices. This paper reviews the advancements in such soft optoelectronic device technologies, honing in on various materials, manufacturing techniques, and device design strategies. We will first highlight the general approaches for flexible and stretchable device fabrication, including the appropriate material selection for the substrate, electrodes, and insulation layers. We will then focus on the materials for flexible and stretchable light-emitting diodes, their device integration strategies, and representative application examples. Next, we will move on to the materials for flexible and stretchable photodetectors, highlighting the state-of-the-art materials and device fabrication methods, followed by their representative application examples. At the end, a brief summary will be given, and the potential challenges for further development of functional devices will be discussed as a conclusion.

Brownian Diffusion of Hexagonal Boron Nitride Nanosheets and Graphene in Two Dimensions

Two-dimensional (2D) nanomaterials have numerous interesting chemical and physical properties that make them desirable building blocks for the manufacture of macroscopic materials. Liquid-phase processing is a common method for forming macroscopic materials from these building blocks including wet-spinning and vacuum filtration. As such, assembling 2D nanomaterials into ordered functional materials requires an understanding of their solution dynamics. Yet, there are few experimental studies investigating the hydrodynamics of disk-like materials. Herein, we report the lateral diffusion of hexagonal boron nitride nanosheets (h-BN and graphene) in aqueous solution when confined in 2-dimensions. This was done by imaging fluorescent surfactant-tagged nanosheets and visualizing them by using fluorescence microscopy. Spectroscopic studies were conducted to characterize the interactions between h-BN and the fluorescent surfactant, and atomic force microscopy (AFM) was conducted to characterize the quality of the dispersion. The diffusion data under different gap sizes and viscosities displayed a good correlation with Kramers' theory. We propose that the yielded activation energies by Kramers' equation express the magnitude of the interaction between fluorescent surfactant tagged h-BN and glass because the energies remain constant with changing viscosity and decrease with increasing confinement size. The diffusion of graphene presented a similar trend with similar activation energy as the h-BN. This relationship suggests that Kramers' theory can also be applied to simulate the diffusion of other 2D nanomaterials.

Cross-Linking-Filler Composite Materials of Functionalized Hexagonal Boron Nitride and Polyrotaxane Elastomer

This study demonstrates cross-linking-filler composites in which covalent bonds between the fillers and polymer chains act as the main cross-linking points for the development of flexible and thermally conductive materials. Cross-linking-filler composites are fabricated using functionalized hexagonal boron nitride (hBN) fillers and polyrotaxane, called slide-ring polymers. The hBN particles modified with a carbon layer were produced by plasma processing in hydroquinone aqueous solution and functionalized with isocyanate groups. As the functionalized hBN provides cross-linking points for polyrotaxane, the cross-linking-filler composites can reduce cross-linking agents among polyrotaxane and exhibit considerable flexibility. Young's moduli of the cross-linking-filler composites are much lower than those of previously reported polyrotaxane composites while retaining their toughness. These values are relatively close to those of unfilled polyrotaxane elastomers, despite containing hBN fillers with a content of 50 wt %. Thus, the cross-linking-filler composites exhibit a combination of flexibility and thermal conductivity, which few hBN/elastomer composites have achieved.

Fabrication, Thermal Conductivity, and Mechanical Properties of Hexagonal-Boron-Nitride-Pattern-Embedded Aluminum Oxide Composites

As electronics become more portable and compact, the demand for high-performance thermally conductive composites is increasing. Given that the thermal conductivity correlates with the content of thermally conductive fillers, it is important to fabricate composites with high filler loading. However, the increased viscosity of the composites upon the addition of these fillers impedes the fabrication of filler-reinforced composites through conventional methods. In this study, hexagonal-boron-nitride (h-BN)-pattern-embedded aluminum oxide (Al₂O₃) composites (Al/h-BN/Al composites) were fabricated by coating a solution of h-BN onto a silicone-based Al₂O₃ composite through a metal mask with square open areas. Because this method does not require the dispersion of h-BN into the Al₂O₃ composite, composites with high filler loading could be fabricated without the expected problems arising from increased viscosity. Based on the coatability and thixotropic rheological behaviors, a composite with 85 wt.% Al₂O₃ was chosen to fabricate Al/h-BN/Al composites. The content of the Al₂O₃ and the h-BN of the Al/h-BN/Al-1 composite was 74.1 wt.% and 12.8 wt.%, respectively. In addition to the increased filler content, the h-BN of the composite was aligned in a parallel direction by hot pressing. The in-plane (k_x) and through-plane (k_z) thermal conductivity of the composite was measured as 4.99 ± 0.15 Wm^-1 K^-1 and 1.68 ± 0.2 Wm^-1 K^-1, respectively. These results indicated that the method used in this study is practical not only for increasing the filler loading but also for achieving a high k_x through the parallel alignment of h-BN fillers.

3D Printing of Nacre-Inspired Structures with Exceptional Mechanical and Flame-Retardant Properties

Flame-retardant and thermal management structures have attracted great attention due to the requirement of high-temperature exposure in industrial, aerospace, and thermal power fields, but the development of protective fire-retardant structures with complex shapes to fit arbitrary surfaces is still challenging. Herein, we reported a rotation-blade casting-assisted 3D printing process to fabricate nacre-inspired structures with exceptional mechanical and flame-retardant properties, and the related fundamental mechanisms are studied. 3-(Trimethoxysilyl)propyl methacrylate (TMSPMA) modified boron nitride nanoplatelets (BNs) were aligned by rotation-blade casting during the 3D printing process to build the "brick and mortar" architecture. The 3D printed structures are more lightweight, while having higher fracture toughness than the natural nacre, which is attributed to the crack deflection, aligned BN (a-BNs) bridging, and pull-outs reinforced structures by the covalent bonding between TMSPMA grafted a-BNs and polymer matrix. Thermal conductivity is enhanced by 25.5 times compared with pure polymer and 5.8 times of anisotropy due to the interconnection of a-BNs. 3D printed heat-exchange structures with vertically aligned BNs in complex shapes were demonstrated for efficient thermal control of high-power light-emitting diodes. 3D printed helmet and armor with a-BNs show exceptional mechanical and fire-retardant properties, demonstrating integrated mechanical and thermal protection.

Beyond homogeneous dispersion: oriented conductive fillers for high κ nanocomposites

Rational design of structures for regulating the thermal conductivities (κ) of materials is critical to many components and products employed in electrical, electronic, energy, construction, aerospace, and medical applications. As such, considerable efforts have been devoted to developing polymer composites with tailored conducting filler architectures and thermal conduits for highly improved κ. This paper is dedicated to overviewing recent advances in this area to offer perspectives for the next level of future development. The limitations of conventional particulate-filled composites and the issue of percolation are discussed. In view of different directions of heat dissipation in polymer composites for different end applications, various approaches for designing the micro- and macroscopic structures of thermally conductive networks in the polymer matrix are highlighted. Methodological approaches devised to significantly ameliorate thermal conduction are categorized with respect to the pathways of heat dissipation. Future prospects for the development of thermally conductive polymer composites with modulated thermal conduction pathways are highlighted.

Advances in Studies of Boron Nitride Nanosheets and Nanocomposites for Thermal Transport and Related Applications

Hexagonal boron nitride (h-BN) and exfoliated nanosheets (BNNs) not only resemble their carbon counterparts graphite and graphene nanosheets in structural configurations and many excellent materials characteristics, especially the ultra-high thermal conductivity, but also offer other unique properties such as being electrically insulating and extreme chemical stability and oxidation resistance even at elevated temperatures. In fact, BNNs as a special class of 2-D nanomaterials have been widely pursued for technological applications that are beyond the reach of their carbon counterparts. Highlighted in this article are significant recent advances in the development of more effective and efficient exfoliation techniques for high-quality BNNs, the understanding of their characteristic properties, and the use of BNNs in polymeric nanocomposites for thermally conductive yet electrically insulating materials and systems. Major challenges and opportunities for further advances in the relevant research field are also discussed.

Vertically Aligned and Interconnected Graphite and Graphene Oxide Networks Leading to Enhanced Thermal Conductivity of Polymer Composites

Natural graphite flakes possess high theoretical thermal conductivity and can notably enhance the thermal conductive property of polymeric composites. Currently, because of weak interaction between graphite flakes, it is hard to construct a three-dimensional graphite network to achieve efficient heat transfer channels. In this study, vertically aligned and interconnected graphite skeletons were prepared with graphene oxide serving as bridge and support via freeze-casting method. Three freezing temperatures were utilized, and the resulting graphite and graphene oxide network was filled in a polymeric matrix. Benefiting from the ultralow freezing temperature of -196 °C, the network and its composite occupied a more uniform and denser structure, which lead to enhanced thermal conductivity (2.15 W m-1 K-1) with high enhancement efficiency and prominent mechanical properties. It can be significantly attributed to the well oriented graphite and graphene oxide bridges between graphite flakes. This simple and effective strategy may bring opportunities to develop high-performance thermal interface materials with great potential.

Three-Dimensional Heterostructured Reduced Graphene Oxide-Hexagonal Boron Nitride-Stacking Material for Silicone Thermal Grease with Enhanced Thermally Conductive Properties

The thermally conductive properties of silicone thermal grease enhanced by hexagonal boron nitride (hBN) nanosheets as a filler are relevant to the field of lightweight polymer-based thermal interface materials. However, the enhancements are restricted by the amount of hBN nanosheets added, owing to a dramatic increase in the viscosity of silicone thermal grease. To this end, a rational structural design of the filler is needed to ensure the viable development of the composite material. Using reduced graphene oxide (RGO) as substrate, three-dimensional (3D) heterostructured reduced graphene oxide-hexagonal boron nitride (RGO-hBN)-stacking material was constructed by self-assembly of hBN nanosheets on the surface of RGO with the assistance of binder for silicone thermal grease. Compared with hBN nanosheets, 3D RGO-hBN more effectively improves the thermally conductive properties of silicone thermal grease, which is attributed to the introduction of graphene and its phonon-matching structural characteristics. RGO-hBN/silicone thermal grease with lower viscosity exhibits higher thermal conductivity, lower thermal resistance and better thermal management capability than those of hBN/silicone thermal grease at the same filler content. It is feasible to develop polymer-based thermal interface materials with good thermal transport performance for heat removal of modern electronics utilising graphene-supported hBN as the filler at low loading levels.

Polyarylene ether nitrile and boron nitride composites: coating with sulfonated polyarylene ether nitrile

Boron nitride (BN) coated with sulfonated poly-arylene ether nitrile (SPEN) (BN@SPEN) was used as additive to enhance the thermal conductivity of polyarylene ether nitrile. BN@SPEN was prepared by coating BN micro-platelets with SPEN through ultrasonic technology combined with the post-treatment bonding process. The prepared BN@SPEN was characterized by FTIR, TGA, SEM and TEM, which confirmed the successful coating of BN micro-platelets. The obtained BN@SPEN was introduced into the PEN matrix to prepare composite films by a solution casting method. The compatibility between BN and PEN matrix was studied by using SEM observation and rheology measurement. Furthermore, thermal conductivity of BN@SPEN/PEN films were carefully characterized. Thermal conductivity of BN@SPEN/PEN films was increased to 0.69 W/(m⋅K) at 20 wt% content of BN@SPEN, having 138% increment comparing with pure PEN.

Highly Thermally Conductive Polyimide Composites via Constructing 3D Networks

Easy and high efficient methods are in great demand to obtain polyimide (PI) composites with high thermal conductivity in the electronic packaging field. In this work, PI/boron nitride (BN) composites with high thermal conductivity are easily fabricated. Tightly connected and well-arranged BN platelets construct effective 3D thermally conductive networks in the PI matrix upon hot pressing, after BN platelets are coated on the surface of PI granules by the help of a kind of PI adhesive. The thermal conductivity of the PI/BN composites reaches as high as 4.47 W mK^-1 at a low BN loading of 20 vol%, showing an enhancement of 2099%, compared to pure PI. Such enhancement of the thermal conductivity is the highest compared with the results in the open literature. Our work is a good example that utilized the sufficient physical connection (aggregates) of thermally conductive fillers to significantly promote the thermal conductivity of polymer composites.

Investigation on cure kinetics of epoxy resin containing carbon nanotubes modified with hyper-branched polyester

The cure kinetics of epoxy resin cured by diethyltoluene diamine (D-EP), D-EP/multi-walled carbon nanotube (D-EP/CNT) composites and D-EP/hyper branched polyester functionalized CNTs (D-EP/CNTs-H20) were investigated by non-isothermal differential scanning calorimetry (DSC). Results revealed that the presence of CNTs shifted the cure temperature to a lower temperature and accelerated the curing of D-EP, and the addition of CNTs-H20 exhibited a stronger effect in accelerating the cure of D-EP. Activation energies were calculated based on the Kissinger approach and Ozawa approach respectively. Lowered activation energy was observed after the addition of CNTs or CNTs-H20 at low degrees of cure, indicating that the CNTs had a large effect on the curing reaction. The presence of CNTs facilitated the curing reaction, especially the initial epoxyamine reaction. Moreover, CNTs-H20 exhibited better performance. The autocatalytic model was used to describe the cure kinetics phenomena of the studied systems. When CNTs or CNTs-H20 were added, the Sesták–Berggren model still can describe the cure kinetics of the D-EP composites because the results, calculated by the model, agreed with the experimental data well. Moreover, the kinetics parameters as well as the equation describing the cure process were proposed.

The cure kinetics of epoxy resin cured by D-EP, D-EP/CNT composites and D-EP/CNTs-H20 were investigated by non-isothermal differential scanning calorimetry (DSC).