Thermal transport in amorphous small organic materials: a mechanistic study

Insight into the effect of side chains on thermal transport of organic semiconductors

Understanding the correlation mechanism of side chains on thermal transport of organic semiconductors is crucial for functionalized organic electronics. In this study, phenyl and alkyl side chains, two representatives of side chain engineering, are chosen to modify dinaphtho-[2,3-b:2',3'-f]thieno[3,2-b]thiophene (DNTT) to synthesize Ph-DNTT and C10-DNTT. The thermal conductivities of the three organic semiconductors exhibit obvious anisotropy, and the corresponding relationships are along-chain > inter-chain > cross-chain. The phenyl side chains enhance the thermal conductivity in the along-chain direction and degrade it in the inter-chain direction, while the alkyl side chains hinder thermal transport. In the cross-chain direction, side chains have a slight effect on thermal transport. The structure orientation consistency between the phenyl side chains and the main chains in Ph-DNTT leads to phonon coupling in the along-chain direction, which improves phonon transport. In the inter-chain direction, the combined effect of the phonon group velocity and phonon participation ratio causes the thermal conductivity degeneracy of Ph-DNTT. For C10-DNTT, the vibrational mismatch between the alkyl side chains and the main chains results in the degradation of thermal transport in the along-chain and inter-chain directions. In the cross-chain direction, the nonbonding interaction dominates the energy transfer in the three organic semiconductors, which induces inferior phonon transport properties and weak effects of side chains.

Enhancing the Thermo-Mechanical Property of Polymer by Weaving and Mixing High Length-Diameter Ratio Filler

Improving thermo-mechanical characteristics of polymers can efficiently promote their applications in heat exchangers and thermal management. However, a feasible way to enhance the thermo-mechanical property of bulk polymers at low filler content still remains to be explored. Here, we propose mixing high length-diameter ratio filler such as carbon nanotube (CNT), boron nitride (BN) nanotube, and copper (Cu) nanowire, in the woven polymer matrix to meet the purpose. Through molecular dynamics (MD) simulation, the thermal properties of three woven polymers including woven polyethylene (PE), woven poly (p-phenylene) (PPP), and woven polyacetylene (PA) are investigated. Besides, using woven PE as a polymer matrix, three polymer nanocomposites, namely PE-CNT, PE-BN, and PE-Cu, are constructed by mixing CNT, BN nanotube, and Cu nanowire respectively, whose thermo-mechanical characteristics are compared via MD simulation. Morphology and phonons spectra analysis are conducted to reveal the underlying mechanisms. Furthermore, impacts of electron-phonon coupling and electrical field on the thermal conductivity of PE-Cu are uncovered via two temperature model MD simulation. Classical theoretical models are modified to predict the effects of filler and matrix on the thermal conductivity of polymer nanocomposites. This work can provide useful guidelines for designing thermally conductive bulk polymers and polymer nanocomposites.