Plastic packaging-associated chemicals and their hazards - An overview of reviews

Plastic packaging contains residues from substances used during manufacturing, such as solvents, as well as non-intentionally added substances (NIAS), such as impurities, oligomers, or degradation products. By searching peer-reviewed literature, we found that at least 10,259 chemicals were related to plastic packaging materials, which include chemicals used during manufacturing and/or present in final packaging items. We then summarized and discussed their chemical structures, analytical instruments, migration characteristics, and hazard categories where possible. For plastic packaging chemicals, examination of the literature reveals gas and liquid chromatography hyphenated to a variety of accurate mass analyzers based on the use of high-resolution mass spectrometry is usually used for the identification of unknown migrants coming from plastic packaging. Chemical migration from food packaging is affected by several parameters, including the nature and complexity of the food, contact time, temperature of the system, type of packaging contact layer, and properties of the migrants. A review of the literature reveals that information on adverse effects is only available for approximately 1600 substances. Among them, it appears that additives are more toxic than monomers to wildlife and humans. Neurotoxicity accounted for the highest proportion of toxicity of all types of chemicals, while benzenoids, organic acids, and derivatives were the most toxic types of chemicals. Furthermore, studies have demonstrated that hydrocarbon derivatives, organic nitrogen compounds, and organometallic compounds have the highest proportions of dermatotoxicity, and organohalogen compounds have the highest proportions of hepatotoxicity. The main contributors to skin sensitization are organic salts. This study provides a basis for comprehensively publicizing information on chemicals in plastics, and could be helpful to better understand their potential risks to the environment and humans.

Thiourea modified low molecular polyamide as a novel room temperature curing agent for epoxy resin

A thiourea modified low molecular weight polyamide (TLMPA) as a room temperature curing agent was synthesized by a two-step method. Firstly, a low molecular weight polyamide curing agent (LMPA) with low viscosity and high amine value was synthesized by amidation of sebacic acid with tetraethylenepentamine, then the synthesized curing agent was modified with thiourea to increase its reactivity at room temperature. The optimal reaction conditions were studied by L9(33) orthogonal experiments. The structure of the prepared curing agent was analyzed by Fourier transform infrared spectroscopy (FT-IR). The kinetics of TLMPA curing of E-51 epoxy resin was analyzed using the Kissinger method with non-isothermal differential scanning calorimetry (DSC). The activation energy of TLMPA/E-51 calculated by the Kissinger method and FWO method was 38.79 kJ mol-1 and 42.73 kJ mol-1. The nano-SiO2 filler was compounded with E-51 epoxy resin, TLMPA, allyl glycidyl ether diluent, and KH-560 coupling agent to prepare the room temperature curing epoxy resin (EP) system. L9(34) orthogonal experiments were carried out to study the effect of various factors on the mechanical properties of the cured resin systems. The best formulation of the system is that the content of nano-SiO2, curing agent, diluent, and coupling agent is 3, 35, 15, 1 wt%, respectively. With the optimal formulation, the tensile and shear strength, tensile strength, impact strength, and bending strength of the cured EP system was 13.19 MPa, 53.8 MPa, 52.16 kJ m-2, and 94.95 MPa, respectively.